CN2899392Y - Telecommunicating equipment cabinet - Google Patents
Telecommunicating equipment cabinet Download PDFInfo
- Publication number
- CN2899392Y CN2899392Y CN 200620013563 CN200620013563U CN2899392Y CN 2899392 Y CN2899392 Y CN 2899392Y CN 200620013563 CN200620013563 CN 200620013563 CN 200620013563 U CN200620013563 U CN 200620013563U CN 2899392 Y CN2899392 Y CN 2899392Y
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- tec device
- air
- communication cabinet
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- tec
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Abstract
The utility model relates to a telecommunicating equipment cabinet, comprising a cabinet body (7), at least two supports (6) arranged in the cabinet body. An air inlet is provided on the support. The telecommunicating equipment cabinet also comprises a radiating device with a TEC device (1); the cold end of the TEC device (1) is positioned at the air-inlet side of the support. By adding a TEC device (1) at the air-inlet side of the upper support of two adjacent supports in the cabinet body, the utility model solves the problem that the radiating of the upper support is difficult because the lower supports heats the upper supports one by one. The utility model is of enhanced radiating capability, small application and installation influence caused by a change to communication devices, low cost.
Description
Technical field
The utility model relates to a kind of communication cabinet, more particularly, relates to a kind of communication cabinet that has heat abstractor.
Background technology
For performance, the saving user machine room space of improving communication products, the integrated level of equipment and power density are improving year by year.The communication network product is normally used to be the rack of etsi standard, degree of depth 300mm, height 2.2m.The etsi standard rack generally can be established 4 sub-framves from top to bottom, and total power consumption is about 3000～5000W.Rack generally is two in user's machine room is close to back-to-back or places by wall, and sub-frame is by front portion, bottom and the top portion ventilation heat radiation of rack in the rack.Because the heat of face frame can produce the influence of heating cascade step by step to last face frame down, make the heat radiation of the sub-frame in top very difficult.
As shown in Figure 1, be the air channel structure schematic diagram of the direct ventilation of the sub-frame up/down perforation in existing a kind of rack.In this kind rack, be provided with the cabinet door in the front of rack body 7, the cabinet door is provided with the perforate of certain density, in order to air intake; The top is provided with perforate, in order to air-out.And in rack body 7, be provided with a plurality of sub-framves 6 that stack up and down.This a little 6 generally fixing (for example connecting with bolt) is in rack body 7 on the set column (not drawing among the figure).Leave the space between each sub-frame 6 outer wall and rack body 7 inwalls and be used to place data wire, optical fiber or cable, and ventilate; Also leave the space between the neighbouring sub-frame 6., be used for inhaling on the wind direction with the bottom or/and the bottom is provided with the fan (not shown) of some on the top of each height frame 6, in sub-frame 6, form upwards distinguished and admirable, so at the lower end of each frame 6 formation air inlet, and form the air port in the top.The air that passes through in sub-frame 6 can carry out heat exchange with the device in this sub-frame, thereby is sub-frame heat radiation, and hot blast flows out from the air outlet of sub-frame 6, finally discharges the rack outside from the top of rack and the top of cabinet door.
But the weak point of this rack is: when many and power consumption is big when sub-frame in the rack, the net quantity of heat of following face frame will enter top sub-frame along with air, so make the lower device of face frame mesochite temperature can't satisfy the heat radiation requirement, have the hidden danger of damaging those devices owing to temperature is too high.
As shown in Figure 2, be the air channel structure schematic diagram of air-out after each sub-frame independence advance side in existing a kind of rack.Air-out is meant the perforate air intake on the cabinet door of rack front after the so-called advance side, and the side and the back of sub-frame forms the air-out air channel in the rack, and finally in the structure of enclosure top air-out.In this structure, and among Fig. 1 in the structure of rack maximum difference be: have additional dividing plate 8 between per two neighbouring sub-framves, this dividing plate 8 also is being fixed on the column of rack; It isolates Lower subrack air-out air and Upper subrack air intake air, and the air-out air of Lower subrack is discharged from the back or the side of Upper subrack, avoids the air-out air of the high temperature of Lower subrack directly to enter the air inlet of Upper subrack.
But this rack also has weak point: because the rack both sides are provided with column and lot of data line, optical fiber or cable etc., most of airspace between sub-frame in both sides and the rack inner body wall has accounted for, make duct resistance very big, in rack inside, along with the increase of height, the throughput of both sides and back space increases, it is big that resistance also becomes, in making, the sub-frame air-out of bottom difficulty more, cause deficiency in draught in each sub-frame, make radiating effect bad.
In addition, IBM Corporation has released a kind of water-cooled server recently, and it is the heat exchanger that the water-cooled circulation is installed in sub-frame.Air in the cold junction antithetical phrase frame of heat exchanger circulation cools off, and the secondary cooling is carried out in the circulation hot junction cooling pipe of the cooling system (as central air-conditioning) by machine room again.According to data explanation, the heat that this heat exchanger can takeaway service device 55%.The deficiency that this heat dissipating method exists is, it is bigger that the heat exchanger of water-cooled circulation takies the space of rack, need to adopt the cooling system of machine room to carry out the secondary cooling, and the change to original rack is bigger in actual applications, and limitation is more.
The utility model content
Technical problem to be solved in the utility model is, provides a kind of heat-sinking capability strong communication cabinet.
For solving its technical problem, the technical scheme that this practicality is adopted is: a kind of communication cabinet is provided, comprise the rack body, be installed in intrinsic at least two the sub-framves of rack, son sets up and is equipped with air inlet, described communication cabinet also includes the heat abstractor that comprises the TEC device, and the cold junction of described TEC device is positioned at a side of the air inlet of sub-frame.
In communication cabinet of the present utility model, described sub-frame is served as reasons and is gone up to being provided with down, described heat abstractor comprises two TEC devices, described two TEC devices are obliquely installed to rack body both sides, the cold junction of described each TEC device is towards the air inlet of Upper subrack, and its hot junction is towards the air outlet of Lower subrack.
In communication cabinet of the present utility model, described each TEC device and horizontal angle are in 30 and spend between 90 degree.
In communication cabinet of the present utility model, described heat abstractor comprises that also at least one connects this heat pipe between the cold junction of two TEC device for cooling.
In communication cabinet of the present utility model, described heat pipe outer surface is provided with fin.
In communication cabinet of the present utility model, the described fin on institute's heat pipe is the vertical spacing setting.
In communication cabinet of the present utility model, described heat abstractor comprises a TEC device, described TEC device is arranged between the opposite side of adjacent two sub-framves, it separates the air inlet air of Upper subrack and the air outlet air of Lower subrack, its cold junction is towards the air inlet of Upper subrack, and its hot junction is towards the air outlet of Lower subrack.
In communication cabinet of the present utility model, the cold junction or the hot end surface of described TEC device are provided with fin, and described fin is parallel and the compartment of terrain is provided with, and the gap between the described adjacent fins forms airflow channel.
In communication cabinet of the present utility model, in the TEC device, described fin is welded on the surface in the cold junction of described TEC device or hot junction, and is perhaps one-body molded with the cold junction or the hot junction of described TEC device.
In communication cabinet of the present utility model, described TEC device fixedly is located on the intrinsic column of rack.
Implement communication cabinet of the present invention, have following beneficial effect: the utility model is being provided with the heat abstractor that contains the TEC device between the Lower subrack on the communication cabinet, and hot junction and cold junction at the TEC device are equipped with fin, and fin is the direction design along air-flow, increases area of dissipation.Can be basically on the basis of invariable at each sub-frame intake of existing scheme, adopt the TEC device that the distinguished and admirable of Upper subrack freezed, utilize the air-out air of Lower subrack to take away the heat in TEC hot junction, the heat radiation in the enhancer frame has avoided Lower subrack that Upper subrack added thermal impact step by step.And the TEC device volume is little, and working method is simple, and the actual installation of communication equipment is used almost not influence.
Description of drawings
Fig. 1 is the air channel structure schematic diagram of the direct ventilation of the sub-frame up/down perforation in existing a kind of rack;
Fig. 2 is the air channel structure schematic diagram of air-out after each sub-frame independence advance side in existing a kind of rack;
Fig. 3 is the first example structure schematic diagram of communication cabinet of the present invention;
Fig. 4 is the structural representation of the heat abstractor among first embodiment of communication cabinet of the present invention;
Fig. 5 is the second example structure schematic diagram of communication cabinet of the present invention;
Fig. 6 is the structural representation of the heat abstractor among second embodiment of communication cabinet of the present invention;
Fig. 7 is the structural representation of TEC device in the communication cabinet of the present invention.
Embodiment
The invention provides a kind of between the sub-frame of rack, the setting and adopt thermoelectric cooling (ThermoelectricCooling, TEC,) the device structure of dispelling the heat, can be in guaranteeing existing rack air quantity basically on the basis of invariable between each sub-frame, adopt the TEC device to reduce the temperature of each sub-frame air inlet place air, avoid the add thermal impact of Lower subrack, thereby reach the radiating effect in the enhancer frame Upper subrack.Thermoelectric cooling (TEC) is to utilize after the semiconductor energising heat to be moved to the effect of the other end from an end, utilizes an end of low temperature to produce refrigeration, and wherein the end that temperature is low is called as cold junction, and the end that temperature is high is called as the hot junction.It is little that the TEC device has a volume, the simple advantage of working method.Below in conjunction with accompanying drawing the utility model is further described, in the accompanying drawing:
As shown in Figures 3 and 4, be the structural representation of first embodiment of the invention, it is applied in the rack of direct ventilation of sub-frame up/down perforation.This kind rack mainly includes rack body 7, is arranged on a plurality of sub-frame 6 in the rack body 7 from top to bottom, the position is provided with the heat abstractor that includes the TEC device between neighbouring sub-frame 6, this heat abstractor comprise two TEC devices 1, connect at least one heat pipe 2 of these two TEC devices 1 and be located at TEC device 1 and heat pipe 2 on multi-disc fin 3.
Two TEC devices 1 dispel the heat about adopting in the heat abstractor in the utility model, wherein, two TEC devices 1 can vertically be arranged between two sub-framves 6 abreast, this moment each TEC device 1 cold junction 4 inwards, its hot junction 5 is the side towards rack body 7 inwalls.And in actual applications, in order to increase radiating effect, generally this two TEC device 1 is obliquely installed to rack body both sides.Equally, in each TEC device 1, be hot junction 5 towards a side of Lower subrack air outlet, be cold junction 4 towards a side of Upper subrack air inlet.This two TEC device 1 generally is fixed on the column of this rack.The angle (with horizontal angle) that this moment, each TEC device 1 tilted is also not too small, ventilates up and down in order to avoid influence 6 on sub-frame, and this angle can be spent between 90 degree 30, and in practice, this angle is good about spending with 60.
Adopt at least one heat pipe 2 to connect the cold junction 4 (only showing among the figure) of two TEC devices 1, this heat pipe 2 can be welded on the surface of cold junction 4, also can be located in the inside of cold junction 4.Described heat pipe 2 surfaces are provided with metal fin 3, and also are provided with fin 3 at the cold junction 4 of each TEC device 1 and the surface in hot junction 5.Described fin 3 is a kind of heat dissipation metal thin slice.It can be welded on the surface in the cold junction 4 of heat pipe, TEC device 1 and hot junction 5, and in another embodiment of the present invention, this fin 3 also can be one-body molded with the cold junction 4 or the hot junction 5 of TEC device.Fin 3 herein mainly be the contact area that is used to increase the cold junction 4 of heat pipe 2, TEC device 1 or hot junction 5 and air.Herein, the cold junction of TEC device 1 or the fin on the hot junction should be parallel and the compartment of terrain (can referring to shown in Figure 7) be set, the gap between the fin 3 forms airflow channel, distinguished and admirable can passing through from the gap between the fin 3.And, also should leave certain interval between each fin 3 on the heat pipe 2 for avoiding increasing systemic resistance.
As can be seen from the figure, for Upper subrack, owing to be provided with the TEC device between itself and Lower subrack, the cold junction of TEC device (and fin) is to the air inlet air cooling of Upper subrack, and its heat is to the migration of the hot junction of TEC device; Simultaneously, the air outlet air that utilizes Lower subrack is taken away the heat on the TEC device hot junction (and fin) from the gap between Upper subrack and the rack; Simultaneously, owing to be connected with heat pipe on the TEC device, this heat pipe (and fin) contacts with the air inlet air of Upper subrack, the airborne heat of air inlet is passed to the cold junction of TEC device.Under the effect of heat pipe, TEC device cold junction, can the air inlet air of Upper subrack be cooled off, but the radiating effect of final enhancer frame inside.
As shown in Figure 5 and Figure 6, be the structural representation of second embodiment of the invention, it is applied in the rack of air-out after each sub-frame independence advance side.This kind rack mainly comprises rack body 7, is arranged on a plurality of sub-frame 6 in the rack body 7 from top to bottom.Between neighbouring two sub-framves 6, be provided with the heat abstractor that includes TEC device 1, this heat abstractor includes a TEC device 1, this TEC device 1 is provided with and is obliquely installed between the opposite side of adjacent two sub-framves, the two ends of TEC device 1 are connected to the opposite end of Lower subrack respectively, separate the air inlet air of Upper subrack and the air outlet air of Lower subrack.This TEC device 1 is fixed on the column in the rack body 7.This TEC device is hot junction 5 near a side of Lower subrack air outlet, and a side of close Upper subrack air inlet is a cold junction 4.All be provided with fin 3 at the cold junction 4 of TEC device 1 and the surface in hot junction 5, the cold junction of this TEC device 1 or the fin on the hot junction 3 should be along wind direction parallel and compartment of terrain (can referring to shown in Figure 7) be set, gap between the adjacent fins 3 forms airflow channel, distinguished and admirable can passing through from the gap between the fin 3.
In like manner, in this embodiment, the cold junction of TEC device (and fin) is to the air inlet air cooling of Upper subrack, and its heat is to the migration of the hot junction of TEC device; Simultaneously, utilize the air outlet air of Lower subrack to take away heat on the TEC device hot junction (and fin).Thereby reach the effect that the air inlet air to Upper subrack cools off, but the radiating effect in the final enhancer frame.
The utility model shows the device that the rack that stacks sub-frame is up and down dispelled the heat.But under the situation that does not break away from claim scope of the present invention, can carry out various changes and be equal to alternative the present invention, for example, every cold junction with heat abstractor (TEC device) is arranged on air inlet one side of sub-frame, all can reach the purpose of the sub-frame air intake air of cooling, and be not limited to be applied in this rack structure that stacks sub-frame up and down, it can also be applied in the rack structure of the sub-frame of parallel placement.
This shows the heat abstractor that adopts in the utility model, can the air intake air of Upper subrack be cooled off, can effectively reduce the heat radiation influence between a plurality of sub-framves.Can satisfy the development trend of the how sub-frame of communication products, high power consumption, improve the reliability of equipment; And this heat abstractor cost is low, to the practical application almost not influence of existing rack corrective measure to communication equipment.
Claims (10)
1, a kind of communication cabinet, comprise rack body (7), be installed at least two the sub-framves (6) in the rack body (7), son sets up and is equipped with air inlet, it is characterized in that, described communication cabinet also includes the heat abstractor that comprises TEC device (1), and the cold junction (4) of described TEC device (1) is positioned at a side of the air inlet of sub-frame.
2, communication cabinet as claimed in claim 1, it is characterized in that, described sub-frame is served as reasons and is gone up to being provided with down, described heat abstractor comprises two TEC devices (1), described two TEC devices (1) are obliquely installed to rack body both sides, the cold junction (4) of described each TEC device (1) is towards the air inlet of Upper subrack, and its hot junction (5) are towards the air outlet of Lower subrack.
3, communication cabinet as claimed in claim 2 is characterized in that, described each TEC device (1) and horizontal angle are in 30 and spend between 90 degree.
4, communication cabinet as claimed in claim 2 is characterized in that, described heat abstractor comprises that also at least one connects the heat pipe (2) that is somebody's turn to do between the cold junction (4) of two TEC device for cooling (1).
5, communication cabinet as claimed in claim 4 is characterized in that, described heat pipe (2) outer surface is provided with fin (3).
6, communication cabinet as claimed in claim 4 is characterized in that, the described fin (3) on institute's heat pipe (2) is the vertical spacing setting.
7, communication cabinet as claimed in claim 1, it is characterized in that, described sub-frame is served as reasons and is gone up to being provided with down, described heat abstractor comprises a TEC device (1), described TEC device (1) is arranged between the opposite side of adjacent two sub-framves, it separates the air inlet air of Upper subrack and the air outlet air of Lower subrack, and its cold junction (4) is towards the air inlet of Upper subrack, and its hot junction (5) are towards the air outlet of Lower subrack.
8, as each described communication cabinet of claim 2 to 7, it is characterized in that, the cold junction (4) of described TEC device (1) or surface, hot junction (5) are provided with fin (3), and described fin (3) is parallel and the compartment of terrain is provided with, and the gap between the described adjacent fins (3) forms airflow channel.
9, communication cabinet as claimed in claim 8, it is characterized in that, in TEC device (1), described fin (3) is welded on the surface of the cold junction (4) of described TEC device (1) or hot junction (5), and is perhaps one-body molded with cold junction (4) or hot junction (5) of described TEC device (1).
10, communication cabinet as claimed in claim 9 is characterized in that, described TEC device (1) fixedly is located on the interior column of rack body (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620013563 CN2899392Y (en) | 2006-04-13 | 2006-04-13 | Telecommunicating equipment cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620013563 CN2899392Y (en) | 2006-04-13 | 2006-04-13 | Telecommunicating equipment cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2899392Y true CN2899392Y (en) | 2007-05-09 |
Family
ID=38074721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620013563 Expired - Fee Related CN2899392Y (en) | 2006-04-13 | 2006-04-13 | Telecommunicating equipment cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2899392Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011150798A1 (en) * | 2010-11-25 | 2011-12-08 | 华为技术有限公司 | Tec refrigerating installation and electrical apparatus using same |
| CN108307607A (en) * | 2017-01-13 | 2018-07-20 | 慧与发展有限责任合伙企业 | Inlet channel with thermoelectric cooling element |
| CN109475074A (en) * | 2018-12-29 | 2019-03-15 | 杭州和利时自动化有限公司 | Cabinet |
-
2006
- 2006-04-13 CN CN 200620013563 patent/CN2899392Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011150798A1 (en) * | 2010-11-25 | 2011-12-08 | 华为技术有限公司 | Tec refrigerating installation and electrical apparatus using same |
| CN108307607A (en) * | 2017-01-13 | 2018-07-20 | 慧与发展有限责任合伙企业 | Inlet channel with thermoelectric cooling element |
| EP3349556A3 (en) * | 2017-01-13 | 2018-07-25 | Hewlett-Packard Enterprise Development LP | Air inlet channel with thermoelectric cooling element |
| CN108307607B (en) * | 2017-01-13 | 2020-05-26 | 慧与发展有限责任合伙企业 | Intake passage with thermoelectric cooling element |
| CN109475074A (en) * | 2018-12-29 | 2019-03-15 | 杭州和利时自动化有限公司 | Cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070509 Termination date: 20100413 |