CN302454361S - Vacuum adsorption platform for wafer adsorption - Google Patents

Vacuum adsorption platform for wafer adsorption

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Publication number
CN302454361S
CN302454361S CN201330025768.0 CN302454361S CN 302454361 S CN302454361 S CN 302454361S CN 302454361 S CN302454361 S CN 302454361S
Authority
CN
China
Prior art keywords
wafer
adsorption
design
product
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201330025768.0
Other languages
Chinese (zh)
Inventor
崔华
Original Assignee
昆山允可精密工业技术有限公司
Filing date
Publication date
Application filed by 昆山允可精密工业技术有限公司 filed Critical 昆山允可精密工业技术有限公司
Application granted granted Critical
Publication of CN302454361S publication Critical patent/CN302454361S/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

1. 1. 本外观设计产品的名称:晶圆吸附用真空吸附平台。 The name of this design product: vacuum adsorption platform for wafer adsorption. 2. 2. 本外观设计产品的用途:本外观设计产品用于晶圆精密测量设备领域,具体涉及一种针对晶圆厚度、平面度测量过程中对晶圆进行吸附、固定、定位用的真空吸附平台。 Purpose of this design product: This design product is used in the field of wafer precision measurement equipment, and specifically relates to a vacuum adsorption platform for the adsorption, fixation and positioning of the wafer during the measurement of the thickness and flatness of the wafer. 3. 3. 本外观设计产品的设计要点:在于产品的结构和形状。 The main point of the design of this design product: lies in the structure and shape of the product. 4. 4. 最能表明本外观设计设计要点的图片或照片:立体图。 The picture or photo that best shows the main points of the design: a three-dimensional diagram.

CN201330025768.0 2013-01-28 Vacuum adsorption platform for wafer adsorption Expired - Fee Related CN302454361S (en)

Publications (1)

Publication Number Publication Date
CN302454361S true CN302454361S (en) 2013-06-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103389052A (en) * 2013-08-09 2013-11-13 昆山允可精密工业技术有限公司 Vertical shape measuring device capable of compensating shaft system errors of wafer
CN103389051A (en) * 2013-08-09 2013-11-13 昆山允可精密工业技术有限公司 Vertical-type wafer shape measuring instrument

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103389052A (en) * 2013-08-09 2013-11-13 昆山允可精密工业技术有限公司 Vertical shape measuring device capable of compensating shaft system errors of wafer
CN103389051A (en) * 2013-08-09 2013-11-13 昆山允可精密工业技术有限公司 Vertical-type wafer shape measuring instrument

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Legal Events

Date Code Title Description
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130605

Main classification number: 10-07

Termination date: 20140128