CN2915731Y - Combined buffer packing structure - Google Patents
Combined buffer packing structure Download PDFInfo
- Publication number
- CN2915731Y CN2915731Y CN 200520115457 CN200520115457U CN2915731Y CN 2915731 Y CN2915731 Y CN 2915731Y CN 200520115457 CN200520115457 CN 200520115457 CN 200520115457 U CN200520115457 U CN 200520115457U CN 2915731 Y CN2915731 Y CN 2915731Y
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- CN
- China
- Prior art keywords
- layer
- packing structure
- buffer packing
- skin
- compound type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a combined buffer packing structure which includes an inner layer and an outer layer, the inner layer being a PVC foam layer which matches the appearance of the appliance and the outer layer being a corrugated paper layer, the inner layer and the outer layer forming a detachable plug connected combination. In the combined buffer packing structure, a corrugated paper layer is arranged out of the PVC foam layer, thus consumption of foam PVC and the cost can be effectively reduced without changing the size of the buffer packing structure; what's more, corrugated cardboard has better buffer performance than foam PVC, by which the buffer performance of the buffer packing structure can be also improved.
Description
Technical field
The utility model relates to a kind of Shockproof packaging structure of product, more particularly, relates to a kind of packing chest in-to-in compound type buffer packing structure that places.
Background technology
The extranal packing box that is used to transport, pack various electrical equipment at present mostly adopts is convenient to transportation and lower-cost corrugated case, and be further cost-cutting again under the prerequisite that guarantees the security appliance transportation, the general buffer packing structure that is provided with the manufacturing of structure electrical equipment profile in corrugated case inside.One of buffer packing structure commonly used at present is by polyethylene foamed sheet material stamping-out molding bonded, and the low density material with cost height, general employing is difficult to guarantee cushion when heavy electrical equipment falls the shortcoming that requires again.
For this reason, the creator in the utility model relies on it to be engaged in the experience and the practice of relevant industries for many years, and through concentrating on studies and effort, creates a kind of effectively cost-cutting finally and the compound type buffer packing structure of enough cushion characteristics can be provided.
Summary of the invention
The purpose of this utility model is to provide a kind of compound type buffer packing structure, utilizes this compound type buffer packing structure can cost-cutting, and can provide enough buffering requirements for electrical equipment.
Compound type buffer packing structure in the utility model comprises internal layer with outer, and wherein internal layer is the polyethylene foamed layer supporting with the electrical equipment profile, and skin is a corrugated layer, is detachable grafting combination between internal layer and the skin.
Make up by projection and groove grafting between described internal layer and the skin.
Described skin is put together by the polylith corrugated board, is connected by the fore shaft that is mutually locked between adjacent two corrugated cardboard.
Compound type buffer packing structure in the utility model is by being provided with the corrugated board layer outside the polyethylene foamed layer, thereby can effectively reduce the consumption of polyethylene foamed, cost-cutting under the prerequisite that does not change the buffer packing structure size.Polyethylene foamed cushion characteristic under little load is good, abraded product surface not, and corrugated board has than the better cushion characteristic of low-density foamed polyethylene under big load, unitized construction can be given full play to advantage separately.
Description of drawings
Fig. 1 is the cross-sectional schematic of compound type buffer packing structure in the utility model;
Fig. 2 is the cross-sectional schematic before polyethylene foamed shown in Fig. 1 engages with corrugated board;
Fig. 3 is the side closing component structure scheme drawing of corrugated board in the utility model.
The specific embodiment
Below in conjunction with accompanying drawing specific embodiment of the utility model is described in further detail.
As depicted in figs. 1 and 2, the compound type buffer packing structure in the utility model is the buffering package that is used for various electrical equipment (as flat panel TV 3), and is impaired so that prevent electrical equipment to be subjected to violent vibrations.The concrete shape of this compound type buffer packing structure changes with the electrical equipment profile, it includes the internal layer 1 by polyethylene foamed sheet material stamping-out molding bonded, with skin 2 by the sealed moulding of corrugated board cross cutting, wherein the outside face at the polyethylene foamed layer is provided with one or more grooves 10, consistent with these groove 10 shapes, quantity, size, on corrugated board, be provided with projection 20, utilize the chimeric of projection 20 and groove 10, make polyethylene foamed layer 1 and 2 firm the combining of fluting board flaggy, form a kind of compound type buffer packing structure.
Zong the above, the Combined cushion packaging structure of the utility model Zhong has the low and better resiliency of cost The You point of energy.
Claims (3)
1. compound type buffer packing structure is characterized in that: comprise internal layer with outer, wherein internal layer be the polyethylene foamed layer supporting with the electrical equipment profile, and skin is a corrugated layer, is that detachable grafting is made up between internal layer and the skin.
2. according to the compound type buffering package described in the claim 1, it is characterized in that: make up by projection and groove grafting between described internal layer and the skin.
3. according to the compound type buffering package described in the claim 1, it is characterized in that: described skin is put together by the polylith corrugated board, is connected by the fore shaft that is mutually locked between adjacent two corrugated cardboard.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520115457 CN2915731Y (en) | 2005-07-21 | 2005-07-21 | Combined buffer packing structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520115457 CN2915731Y (en) | 2005-07-21 | 2005-07-21 | Combined buffer packing structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2915731Y true CN2915731Y (en) | 2007-06-27 |
Family
ID=38186638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520115457 Expired - Fee Related CN2915731Y (en) | 2005-07-21 | 2005-07-21 | Combined buffer packing structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2915731Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113120428A (en) * | 2021-04-30 | 2021-07-16 | 合肥海景包装制品有限公司 | Buffering EPS packing plant in circular cabinet of air conditioner |
-
2005
- 2005-07-21 CN CN 200520115457 patent/CN2915731Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113120428A (en) * | 2021-04-30 | 2021-07-16 | 合肥海景包装制品有限公司 | Buffering EPS packing plant in circular cabinet of air conditioner |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070627 |