CN2932756Y - Test connector - Google Patents

Test connector Download PDF

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Publication number
CN2932756Y
CN2932756Y CNU2006200735827U CN200620073582U CN2932756Y CN 2932756 Y CN2932756 Y CN 2932756Y CN U2006200735827 U CNU2006200735827 U CN U2006200735827U CN 200620073582 U CN200620073582 U CN 200620073582U CN 2932756 Y CN2932756 Y CN 2932756Y
Authority
CN
China
Prior art keywords
insulating base
test connector
kickboard
cover plate
pressing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2006200735827U
Other languages
Chinese (zh)
Inventor
谢文逸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Priority to CNU2006200735827U priority Critical patent/CN2932756Y/en
Application granted granted Critical
Publication of CN2932756Y publication Critical patent/CN2932756Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a testing connector used to electrically connect a chip module with a circuit board, comprising an insulating base receipting a plurality of conductive terminals, a floating plate which is assembled at the insulating base and can transform between the conducting position and the disconnecting position relative to the insulating base, a springing device which is arranged between the insulating base and the floating plate and can actuate the floating plate to restore from the conducting position to the disconnecting position, a cover plate which can movably connected with the insulating base to lock the chip module to the insulating base, a press plate connected with the cover plate, and a fixed shaft having screw threads. The fixed shaft is arranged in a first screwed hole and a second screwed hole of the cover plate and the press plate to ensure that the press plate is stably connected with the cover plate, and the connection method is convenient to assemble and disassemble the press plate and reduces the fault rate of the testing connector.

Description

Test connector
[technical field]
The utility model relates to a kind of test connector, especially a kind of test connector that makes things convenient for wafer module Performance Detection.
[background technology]
In the circuit that is made of several actives and passive device, Electronic Packaging, such as wafer module are the miniaturized electric sub-elements, and in use safe and reliable in order to guarantee it, nearly all wafer module must be tested before installation.The wafer module is carried out long high temperature running, the wafer module that has defective was lost efficacy as early as possible, eliminate thereby defective wafer module screened, and the wafer module by test just can be used safely after being assembled to electronic terminal product, can not lose efficacy as early as possible.
Please join shown in Figure 1ly, existing test connector 1 ' generally comprises the insulating base 20 ' that is installed with plurality of conductive terminals 30 ', be mounted on that insulating base 20 ' is gone up and the kickboard 50 ' between conduction position and open position, changed of insulating base 20 ' relatively, place and to drive the elastic device 40 ' that kickboard 50 ' is replied to open position from the conducting position between insulating base 20 ' and the kickboard 50 ', be articulated in the lower cover 80 ' of insulating base 20 ' one end, be pivotally connected to the upper cover plate 90 ' of the relative end of lower cover 80 ' with pivot end, be connected in the pressing plate 60 ' on the lower cover 80 '.Wherein, lower cover 80 ' and pressing plate 60 ' are to realize being connected by the pivot 10 ' that the surface is provided with support slot 100, lower cover 80 ' and pressing plate 60 ' corresponding first accepting hole 800 ', second accepting hole 600 ' of accommodating pivot 10 ' that be provided with, place hole 800 ', 600 ' to connect lower cover 80 ' and pressing plate 60 ' on pivot 10 ', then the retaining sheet 801 ' of the semicircular in shape groove 802 ' by lower cover 80 ' surface is buckled in the support slot 100 ' on the pivot 10 ', thereby realizes pressing plate 60 ' and lower cover 80 ' stable being connected.
During use, the upper and lower cover plate 90 ', 80 ' that at first will be mounted on the test connector 1 ' on the printed circuit board (PCB) (not shown) places the enable possition, and wafer module (not shown) is placed on the kickboard 50 '; At this moment, the contact site of conducting terminal 30 (not indicating) does not expose kickboard 50 ' as yet, does not form between wafer module and the printed circuit board (PCB) to electrically conduct.Then, drive upper and lower cover plate 90 ', 80 ' and pressing plate 60 ' rotate and be pressed on down wafer module on the kickboard 50 ' with respect to insulating base 20 ', make kickboard 50 ' and place the wafer module on the kickboard 50 ' together to sink; At this moment, the upper surface butt of wafer module pressing plate 60 ', and the contact site of conducting terminal 30 ' begins to pass corresponding conducting element (not shown) butt joint on kickboard 50 ' and the wafer module.At last, the wafer module is locked on the insulating base 20 ' by upper cover plate 90 ', thus the electric connection between realization wafer module and the printed circuit board (PCB).
The general test connector is in order to test wafers having different sizes module, so need to change different pressing plates with the stable wafer module of pushing, yet, existing pressing plate is by realizing in the support slot that retaining sheet is buckled in the pivot that connects pressing plate and lower cover and being connected of lower cover, this structure is very complicated, be difficult for the installation and removal pressing plate, and may damage test connector.
In view of above-mentioned drawback, be necessary to provide a kind of improved test connector in fact, to overcome the defective of above-mentioned test connector.
[utility model content]
The technical problems to be solved in the utility model provides a kind of test connector that makes things convenient for the installation and removal pressing plate.
For this reason, it is a kind of in order to electrically connect the test connector of wafer module and printed circuit board (PCB) that the utility model provides, it comprises the insulating base that is installed with plurality of conductive terminals, be mounted on the insulating base and relatively insulating base in the kickboard of changing between conduction position and the open position, place the elastic device that can drive kickboard between insulating base and the kickboard and reply to open position from the conducting position, movably be connected on the insulating base with locking wafer module in the cover plate on the insulating base, be connected in the pressing plate on the cover plate, and the fixed axis that is provided with screw thread.
With respect to prior art, the utility model test connector has the following advantages at least: by fixed axis being placed the screwed hole of cover plate and pressing plate, thereby with the stable cover plate that is connected in of pressing plate, this kind connected mode is easy to installation and removal simultaneously, has reduced the probability that test connector damages.
[description of drawings]
Fig. 1 is a kind of perspective exploded view of existing test connector.
Fig. 2 is the perspective exploded view of the utility model test connector.
Fig. 3 is the enlarged drawing of connecting axle in the test connector shown in Figure 2.
Fig. 4 is the assembly drawing of test connector shown in Figure 2.
[embodiment]
Please join Fig. 2 to shown in Figure 4, the utility model test connector 1 is in order to electrically connect wafer module (not shown) to printed circuit board (PCB) (not shown), it comprises the insulating base 20 that is installed with plurality of conductive terminals 30, be mounted on the insulating base 20 and the kickboard 50 between conduction position and open position, changed of insulating base 20 relatively, place and to drive the elastic device 40 that kickboard 50 is replied to open position from the conducting position between insulating base 20 and the kickboard 50, movably be connected on the insulating base 20 with the cover plate 70 of locking wafer module on insulating base 20, be connected in the pressing plate 60 on the cover plate 70, and the surface is provided with the fixed axis 10 of screw thread.
As shown in Figure 2, the roughly rectangular structure of insulating base 20, it comprises diapire 200, the pivot joint wall 202 that prolongs and locking wall 204 on diapire 200 two opposite sides, and connects a pair of connecting wall 206 that articulates wall 202 and locking wall 204.Diapire 200, pivot joint wall 202, locking wall 204 and a pair of connecting wall 206 one common peripheral are set as an accommodation space 208, with ccontaining elastic device 40 and kickboard 50.The diapire 200 that runs through insulating base 20 is provided with some terminal grooves 210 that are arranged, and conducting terminal 30 correspondences are contained in the terminal groove 210.The diapire 200 that conducting terminal 30 1 ends extend insulating base 20 downwards with printed circuit board (PCB) on corresponding conducting element (not shown) electrically connect, the other end extends upwardly to accommodation space 208 and forms contact site (indicating) in the top, with the wafer module on corresponding conducting element (not shown) butt joint.20 4 jiaos of places of insulating base are provided with groove 207 to accommodate kickboard 50.
Kickboard 50 is the lamellar structure that can place the accommodation space 208 of insulating base 20, it comprises diapire 500 and the some sidewalls 502 that extend in the same way from diapire 500, diapire 500 and sidewall 502 one common peripheral are set as a bearing space 504, with the bearing wafer module in wherein.Kickboard 50 bottoms are respectively equipped with some snap close hooks 508 for four jiaos, snap close hook 508 can be snapped in the groove 207 of relative set on the insulating base 20, thereby both kickboard 50 movable group can be connected on the insulating base 20, can prevent again that kickboard 50 from coming off from the pedestal 20 that insulate under the elastic force effect of spring 40.
Be provided with elastic device 40 between the diapire 200 of kickboard 50 and insulating base 20,, can drive kickboard 50 and automatically reply to open position from the conducting position as spring etc.
Cover plate 70 comprises lower cover 80 and the upper cover plate 90 that is coated on the lower cover 80, lower cover 80 is hollow frame structures of being made by insulating material, it comprises that rotor is connected in the pivot joint limit 802 and the installation limit 806 relative with articulating limit 802 on the insulating base 20, connect the fillet 807 that articulates limit 802 and limit 806 is installed, the central opening 805 that is surrounded by pivot joint limit 802, installation limit 806 and fillet 807 is concaved with supporting part 800 all around relatively, with carrying radiator (not shown) thereon, fillet 807 is provided with first screwed hole 8070 to accommodate fixed axis 10.Upper cover plate 90 is to be made by metal sheet, can be coated on the outside of lower cover 80, and it comprises the locking end 906 that pivot end 902 and pivot end 902 are relative, and connects a pair of by flanging 904 of pivot end 902 and locking end 906.
Pressing plate 60 roughly is hollow sheeting columnar structure, and it can be connected on the lower cover 80 separably by fixed axis 10, and it comprises and is provided with second screwed hole 600 accommodating a pair of fixation wall 601 of fixed axis 10, and a pair of connecting wall 602 that is connected and fixed wall 601.In actual use, can select profile, pressing plate 60 that size is suitable according to the profile of wafer module and size.
As shown in Figure 3, fixed axis 10 roughly is a cylinder, and it comprises threaded portion 101, the rotating part 102 that is installed on lower cover 80 and pressing plate 60, and the connecting portion 103 of connecting thread portion 101 and rotating part 102.Wherein rotating part 102 is a crosswise, and it also can be set to other shapes such as interior hexagonal, a word according to actual needs.Fixed axis 10 is passed first, second screwed hole 8070,600 on pressing plate 60 and the lower cover 80, thereby pressing plate 60 closely can be connected with lower cover 80.
As shown in Figure 4, during assembling, at first kickboard 50 is placed the accommodation space 208 of the insulating base 20 that contains conducting terminal 30, spring 40 places between kickboard 50 and the insulating base 20, and the snap close hook 508 that kickboard 50 lower ends are provided with is held on insulating base 20 sidewalls; Next, thus first, second screwed hole 8070,600 that fixed axis 10 passes in pressing plate 60 and the lower cover 80 is connected to pressing plate 60 on the lower cover 80; Then, lower cover 80 is pivotally connected to the locking wall 204 of insulating base 20; At last upper cover plate 90 is connected in the installation limit 806 of lower cover 80, and upper cover plate 90 can rotate with respect to lower cover 80 between enable possition and make position.
During use, the upper and lower cover plate 90,80 that at first group is located at the test connector 1 on the printed circuit board (PCB) places the enable possition, and the wafer module is placed on the kickboard 50, and at this moment, the contact site of conducting terminal 30 does not expose kickboard 50 as yet.Then, drive upper and lower cover plate 90,80 and pressing plate 60 relative to the wafer module butt that insulating base 20 rotates and is pressed on the kickboard 50 down with pressing plate 60, conducting terminal 30 passes pressing plate 50 and docks with corresponding conducting element on the wafer module, at last, by upper cover plate 90 the wafer module is locked on the insulating base 20, thus the electric connection of realization wafer module and printed circuit board (PCB).
Should be understood that; described above only is some execution modes of the utility model test connector; for the person of ordinary skill of the art, other improvement made under the prerequisite that does not break away from the utility model principle and distortion also should be considered as protection range of the present utility model.

Claims (6)

1. test connector, in order to electrically connect the wafer module to printed circuit board (PCB), it comprises: the insulating base that is installed with plurality of conductive terminals, be mounted on the insulating base and the kickboard between conduction position and open position, changed of insulating base relatively, place and to drive the elastic device that kickboard is replied to open position from the conducting position between insulating base and the kickboard, movably be connected on the insulating base with the cover plate of locking wafer module on insulating base, and be connected in pressing plate on the cover plate, it is characterized in that: described test connector comprises that also the surface is provided with the fixed axis of screw thread, corresponding first screwed hole and second screwed hole of accommodating fixed axis that be provided with of cover plate and pressing plate.
2. test connector according to claim 1 is characterized in that: described fixed axis is provided with rotating part, and above-mentioned rotating part is interior hexagonal, a word, cross or other shape.
3. test connector according to claim 1 is characterized in that: the shape and size of the shape and size of described pressing plate and wafer module are suitable.
4. test connector according to claim 1 is characterized in that: the lower end of described kickboard is provided with some snap close hooks, and corresponding being provided with of described insulating base detained the groove of holding the snap close hook.
5. according to any described test connector in the claim 1 to 4, it is characterized in that: described lid comprises lower cover that is articulated in insulating base one end and the upper cover plate that is pivotally connected to the relative end with pivot end of lower cover.
6. test connector according to claim 5 is characterized in that: described lower cover is separable the connection with pressing plate.
CNU2006200735827U 2006-05-31 2006-05-31 Test connector Expired - Fee Related CN2932756Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2006200735827U CN2932756Y (en) 2006-05-31 2006-05-31 Test connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2006200735827U CN2932756Y (en) 2006-05-31 2006-05-31 Test connector

Publications (1)

Publication Number Publication Date
CN2932756Y true CN2932756Y (en) 2007-08-08

Family

ID=38349247

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2006200735827U Expired - Fee Related CN2932756Y (en) 2006-05-31 2006-05-31 Test connector

Country Status (1)

Country Link
CN (1) CN2932756Y (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101551405B (en) * 2008-04-02 2011-08-24 东捷科技股份有限公司 Adjustable frame body
CN103490208A (en) * 2012-06-28 2014-01-01 富士康(昆山)电脑接插件有限公司 Electrical connector
CN103543343A (en) * 2012-07-10 2014-01-29 鸿富锦精密工业(深圳)有限公司 Lens module testing device
US8979565B2 (en) 2012-06-25 2015-03-17 Hon Hai Precision Industry Co., Ltd. Electrical connector having a holding member and a load plate pivotally assembled to two ends of a stiffener
CN107196163A (en) * 2017-01-23 2017-09-22 番禺得意精密电子工业有限公司 Electric connector
CN108885227A (en) * 2016-03-30 2018-11-23 李诺工业股份有限公司 Test bench unit
CN113588991A (en) * 2021-07-26 2021-11-02 深圳市欧米加智能科技有限公司 Butt-joint positioning test device for small connector

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101551405B (en) * 2008-04-02 2011-08-24 东捷科技股份有限公司 Adjustable frame body
US8979565B2 (en) 2012-06-25 2015-03-17 Hon Hai Precision Industry Co., Ltd. Electrical connector having a holding member and a load plate pivotally assembled to two ends of a stiffener
CN103490208A (en) * 2012-06-28 2014-01-01 富士康(昆山)电脑接插件有限公司 Electrical connector
CN103490208B (en) * 2012-06-28 2017-04-05 富士康(昆山)电脑接插件有限公司 Electric connector
CN103543343A (en) * 2012-07-10 2014-01-29 鸿富锦精密工业(深圳)有限公司 Lens module testing device
CN103543343B (en) * 2012-07-10 2018-01-23 泰州市光明电子材料有限公司 Camera lens module test device
CN108885227A (en) * 2016-03-30 2018-11-23 李诺工业股份有限公司 Test bench unit
US10884024B2 (en) 2016-03-30 2021-01-05 Leeno Industrial Inc. Test socket unit
CN107196163A (en) * 2017-01-23 2017-09-22 番禺得意精密电子工业有限公司 Electric connector
CN107196163B (en) * 2017-01-23 2019-06-18 番禺得意精密电子工业有限公司 Electric connector
CN113588991A (en) * 2021-07-26 2021-11-02 深圳市欧米加智能科技有限公司 Butt-joint positioning test device for small connector
CN113588991B (en) * 2021-07-26 2022-06-28 深圳市欧米加智能科技有限公司 Make-up positioning test device of small connector

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070808

Termination date: 20120531