CN2899106Y - Chip electronic part - Google Patents
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- CN2899106Y CN2899106Y CN 200520019366 CN200520019366U CN2899106Y CN 2899106 Y CN2899106 Y CN 2899106Y CN 200520019366 CN200520019366 CN 200520019366 CN 200520019366 U CN200520019366 U CN 200520019366U CN 2899106 Y CN2899106 Y CN 2899106Y
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Abstract
In a chip-type electronic component of the present invention, at least one surface of a ceramic body is a convexly curved surface. Specifically, at least one surface in a thickness direction of the ceramic body may be convexly curved, and the side surface of the ceramic body may be concavely curved. Alternatively, only one surface may be a convexly curved surface. This chip-type electronic component has a high visibility and a high mechanical strength, though it is small. Moreover, in a chip-type electronic component comprising a ceramic body that is formed by alternately laminating insulating layers and conductor layers, and a pair of external electrodes, the thickness in a laminate direction at the central part between external electrodes of the ceramic body is made greater than the thickness of the end surface. This prevents breakage of the external electrodes and also enlarges the ceramic body.
Description
Technical field
The utility model relates to chip-type electronic component, particularly the small-sized chip-type electronic component of laminated ceramic capacitor, inductor, resistor, semiconductor element etc., shape approximation cuboid.
Background technology
In recent years, electronic equipment is sought the densification of miniaturization, installation, for example, open the 2003-318312 communique as the spy and put down in writing, the chip-type electronic component that capacitor, inductor, resistor, semiconductor element etc. have a various characteristics mixes and is installed on the substrate that constitutes above-mentioned electronic equipment.Chip-type electronic component (being equivalent to the circuit element that the spy opens the 2003-318312 communique) as patent documentation 1 is put down in writing for example has: the spy opens small-sized laminated ceramic capacitor (size: length 2mm, width 1.25mm, thickness 1.25mm) that the 2000-114097 communique puts down in writing etc.
Yet, as mentioned above because on substrate, various chip hybrid together, so when installing and the trivial operations in when repairing.Therefore, consider: the method for information such as its characteristic of record or manufacturing firm's name on the surface of employed chip-type electronic component., because the densification of substrate and the miniaturization of chip-type electronic component, it is difficult that the information of identification piece surface becomes.
And, the chip-type electronic component of miniaturization, the mechanical strength of himself is little.Therefore, exist: carry or when on substrate, installing with automation, since the intensity that is booked or speed or intensity when being installed on the substrate, the ruined problem of chip-type electronic component.In addition, because there are corner angle in the crest line portions of the ceramic main body after burning till etc., so there is the tip problems such as (tipping) that is easy to generate when mounted.
On the other hand, Figure 14 is documented in JSA to compile summary section among the JIS handbook 2,001 23 electronic component C5101-10, the existing typical laminated ceramic capacitor of expression.As shown in figure 14, this laminated ceramic capacitor constitutes and form pair of external electrodes 73 on the subtend end face of ceramic main body 71.In the chip-type electronic component of this cascade type, comprise that the most peripheral size of outer electrode 73 becomes specification.That is, the thickness t 3 of the stacked direction of ceramic main body 71 is less than the thickness t 4 of the equidirectional of outer electrode 73, and still, the specification of laminated electronic component is to stipulate with the thickness t 4 of above-mentioned outer electrode 73.
Therefore, under the situation of laminated ceramic capacitor, in order to reach small-sized high capacitanceization, size as the ceramic main body 71 of electric capacity generating unit is become big as much as possible, on the other hand, make outer electrode 73 thin as far as possible, so that the form that all sizes diminish as far as possible manufactures and designs.
Yet, if form outer electrode 73 thinly,, exist: during installation, externally be easy to generate by scolding tin on the electrode 73 and overwhelm though can become greatly as the ceramic main body 71 of electric capacity generating unit; Or in operations such as installation, conveying, be easy to generate problems such as peeling off of outer electrode 73.
On the other hand, for the generation that prevents that outer electrode 73 from peeling off, if form thick outer electrode 73, ceramic main body 71 is diminished, therefore, direct capacitance is suppressed and diminishes, and exist: owing to become the structure that outer electrode 73 protrudes from ceramic main body 71 contoured surface easily, so falling when waiting collision, outer electrode 73 becomes shock surface easily, therefore, outer electrode 73 easy ruined problems.
The utility model content
Main purpose of the present utility model is: a kind of chip-type electronic component is provided, even its small-sized when mounted part, the vision identification of information that is documented in piece surface is also high.
Other purposes of the present utility model are, even a kind of small-sized, chip-type electronic component that mechanical strength is also high is provided.
Another purpose of the present utility model is, even provide a kind of small-sized, also can prevent the chip-type electronic component of defectives such as tip.
Another purpose of the present utility model is, even provide a kind of chip-type electronic component small-sized part, also can make the outer electrode thickening, can prevent outer electrode destruction and can make ceramic main body become big.
Be used to solve the chip-type electronic component of the present utility model of above-mentioned problem, the ceramic main body that is had conductor portion by inside constitutes, and at least one face of this ceramic main body is the flexure plane of convex.Thus, the area of a face that constitutes the ceramic main body of chip-type electronic component becomes big, can be with big literature record chip information, and the looking away angling, so the chip affirmation when utilizing the fitting operation of magnifying glass etc. becomes easy.In addition, be documented in amount of information on the chip, thereby, also can obtain more information, so can rapid and accurate place under repair from chip when even the chip element when repairing is changed by increase.
And, because a mask of ceramic main body has the flexure plane of convex, so for example when the pressurization of strength test, even under the situation of the flexure plane of convex being pressurizeed with the instrument of stipulating, pressure is disperseed, and also can avoid mechanical damages such as destruction.
According to the utility model, preferred described ceramic main body is approximate cuboid, and at least one side's of the thickness direction of described ceramic main body face is bent into convex, and the edgewise bend of ceramic main body is concavity.That is, a face by making convex is in abutting connection with the flexure plane of concavity, thereby the ceramic main body side is made of the position of arcuation, so the mechanical strength of chip-type electronic component further improves, has improved the patience to strength test.
Therefore, for example, chip-type electronic component of the present utility model is applicable to: can install a lot of in hybrid integrated circuit etc., and be carried at a high speed and installed by automation, and need stand the small-sized stacked electronic components such as laminated ceramic capacitor of the mechanical strength of operations such as installation.
The flexure plane of preferred described convex changes thickness and forms along the ceramic main body Width.Thus, even also can make the crest line portion or the corner portion slyness of ceramic main body after burning till.Therefore, installing or carrying in the processing of operation etc., it is damaged to prevent that these crest line portions or corner portion from producing tip etc.In addition, because there are fillet in crest line portion or corner portion, so can save the grinding step that is commonly referred to as tumbling (barrel).The flexure plane of above-mentioned convex preferably is placed as the upper surface side of object chip type electronic component.
In the utility model, can be a flexure plane that face is a convex.Thus, for example, can make the face beyond the upper surface is the plane, even small-sized part is also can shelf-stability superior.
And chip-type electronic component of the present utility model possesses: a plurality of insulating barriers of mutual alternately laminated ceramic and the ceramic main body that conductor layer forms; Be formed on these ceramic main body both ends of the surface, alternately be connected the pair of external electrodes of described conductor layer every one deck.The stacked direction thickness of the central portion between the outer electrode of described ceramic main body is greater than the thickness of end face side.
Thus, even be not the structure that outer electrode protrudes from the ceramic main body contoured surface, also can make outer electrode form enough thickly.And the surface of outer electrode and ceramic main body side can almost be formed on same.Therefore,, only just can reduce suffered impact, can prevent: the caused damaged or destruction of the impact when falling with outer electrode falling etc. when colliding.And the thickness of outer electrode there is no need attenuation, so can prevent: the outer electrode during installation overwhelmed or install by scolding tin or operation such as conveying in the peeling off of the outer electrode that produced.
Description of drawings
Fig. 1 is the approximate three-dimensional map of the chip-type electronic component of expression the 1st execution mode of the present utility model.
Fig. 2 is the summary section of radius of curvature r1 that is used to illustrate the convex curvature face of the 1st execution mode of the present utility model.
Fig. 3 is the summary section of radius of curvature r11 that is used to illustrate the concavity flexure plane of the 1st execution mode of the present utility model.
Fig. 4 is expression: the summary section of the method that the stacked direction (thickness direction) of the chip-type electronic component that the 1st execution mode of the present utility model is related to and the expansion rate of Width are estimated.
Fig. 5 (a) and (b) are skeleton diagrams of manufacture method of the chip-type electronic component of expression the 1st execution mode of the present utility model.
Fig. 6 is the approximate three-dimensional map of the chip-type electronic component that relates to of expression the utility model the 2nd execution mode.
Fig. 7 is the summary section of the chip-type electronic component that relates to of expression the utility model the 2nd execution mode.
Fig. 8 is the summary section of the radius of curvature r2 of the flexure plane that is used to illustrate that the 2nd execution mode of the present utility model relates to.
Fig. 9 is the chip-type electronic component that expression relates at the 2nd execution mode of the present utility model, the summary section of the method that the expansion rate of stacked direction is estimated.
Figure 10 (a) and (b), (c) are the skeleton diagrams of the manufacture method of the chip-type electronic component that relates to of expression the 2nd execution mode of the present utility model.
Figure 11 is the approximate three-dimensional map of the chip-type electronic component that relates to of expression the 3rd execution mode of the present utility model.
Figure 12 is the summary section of the radius of curvature r3 of the flexure plane that is used to illustrate that the 3rd execution mode of the present utility model relates to.
Figure 13 is the skeleton diagram of the manufacture method of the chip-type electronic component that relates to of expression the 3rd execution mode of the present utility model.
Figure 14 is the summary section of the existing laminated ceramic capacitor of expression.
Embodiment
＜the first execution mode 〉
Below, with reference to accompanying drawing,, with the laminated ceramic capacitor example particularly to chip-type electronic component of the present utility model, be elaborated.Fig. 1 is the approximate three-dimensional map of the chip-type electronic component that relates to of this execution mode.Fig. 2 is the summary section that is used to illustrate the radius of curvature r1 of convex curvature face.Fig. 3 is the summary section that is used to illustrate the radius of curvature r11 of concavity flexure plane.
Chip-type electronic component of the present utility model is the chip-type electronic component that has pair of external electrodes 3 in the end of ceramic main body 1, possesses conductor portion 5 in inside, can be considered as rectangular-shaped part when its face shaping is so-called overlooking.In the utility model, the face (one or both sides) of the thickness direction of described ceramic main body 1 (stacked direction) bends to convex, and with respect to described convex face, two edgewise bends are concavity.The upper and lower surface of particularly described ceramic main body 1 and two sides are bent to convex (flexure plane 9a) and concavity (flexure plane 9b) respectively for well.And described (and side) becomes the interarea that constitutes ceramic main body 1.
In more detail, shown in Fig. 2 and 3, preferably ceramic main body 1 makes a plurality of insulating barriers 7 of ceramic and conductor portion 5 alternately laminated.Wish: the volume of ceramic main body 1 is 8mm
3Below, be preferably 5.5mm
3Below, and radius of curvature r1, the r11 on flexure plane 9a, 9b surface are 50mm.In addition, the radius of curvature r1 of flexure plane 9a, 9b, r11 can be that identical value also can be different value.
Do not have under the situation of flexure plane 9a, 9b at the ceramic main body 1 that constitutes chip-type electronic component, because the area of the interarea of ceramic main body 1 is little, so can not put down in writing chip information with big literal, the visual field also narrows down, even in utilizing the fitting operation of magnifying glass etc., also be difficult to confirm chip element.In addition, when the replacing of the chip element when repairing, because the information that obtains from electronic component is few, so place under repair quickly and accurately.And when the pressurization of strength test, during with regulation instrument pressurization interarea, pressure is difficult for disperseing and is easy to generate mechanical damage such as destruction, and when installing or carry assembling, electronic component destroys easily.
Fig. 4 is expression: the summary section of the evaluation method of the expansion rate of stacked direction of chip-type electronic component (thickness direction) and Width.
As shown in Figure 4, when representing the length of the stacked direction in ceramic main body 1 side that conductor portion 5 do not expose at the extreme length of the stacked direction of the conductor portion 5 of representing ceramic main body 1 with a, with b, the expansion rate x1 of stacked direction can represent with formula: x1={ (a1-b1)/b1} * 100.Because improve the reason of the breakdown strength of chip-type electronic component, thus expansion rate x greater than 0%, greater than 1% for well, more preferably greater than 5%.In addition, a1＞b1 preferably.
In addition, be made as d at the shortest length with Width, when the length between the end of equidirectional ceramic main body 1 is made as c, the expansion rate y of Width can represent with formula: y={ (d-c)/c} * 100.Owing to improve the reason of the breakdown strength of chip-type electronic component, so the absolute value of this expansion rate (y) is greater than 0%, absolute value is greater than 1% for well, and more preferably absolute value is greater than 5%.Under chip-type electronic component is small-sized situation, if above-mentioned expansion rate y is excessive, then can reduce shelf-stability, so, preferably satisfy the relation of y＜10 satisfying aspect the characteristics such as shelf-stability, breakdown strength, vision identification.In addition, preferred d＜c.
In addition, the radius of curvature r1 and the r11 on the flexure plane 9a of the bending of preferably ceramic main body 1,9b surface are respectively below the 50mm.Like this, according to the utility model, satisfy above-mentioned relation by making the expansion rate and the radius of curvature that are defined as x1 and y, thereby can improve the breakdown strength of chip-type electronic component.
In addition, preferably the flexure plane tone is different from the tone of other faces, and promptly flexure plane 9a, 9b are different tone or in its color difference of contrast points.For make flexure plane 9a, 9b mutually with other complexions transfer different, end that can be by general's conductor portion 5 internally being adjusted into different size and forming till ceramic main body 1 surface apart from w1, w2.For example, by till making from the superiors of the conductor portion 5 of Fig. 4 to ceramic main body 1 surface of bending apart from w1 less than the side of the end of conductor portion 5 and conductor portion 5 apart from w2, thereby can see that the degree of conductor portion 5 forms hue difference to see through ceramic main body 1.Thus, further improve the vision identification of information, it is easy that the difference of flexure plane 9a, 9b becomes.
Fig. 5 is the skeleton diagram of the manufacture method of the chip-type electronic component that relates to of this execution mode of expression.At first, shown in Fig. 5 (a), comprising the conductive pattern 13 that forms rectangle on the raw cook of ceramic powders (green sheet) 11.In Fig. 5 (a), model A is the model that only forms conductive pattern 13 on raw cook 11, Model B, C, D be formed at conductive pattern 13 on the raw cook 11 around, with the material identical with raw cook, form different ceramic pattern 15a, 15b, the 15c of size, eliminate the model of the jump of conductive pattern 13.
Then, for example, utilize the combination of Fig. 5 (b), the interarea that the raw cook 11 of model A～D is laminated into the ceramic main body formed body is bent into the regulation shape, cuts into the regulation shape and forms the ceramic main body formed body that inside has conductive pattern 13.Then, utilize rubber die press etc. to carry out pressurized, heated.Then, Low fire ceramic main body formed body is made inner ceramic main body with conductor portion.
That is, raw cook 11 preferably from the duplexer middle body to the upper and lower, carry out stacked according to the order of Model B, C, D and A.Thus, form the flexure plane 9a of convex and the flexure plane 9b of concavity.Stacked piece of number of raw cook 11 is generally about 15～400 pieces, in this scope, as long as piece number of each model of decision raw cook 11 and combination just can.Pressure when in addition, expansion rate and radius of curvature also can be according to the pressurizations of stacked piece of number, formed body is adjusted.
At last, at the both ends of above-mentioned ceramic main body, for example form outer electrode, to finish laminated ceramic capacitor.
＜the second execution mode 〉
Below, with reference to accompanying drawing,, with the laminated ceramic capacitor example especially to the chip-type electronic component of second execution mode of the present utility model, be elaborated.Fig. 6 is the stereogram of the chip-type electronic component that relates to of this execution mode of expression, and Fig. 7 is its summary section.This chip-type electronic component possesses conductor portion 25 in ceramic main body 21 inside across insulating barrier 24, has pair of external electrodes 23,23 in its end.Its face shaping can be considered as cuboid when so-called overlooking, particularly importantly, at least one mask that comprises the longitudinal edge 27 of ceramic main body 21 has the flexure plane 29 of convex.In this embodiment, just form the flexure plane 29 of convex at ceramic main body 21 upper surfaces.And an above-mentioned face becomes the interarea that constitutes ceramic main body 21.
In addition, ceramic main body 21 is that volume is 1mm
3Following is small-sized.Preferred this ceramic main body 21 is made of a plurality of insulating barriers 24, is laminated with conductor portion 25 between this insulating barrier 24.
In contrast, if ceramic main body 21 does not have flexure plane 29, then because the major-surface-area of ceramic main body is little, so can not be with big literature record chip information, the visual field also narrows down, even in utilizing the fitting operation of magnifying glass etc., and the affirmation of the chip element difficulty that also becomes.In addition, because the amount of information put down in writing is few, so even when the chip element when repairing was changed, the information that obtains from chip element was few, therefore can not be rapidly and place under repair exactly.And, because there are corner angle in crest line portion, so be easy to generate the tip.
Fig. 8 is the summary section that is used to illustrate the radius of curvature r2 of flexure plane.Fig. 9 is the summary section of the method estimated at chip-type electronic component, to the expansion rate of stacked direction of expression.
As shown in Figure 9, when near the stacked direction length that the extreme length of stacked direction is made as a2, ceramic main body 21 end sides will be perpendicular to the central portion of the face of outer electrode 23 directions of subtend was made as b2, the expansion rate x2 of stacked direction can represent with formula x2={ (a2-b2)/b2} * 100.Because improve the reason of the breakdown strength of chip-type electronic component, this expansion rate is greater than 0%, is preferably greater than 1%, more preferably greater than 5%.
In addition, from vision identification and prevent most advanced and sophisticated aspect, the radius of curvature r2 on ceramic main body 21 surfaces more preferably shown in Figure 8 is below the 5mm.And, for example, aspect easy identification stacked direction flexure plane and flattened side, preferred flexure plane 29 be the tone different with other faces or on contrast points its color difference.
Different for flexure plane 29 and other complexions are transferred, can be by general's end being adjusted into different size and forming till ceramic main body 21 surfaces of stacked conductor portion 25 internally apart from w3, w4.Promptly, for example by make among Fig. 9 from the superiors of conductor portion 25 to ceramic main body 21 surfaces of bending till apart from w3 less than the side of the end of conductor portion 25 and ceramic main body 21 apart from w4, thereby can see that the degree of conductor portion 25 forms hue difference to see through ceramic main body 21.
Figure 10 is the skeleton diagram of the manufacture method of the chip-type electronic component that relates to of this execution mode of expression.At first, shown in Figure 10 (a), on the raw cook 31 that comprises ceramic powders, form the conductive pattern 33 of rectangle.In this case, model E is the model that only forms conductive pattern 13 on raw cook 31; Model F is around the conductive pattern 33 that forms on the raw cook 31, forming ceramic pattern 35 with raw cook 31 identical materials, with the model of the jump of eliminating conductive pattern 33.
Then, for example utilize the combination shown in Figure 10 (b), (c),, cut into the regulation shape, thereby form inner ceramic main body formed body with conductive pattern 33 so that the interarea of ceramic main body formed body is bent into the mode of regulation shape is multilayer laminated.Then, utilize rubber die press etc. to carry out pressurized, heated.Then, Low fire ceramic main body formed body, the ceramic main body 21 that has conductor portion 25 with construction drawing 7, inside shown in Figure 8.
At last, for example form pair of external electrodes 23, finish the laminated ceramic capacitor that the utility model relates in above-mentioned ceramic main body 21 ends.
In the combination of Figure 10 (b), after the raw cook 31 of stacked many pieces of model F, the raw cook 31 of stacked model E on the duplexer upper and lower surface of the model F that is obtained, and configuration does not have the raw cook 31 of conductive pattern 33 on upper surface.Thus, can form flexure plane 29 on upper and lower surface.
On the other hand, in the combination of Figure 10 (c), after the raw cook 31 of many pieces of stacked model F, the raw cook 31 of placement model E and do not have the raw cook 31 of conductive pattern 33 on the duplexer upper surface of the model F that is obtained only.Thus, only can form flexure plane 29 at upper surface.Other are with above-mentioned
Execution mode is same.
＜the three execution mode 〉
Below, with reference to accompanying drawing,, with the laminated ceramic capacitor example particularly to other execution modes of the present utility model, be elaborated.Figure 11 is the stereogram of the chip-type electronic component that relates to of this execution mode of expression.
As shown in figure 11, this chip-type electronic component has: a plurality of insulating barriers 41 (ceramic layer) of alternately laminated ceramic and the ceramic main body 45 that conductor layer 43 forms; And on the both ends of the surface 47 of this ceramic main body 45, possess respectively: the pair of external electrodes 49,49 that described conductor layer 43 alternately connects every one deck.
In this embodiment, the stacked direction thickness t of the central portion 51 between the described outer electrode 49 of described ceramic main body 45 is greater than the thickness t 1 of end face 47 sides.That is, be made as t at the maximum ga(u)ge with the stacked direction of ceramic main body 45, in the time of will being made as t0 with the Breadth Maximum of the outer electrode 49 of ceramic main body 45 stacked direction equidirectionals, the pass of satisfying t 〉=t0 is.At this, express as Figure 11, the width t0 of so-called outer electrode 49 is meant: and the Breadth Maximum of ceramic main body 45 stacked direction equidirectionals.
Face shaping can be considered as rectangular-shaped when so-called overlooking, and at least one face of seamed edge that particularly comprises the length direction of ceramic main body 45 presents the flexure plane of convex.As mentioned above, this shape is: the central portion 51 between the outer electrode 49 of ceramic main body 45 has the flexure plane 50 of convex on the cross section view of stacked direction.That is, as shown in figure 11, preferably the stacked direction thickness between the outer electrode 49 of ceramic main body 45 enlarges the shape of width gradually to central portion 51 from end face 47.And an above-mentioned face becomes the interarea that constitutes ceramic main body 45.
Ceramic main body 45 can not be aforesaid flexure plane also, but has only the little shape of end regions thickness t 1 of outer electrode formation portion.
In contrast, if the maximum ga(u)ge t of the central portion 51 of ceramic main body 45 be not more than end face 47 sides thickness t 1 and as in the past rectangular shape, then become the structure that outer electrode 49 protrudes from ceramic main body 45 contoured surface easily.Therefore, when the collision that falls etc., outer electrode 49 becomes shock surface easily, and outer electrode 49 is destroyed easily.In addition, in order to suppress the destruction of outer electrode 49, if make outer electrode 49 thickenings, then for size up to specification, ceramic main body 45 is diminished, direct capacitance diminishes thus.
Figure 12 is the profile of expression perpendicular to the radius of curvature of the flexure plane of ceramic main body 45 stacked directions.As more effective execution mode of the present utility model, the volume of ceramic main body 45 is 8mm
3Below, 5.5mm particularly
3Following small-sized being shaped as, and wish that the radius of curvature r3 of flexure plane 50 is below the 50mm.As such part, be not limited to above-mentioned laminated ceramic capacitor, also have: cascade type inductor, cascade type exciter, resistor etc.
In addition, as shown in figure 11, will be made as t perpendicular near the stacked direction maximum length the central portion of the face of the extending direction of conductor layer 43, when the stacked direction length of ceramic main body 45 ends is made as t1, the expansion rate of ceramic main body 45 stacked directions can be represented with formula x3={ (t-t1)/t1} * 100.Expansion rate x3 is greater than 0%, greater than 1% for well, is better greater than 5%.
Figure 13 is the skeleton diagram of the manufacture method of the chip-type electronic component that relates to of this execution mode of expression.That is, Figure 13 (a) is the manufacture method that expression is observed raw cook 61 and stacked formed body thereof from end face, and Figure 13 (b) represents the manufacture method of observing from the side.
At first, on the raw cook 61 that comprises ceramic powders, form the conductive pattern 63 of rectangle.In this case, model G is the model that only forms conductive pattern 63 on raw cook 61; Model H is around the conductive pattern 63 that forms on the raw cook 61, forms the ceramic pattern 65 identical with raw cook 61 materials, with the model of the jump of elimination conductive pattern 63.
Then, each raw cook 61 of model G, model H, with the combination shown in Figure 13 (a) and (b) carry out stacked after, cut into the regulation shape and form the ceramic main body formed body that inside has conductive pattern 63.That is, in Figure 13 (a) and (b), the raw cook 61 of model H is arranged in central portion and the raw cook 61 of model G is arranged in its two ends.Thus, the interarea of ceramic main body formed body bends to the regulation shape.At this moment, shown in Figure 13 (b), with every one deck conductor layer 43 from the mode that end face alternately exposes, make the position of the conductive pattern 63 on each raw cook 61 alternately become rightabout.
After the moulding, utilize rubber die press etc. to carry out pressurized, heated, then, Low fire ceramic main body formed body is to make the ceramic main body that inside has conductor portion.At last, for example form outer electrode and finish laminated ceramic capacitor of the present utility model in the end of above-mentioned ceramic main body.Other are same with above-mentioned execution mode.
In the above embodiment, as electronic component of the present utility model, be that example is illustrated with the laminated ceramic capacitor, still, electronic component of the present utility model is not to be only limited to laminated ceramic capacitor, for example goes for cascade type inductor, cascade type exciter, resistor etc.
[example I]
(making of chip-type electronic component)
Basically make the chip-type electronic component of structure shown in Figure 1 and estimate.At first, made the dielectric raw cook of thickness 3 μ m that comprises with the barium titanate powder dielectric medium powder that is main component.On the upper surface of this dielectric raw cook, will with Ni the conductor paste of main component, print with the thickness of 1～1.5 μ m, and make model A, B shown in Figure 5, the raw cook of C, D respectively.Then, with the raw cook of model A, B, C, D stacked be various forms, afterwards, thereon, the dielectric raw cook of the thickness that the does not have the printed conductor pattern 10 μ m of the stacked regulation of lower surface piece number.Then, carry out the rubber pattern punching press, cut into desired size thereafter, to form the ceramic main body formed body.Then,, in reducing atmosphere, burn till, carry out that cylinder grinds and form the outer electrode of copper, with the chip-type electronic component shown in the construction drawing 1,2 at end face with 1250～1280 ℃ of temperature the ceramic main body formed body of having made.The shape of the ceramic main body of each electronic component that is obtained shown in the table 1.
And, the printing area of conductor inside pattern is changed, with the tone of modulation emersion to the ceramic main body side.In addition, the raw cook of the only stacked model D of sample No.18 as a comparative example forms.
To the chip-type electronic component of having made, estimate hue difference, expansion rate, radius of curvature and breakdown strength with the method shown in following.In evaluation result shown in the table 1.In addition, the sample number is 10 in all are estimated.
(hue difference)
Utilize colour difference meter to estimate hue difference between the surface of ceramic main body stacked direction (face 9a shown in Figure 1) and side (the face 9b shown in Figure 1) thereof.In this case, hue difference is just to think more than 20% that hue difference is arranged.
(expansion rate)
As shown in Figure 4, when the stacked direction length that be made as a1 at the stacked direction extreme length with the conductor layer of ceramic main body, will not expose the ceramic main body side of conductor layer was made as b1, the expansion rate x1 of stacked direction represented with formula x1={ (a1-b1)/b1} * 100.In addition, conductor portion extending direction and the Width shortest length that do not expose the conductor portion direction of ceramic main body are made as d, when the length between the end of the ceramic main body 1 of equidirectional is made as c, the expansion rate y of the vertical direction of stacked direction represents with y={ (d-c)/c} * 100.In evaluation this time, under the situation of the expansion rate of having measured the two sides respectively, with these mean value as expansion rate.
(radius of curvature)
Radius of curvature r1 is the section after the grinding of the ceramic main body made of electron microscope photography, utilizes this photo, uses compasses (compass) to measure.
(breakdown strength)
Utilize autoplotter (autograph) to measure breakdown strength.
Table 1
| Sample No. | The shape of ceramic main body | The hue difference of upper surface and side | The expansion rate of stacked direction *3 ％ | The expansion rate of | Radius of curvature | Breakdown strength MPa | |||
| The place of flexure plane | Size *2 mm 3 | The stacked number of plies | Upper and lower surface mm | Side mm | |||||
| I-1 | The top and bottom of stacked direction and side | 2×1×1.8 | 50 | Have | 5.5 | -5.1 | 5.2 | 55 | 555 |
| I-2 | The top and bottom of stacked direction and side | 2×1×1.8 | 100 | Have | 5.6 | -5.2 | 4.5 | 49 | 521 |
| I-3 | The top and bottom of stacked direction and side | 2×1×1.8 | 300 | Have | 5.9 | -5.3 | 4.6 | 48 | 501 |
| I-4 | The top and bottom of stacked direction | 2×1×1.8 | 100 | Have | 5.1 | - | 5 | - | 430 |
| I-5 | The top and bottom of stacked direction and side | 3×2×1.8 | 100 | Have | 4.3 | -3.2 | 8 | 86 | 489 |
| I-6 | The top and bottom of stacked direction and side | 2×1×1.8 | 100 | Do not have | 5.2 | -5 | 4 | 49 | 500 |
| I-7 | The top and bottom of stacked direction and side | 2×1×1.8 | 100 | Have | 2.6 | -1.2 | 6 | 59 | 460 |
| *I-8 | No | 2×1×1.8 | 100 | Have | 0 | 0 | - | - | 390 |
*Mark is represented extraneous sample of the present utility model.
*2: outer electrode direction length x width x thickness
*3：x1＝{(a1-b1)/b1}×100
*4：y＝{(d-c)/c}×100
As shown in Table 1: in sample No.I-1～7 of at least one face of ceramic main body as flexure plane, breakdown strength is more than the 430Mpa, particularly with ceramic main body relatively to surface curvature be that breakdown strength is more than the 470Mpa in concavo-convex sample No.I-1～3,5～7.In addition, be of a size of 2 * 1 * 1.8mm at ceramic main body
3, stacked direction expansion rate be more than 5%, the expansion rate of Width is for-5% or more (under the situation about bearing, absolute value is big), for being in following No.I-1～3,6 of 55mm below the 52mm, in the side, its breakdown strength is more than the 500Mpa to radius of curvature in upper and lower surface.To this, all be that its breakdown strength is reduced to 390Mpa among the sample No.I-8 of 0 (radius of curvature is energy measurement not) in the expansion rate of stacked direction and Width.
In addition, in having the No.I-1 of curved surface～3,5～7, whole smooth sample No.I-8 compare with the surface, have increased the area on ceramic main body surface.Thus, the big lettering more than at least 1.1 times becomes possibility, has improved the vision identification of chip element.
[example II]
(making of chip-type electronic component)
Basically make the chip-type electronic component of structure shown in Figure 6 and estimate.At first and example I same, made the dielectric raw cook of model E shown in Figure 10, F.
Then, the raw cook of stacked model E, F to become various forms,, down with after the stacked dielectric raw cook that does not have a printed conductor pattern of piece number that is less than example I, carries out the rubber pattern punching press thereon.Then, cut into desired size, and form the ceramic main body formed body.Then and example I same, burn till, carry out cylinder and grind, then, form outer electrode, with the chip-type electronic component shown in the construction drawing 6,7.Shape at the ceramic main body of each electronic component that is obtained shown in the table 2.
In addition, the raw cook of the only stacked model F of sample No.II-8 as a comparative example forms.
Same for chip-type electronic component of having made and example I, estimated expansion rate, radius of curvature (r2) and the breakdown strength of hue difference, stacked direction.In these evaluation results shown in the table 2.In addition, the sample number is 10 in all are estimated.
Table 2
| Sample No. | The shape of ceramic main body | The hue difference of upper surface and side | The expansion rate of stacked direction *3 ％ | Radius of curvature upper and lower surface mm | Breakdown strength MPa | ||
| The place of flexure plane | Size *2 mm 3 | The stacked number of plies | |||||
| II-1 | The top and bottom of stacked direction | 1×1×1.8 | 50 | Have | 5.5 | 4.9 | 791 |
| II-2 | The top and bottom of stacked direction | 1×1×1.8 | 100 | Have | 5.6 | 4.7 | 756 |
| II-3 | The top and bottom of stacked direction | 1×1×1.8 | 300 | Have | 5.9 | 4.6 | 711 |
| II-4 | Above the stacked direction | 1×1×1.8 | 100 | Have | 5.1 | 3.8 | 654 |
| II-5 | The top and bottom of stacked direction | 2×1×1.8 | 100 | Do not have | 5.6 | 4.7 | 522 |
| II-6 | The top and bottom of stacked direction | 1×1×1.8 | 100 | Have | 5.2 | 4.2 | 703 |
| II-7 | The top and bottom of stacked direction | 1×1×1.8 | 100 | Have | 2.6 | 2 | 460 |
| *II-8 | No | 1×1×1.8 | 100 | Have | 0 | - | 400 |
*Mark is represented extraneous sample of the present utility model.
*2: outer electrode direction length x width x thickness
*3：x2＝{(a2-b2)/b2}×100
As shown in Table 2: in making sample No.II-1 of the present utility model～7 of ceramic main body surface curvature, breakdown strength is more than the 460Mpa.In addition, in the expansion rate of stacked direction be more than 5.1%, radius of curvature is that breakdown strength becomes more than the 522Mpa in sample No.II-1～6 of 4.2～4.9mm; And, though be that the tectal thin thickness of the identical number of plies and the sample destruction intensity that possesses hue difference are lower than and do not have the sample destruction of hue difference intensity.
To this, among the sample No.II-8 outside the expansion rate of stacked direction is the utility model of 0 (radius of curvature can not be measured), breakdown strength is reduced to 400Mpa.
In addition, in having the No.II-1 of curved surface～7, whole smooth sample No.II-8 compare with the surface, and the area on ceramic main body surface increases, and thus, the big lettering more than at least 1.1 times becomes possibility, has improved the vision identification of chip element.
[EXAMPLE III]
(making of chip-type electronic component)
Basically made the chip-type electronic component of structure shown in Figure 11 and estimated.At first and example I same, made the dielectric raw cook of model G, H shown in Figure 13.
Then, the raw cook of stacked model G, H is so that become various forms, thereon, down after the stacked dielectric raw cook that does not have a printed conductor pattern, carry out the rubber pattern punching press.Then, cutting off becomes desired size, and forms the ceramic main body formed body.Then and example I same, burn till formed body, carry out cylinder and grind.Then, on two end faces, with the outer electrode of the formation of the thickness shown in the table 3 copper, to make the chip-type electronic component shown in Figure 11,12.At this, the viscosity that the thickness of outer electrode is stuck with paste by copper is adjusted.The value that the thickness of the outer electrode in the table 3 is represented with Figure 11 (t0-t1)/2.
In addition, the raw cook of the only stacked model H of sample No.III-8 as a comparative example forms.In addition, as the following in shape smooth sample No.III-7 of ceramic main body, owing to can alleviate the influence of the jump of inner conductor, so form this shape.
Same to the chip-type electronic component and the example I of having made, estimate hue difference, radius of curvature (r3) and breakdown strength, and, implement the expansion rate (x3) of stacked direction and the evaluation of shatter test with the method shown in following.In these evaluation results shown in the table 3.In addition, the sample number is 10 in all are estimated.
(expansion rate of stacked direction)
As shown in figure 11, when the stacked direction length that perpendicular near the stacked direction maximum length the central portion of the face of internal electrode extending direction is t, ceramic main body end was t1, the expansion rate x3 of ceramic main body stacked direction represented with formula x3={ (t-t1)/t1} * 100.In current evaluation, measured relatively to the situation of face under, get the mean value of two faces.
(shatter test)
Shatter test be from height 1m after concrete block falls sample, observe the state of the outer electrode after falling, estimated zero defect or crackle.
By the result of following table 3 as can be known: in sample No.III-1～7, breakdown strength is more than the 155Mpa, and the percent defective in the shatter test is below 0.3%.
In addition, in the expansion rate of stacked direction be more than 5%, radius of curvature is in sample No.III-1～6 of 89mm, breakdown strength is more than the 187Mpa, and the percent defective in the shatter test is below 0.1%; In addition, externally the thickness of electrode is that breakdown strength further improves in 4mm, sample No.III-1～4 of ceramic main body stacked direction thickness t greater than the width t0 of equidirectional outer electrode, and the percent defective in the shatter test reduces.To this, be that breakdown strength is reduced to 132Mpa among the sample No.III-8 of 0 (radius of curvature can not be measured) in the stacked direction expansion rate of stacked direction, the percent defective in the shatter test rises to 0.8%.
In sample No.III-1～7, whole smooth sample No.III-8 compare with the surface, and the area on ceramic main body surface increases, and thus, the big lettering more than at least 1.1 times becomes possibility, has improved the vision identification of chip element.
Table 3
| Sample No. | The shape of ceramic main body | Outer electrode thickness μ m | The relation of the outer electrode width t0 of the stacked direction thickness t of electronic component main body and equidirectional | The hue difference of upper surface and side | The expansion rate of stacked direction *3 ％ | Radius of curvature upper and lower surface mm | Breakdown strength MPa | Outer electrode percent defective % in the shatter test | ||
| Shape | Size *2 mm 3 | The stacked number of plies | ||||||||
| II-1 | Figure 11 | 3×2×1.8 | 50 | 4 | t＞t0 | Do not have | 4.5 | 89 | 236 | 0 |
| II-2 | Figure 11 | 3×2×1.8 | 100 | 4 | t＞t0 | Have | 4.7 | 68 | 211 | 0 |
| II-3 | Figure 11 | 3×2×1.8 | 300 | 4 | t＞t0 | Have | 5 | 56 | 190 | 0 |
| II-4 | Figure 11 | 2×1×1.8 | 100 | 4 | t＞t0 | Have | 5.1 | 50 | 266 | 0 |
| II-5 | Figure 11 | 3×2×1.8 | 100 | 4 | t＞t0 | Have | 5.2 | 49 | 259 | 0 |
| II-6 | Figure 11 | 2×1×1.8 | 100 | 6 | t＜t0 | Have | 5.4 | 48 | 187 | 0.1 |
| II-7 | Top and bottom are smooth *4 | 2×1×1.8 | 20 | 4 | t＜t0 | Do not have | 1.8 | 98 | 155 | 0.3 |
| *II-8 | Figure 14 | 2×1×1.8 | 100 | 4 | t＜t0 | Have | 0 | - | 132 | 0.8 |
*Mark is represented extraneous sample of the present utility model.
*2: outer electrode direction length x width x thickness
*3：x3＝{(t-t1)/t1}×100
*4: have only the thickness t 1 of end regions of top and bottom unbending outer electrode formation portion little
Claims (11)
1, a kind of chip-type electronic component wherein is made of the ceramic main body that inside has a conductor portion, it is characterized in that,
At least one face of described ceramic main body is the flexure plane of convex.
2, chip-type electronic component according to claim 1 is characterized in that, described ceramic main body is rectangular-shaped, and the one side at least of the thickness direction of described ceramic main body is bent into convex, and the edgewise bend of ceramic main body is concavity simultaneously.
3, chip-type electronic component according to claim 1 and 2 is characterized in that, the volume of ceramic main body is 8mm
3Below, and the radius of curvature r1 of the flexure plane of convex and concavity and r11 are below the 50mm.
4, chip-type electronic component according to claim 1 is characterized in that, the absolute value of the expansion rate of thickness direction and the expansion rate of Width is greater than 1%.
5, chip-type electronic component according to claim 4 is characterized in that, the absolute value of the expansion rate of thickness direction and the expansion rate of Width is greater than 5%.
6, chip-type electronic component according to claim 1 is characterized in that, the flexure plane of convex changes thickness along the Width of ceramic main body.
7, chip-type electronic component according to claim 1 is characterized in that, having only a face is the flexure plane of convex.
According to claim 1 or 7 described chip-type electronic components, it is characterized in that 8, the volume of ceramic main body is 1mm
3Below, and the radius of curvature r2 of flexure plane is below the 5mm.
9, chip-type electronic component according to claim 7 is characterized in that, the expansion rate of thickness direction is greater than 1%.
10, chip-type electronic component according to claim 9 is characterized in that, the expansion rate of thickness direction is greater than 5%.
11, chip-type electronic component according to claim 1 is characterized in that, described ceramic main body is by a plurality of insulating barriers of ceramic, constitute with the alternately laminated conductor portion of this insulating barrier.
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| JP2004158428 | 2004-05-27 | ||
| JP2004158428 | 2004-05-27 | ||
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| JP2004282383 | 2004-09-28 | ||
| JP2004282381 | 2004-09-28 | ||
| JP2005049196 | 2005-02-24 | ||
| JP2005049197 | 2005-02-24 | ||
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| JP4511625B1 (en) * | 2009-10-16 | 2010-07-28 | ルビコン株式会社 | Multilayer capacitor, manufacturing method thereof, circuit board, and electronic device |
| JP6134507B2 (en) | 2011-12-28 | 2017-05-24 | ローム株式会社 | Chip resistor and manufacturing method thereof |
| KR102029469B1 (en) | 2012-02-17 | 2019-10-07 | 삼성전기주식회사 | Multilayered ceramic electronic component and fabricating method thereof |
| CN102637525B (en) * | 2012-03-29 | 2015-02-18 | 贾伟 | Flat low-inductance and high-voltage capacitor |
| KR101496816B1 (en) * | 2013-04-26 | 2015-02-27 | 삼성전기주식회사 | Multi-layered ceramic electronic part and board for mounting the same |
| JP2015109415A (en) * | 2013-10-24 | 2015-06-11 | 株式会社村田製作所 | Multilayer ceramic electronic component, serial taping electronic component, and manufacturing method for multilayer ceramic electronic component |
| JP6265114B2 (en) | 2014-11-28 | 2018-01-24 | 株式会社村田製作所 | Multilayer capacitor and manufacturing method thereof |
| KR20160108905A (en) * | 2015-03-09 | 2016-09-21 | 삼성전기주식회사 | Multi-Layer Ceramic Electronic Component and Method of Fabricating the Same |
| JP6405328B2 (en) * | 2016-02-26 | 2018-10-17 | 太陽誘電株式会社 | Multilayer ceramic capacitor |
| JP6816817B2 (en) * | 2017-03-03 | 2021-01-20 | 株式会社村田製作所 | Multilayer ceramic capacitors and their manufacturing methods |
| JP6926995B2 (en) * | 2017-11-29 | 2021-08-25 | Tdk株式会社 | Electronic components |
| JP6753421B2 (en) * | 2018-01-11 | 2020-09-09 | 株式会社村田製作所 | Multilayer coil parts |
| JP7163883B2 (en) * | 2019-08-07 | 2022-11-01 | 株式会社村田製作所 | inductor components |
| JP7234951B2 (en) * | 2020-01-17 | 2023-03-08 | 株式会社村田製作所 | Multilayer ceramic capacitor |
| KR102276386B1 (en) * | 2020-01-28 | 2021-07-13 | 삼성전기주식회사 | Coil component |
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Granted publication date: 20070509 Termination date: 20110526 |