CN301883011S - Electroplating flow forming plate with offset spiral hole pattern - Google Patents
Electroplating flow forming plate with offset spiral hole patternInfo
- Publication number
- CN301883011S CN301883011S CN201130081716.6 CN301883011S CN 301883011 S CN301883011 S CN 301883011S CN 301883011 S CN301883011 S CN 301883011S
- Authority
- CN
- China
- Prior art keywords
- design
- view
- electroplating
- hole pattern
- forming plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
1.本外观设计产品的名称为具有偏置螺旋孔图案的电镀流形成板。 1. The name of this design product is an electroplating flow forming plate with an offset spiral hole pattern. 2.本外观设计产品用于电镀操作，例如在处理半导体时电镀铜。 2. This design product is used for electroplating operations, such as electroplating copper when processing semiconductors. 3.本外观设计产品的设计要点在于：该具有偏置螺旋孔图案的电镀流形成板的整体形状。 3. The main points of the design of this design product are: the overall shape of the electroplating flow forming plate with the offset spiral hole pattern. 4.本外观设计指定设计1立体图1为公告视图。 4. This design designated design 1 three-dimensional view 1 is the announcement view. 5.本外观设计指定设计1为基本设计。 5. The design designation 1 is the basic design. 6.设计1-设计4的俯视图与分别与设计1-设计4的仰视图对称，省略设计1-设计4的俯视图；设计1-设计4的左视图与分别与设计1-设计4的仰视图顺时针旋转90度后相同，省略设计1-设计4的左视图；设计1-设计4的右视图分别与设计1-设计4的仰视图逆时针旋转90度后相同，省略设计1-设计4的右视图。 6. The top view of design 1-design 4 is symmetrical to the bottom view of design 1-design 4, the top view of design 1-design 4 is omitted; the left view of design 1-design 4 and the bottom view of design 1-design 4 respectively The same after rotating 90 degrees clockwise, the left view of design 1-design 4 is omitted; the right view of design 1-design 4 is the same as the bottom view of design 1-design 4 rotated 90 degrees counterclockwise, and design 1-design 4 is omitted Right view.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/377,521 | 2010-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN301883011S true CN301883011S (en) | 2012-04-11 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US10301739B2 (en) | 2013-05-01 | 2019-05-28 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10923340B2 (en) | 2015-05-14 | 2021-02-16 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Main classification number: 15-99 Termination date: 20150418 |