CN302010807S - CNC multi-line silicon wafer cutting machine - Google Patents
CNC multi-line silicon wafer cutting machineInfo
- Publication number
- CN302010807S CN302010807S CN201130354138.9 CN302010807S CN 302010807 S CN302010807 S CN 302010807S CN 302010807 S CN302010807 S CN 302010807S
- Authority
- CN
- China
- Prior art keywords
- cutting machine
- design
- silicon wafer
- wafer cutting
- line silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
1.外观设计产品的名称：数控多线硅片切割机床；2.该外观设计产品的用途：属于专用加工设备，是一种多线切割机床(线锯机)；3.该外观设计的设计要点：在于其形状；4.指定一幅最能表明设计要点的视图：主视图。 1. The name of the design product: CNC multi-line silicon wafer cutting machine; 2. The purpose of the design product: it is a special processing equipment, which is a multi-line cutting machine (wire saw machine); 3. The design of the design The main point: lies in its shape; 4. Specify a view that best shows the main points of the design: the main view.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN302010807S true CN302010807S (en) | 2012-07-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9862044B2 (en) | 2013-10-04 | 2018-01-09 | Jrv Holdings, Llc | Apparatus and method for machining internal portions of a valve body |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9862044B2 (en) | 2013-10-04 | 2018-01-09 | Jrv Holdings, Llc | Apparatus and method for machining internal portions of a valve body |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Main classification number: 15-09 Termination date: 20141008 |