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1．本外观设计产品的名称：半导体制造装置用氧化防止气体供给器。2．本外观设计产品的用途：安装在通过引线连接半导体芯片的电极和基板电极之间的被称为引线焊接机的半导体制造装置的焊接头使用。3．本外观设计的设计要点：本外观设计产品的形状、图案或者其结合。4．最能表明设计要点的图片或者照片：立体图。1. The name of the product with this design: Oxidation prevention gas supplier for semiconductor manufacturing equipment. 2. Application of this design product: It is used as a bonding head of a semiconductor manufacturing apparatus called a wire bonding machine, which is installed between the electrodes of the semiconductor chip and the substrate electrodes connected by wires. 3. Design points of this design: the shape, pattern or combination of the product of this design. 4. The picture or photo that best shows the main points of the design: the stereogram.
CN201230476210.X2012-04-022012-10-08
Antioxidant gas supply for semiconductor manufacturing equipment
Expired - LifetimeCN302423843S
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