CN2840279Y - A kind of microminiature ceramic thermistor structure - Google Patents
A kind of microminiature ceramic thermistor structure Download PDFInfo
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- CN2840279Y CN2840279Y CN 200520042974 CN200520042974U CN2840279Y CN 2840279 Y CN2840279 Y CN 2840279Y CN 200520042974 CN200520042974 CN 200520042974 CN 200520042974 U CN200520042974 U CN 200520042974U CN 2840279 Y CN2840279 Y CN 2840279Y
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Abstract
A kind of microminiature ceramic thermistor structure, comprise T font insulator, two the resistance chips of forming by transverse part and vertical part, be characterized in: the transverse part inboard of the T font insulator detent that two and each are complementary with the top of resistance chip respectively that be arranged in parallel, two resistance chips are embedded in respectively in this groove and are bonding in aggregates.The middle part, vertical part of T font insulator is provided with a parallel spacing block that the electrode slice that is provided with on two chip forward surfaces is kept apart.The utility model can guarantee that in communication apparatus reliable contact uses, and solved on the technology unnecessary loaded down with trivial detailsly again, relies on its exclusive insulator once to assemble success, can accurately locate, and further improve the ceramic thermistor structure of equivalent erection space.The utility model has guaranteed the transmission objective on the communication line, can be used for extensive automation surface assembling again, has dwindled the equivalent erection space on printed substrate greatly, and installing for the super-high density of wiring board provides certain reliability.
Description
Technical field
The utility model relates to a microminiature SMD (SMD) thermistor, especially its rational structure.
Background technology
Usually use ceramic thermistor in the electronics as over-current protection device.Adopting the thermistor structure is nothing but two classes, and a class is that band goes between, and during use it is directly inserted wiring board, and again through wave soldering, but this is not suitable for automated production in enormous quantities and pairing is used; Another kind of is the SMD thermistor of SMD, and it is that stacked in parallel about two thermistor chips is formed a protected location, and it saves the area that device accounts for wiring board than lead type thermistor.
But constantly perfect along with development of science and technology progress and ceramic thermal resistance technology, the upgrading of product need develop to microminiature, thereby satisfies the development trend that PCB surface is installed super-high density.
Recently by chip manufacturing rectangularity shape is formed a kind of in-line arrangement device.It comprises two thermistor chips and two pair electrode slices corresponding with it.Two electrode slice opposing parallel thirty years of age of each thermistor chip, electrode slice and chip are fixing to weld, and adopt top cap type or T font insulator that two thermistor chips are bonded into an integral body.
Dislocation can appear in this structure pad on its four leading foots and PCB (printed circuit board (PCB)) plate in actual use, causes bad contact.This is because one be that its top cover insulator or T font insulator all do not have rational location notch or location hole, can cause the leading foot location dimension inaccurate.Next is that its production technology has many inconvenience: first in its technology assembling process, the insulator of its head portion and T font insulator can't be located well with chip, second, if locate exactly, must make the frock mould, its chip and insulator are accurately located, this sampling technology has just brought on the technology loaded down with trivial details, increased manufacturing cost, so its defective is clearly.
Summary of the invention
In order to overcome above-mentioned defective, the purpose of this utility model is to carry and a kind ofly can guarantees that reliable contact is used in communication apparatus, has solved on the technology unnecessary loaded down with trivial detailsly again, and further improves the ceramic thermistor structure of equivalent erection space.
A kind of microminiature ceramic thermistor structure provided by the utility model, comprise a T font insulator of forming by transverse part and vertical part, two resistance chips that parallel upright is placed, all there is a pair of relative thirty years of age electrode slice on each chip two sides, and the electrode of each electrode slice and resistance chip paste the part be welded, it is characterized in that: the transverse part inboard of the described T font insulator detent that two and each are complementary with the top of resistance chip respectively that be arranged in parallel, described two resistance chips are embedded in respectively in this groove and are bonding in aggregates.
In above-mentioned microminiature ceramic thermistor structure, the middle part, vertical part of T font insulator is provided with a parallel spacing block that the electrode slice that is provided with on two chip forward surfaces is kept apart.
In above-mentioned microminiature ceramic thermistor structure, T font insulator adopts the industrial glue with hot setting performance with being connected of resistance chip.
In above-mentioned microminiature ceramic thermistor structure, T font insulator can adopt ceramic material or high-temperature resistance plastice to make.
In above-mentioned microminiature ceramic thermistor structure, two resistance chips use as one group of coupling through the resistance pairing
Owing to adopted above-mentioned technical solution, the utility model can guarantee that reliable contact is used in communication apparatus, solved on the technology unnecessary loaded down with trivial details again, rely on its exclusive insulator once to assemble success, can accurately locate, and further improve the ceramic thermistor structure of equivalent erection space.The utility model has guaranteed the transmission objective on the communication line, can be used for extensive automation surface assembling again, has dwindled the equivalent erection space on printed substrate greatly, and installing for the super-high density of wiring board provides certain reliability.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a perspective exploded view of the present utility model.
Embodiment
Shown in Fig. 1～2, the utility model ceramic thermistor, the resistance chip 2 that comprises a T font insulator of being formed by transverse part 31 and vertical part 32 3, two parallel placements of vertical type, each resistance chip 2 double-sided electrode all has a pair of relative thirty years of age electrode slice 1, and the electrode of each electrode slice 1 and resistance chip 2 pastes part and is welded.
Two independent resistance chips 2 inboard by T font insulator transverse part 31, two detents 4 that be arranged in parallel, and each detent 4 is complementary with the top of resistance chip 2 respectively, resistance chip 2 is embedded in the detent 4, makes insulator 3 and two resistance chips 2 be bonded into as a whole.The arrangement of such two resistance chips is the parallel placement of in-line arrangement.
The middle part of T font insulator vertical part 32, be provided with a parallel spacing block 5 that the electrode slice 1 that is provided with on two chip 2 forward surfaces is kept apart, thereby make these two electrode slices 1 pin the location fully, like this, relative thirty years of age parallel to each other of four pole piece 1 exits of two resistance chips 2, and, make it four pin coplanes perpendicular to whole standing surface, guaranteed that four pole pieces effectively weld with pcb board to contact.
In sum, the utility model adopts by insulator two independently individually is combined into two adjacent parallel vertical type integral body.Two independently the resistance chip a pair of in-line arrangement leading foot is all arranged, make leading foot paste and closely contact through welding, four downward parallel moulding of leading foot, and perpendicular to whole standing surface with the resistance chip.The utility model makes four whole leading foot coplanes, is applicable to that automation in enormous quantities surface mounts, and saves the Equivalent Surface erection space of wiring board to greatest extent.
Above embodiment is only for the usefulness that the utility model is described, but not to restriction of the present utility model, person skilled in the relevant technique, under the situation that does not break away from spirit and scope of the present utility model, can also make various conversion or modification, so all technical schemes that are equal to should belong within the category of the utility model claim also.
Claims (5)
1. microminiature ceramic thermistor structure, comprise a T font insulator of forming by transverse part and vertical part, two resistance chips that parallel upright is placed, all there is a pair of relative thirty years of age electrode slice on each chip two sides, and the electrode of each electrode slice and resistance chip paste the part be welded, it is characterized in that: the transverse part inboard of the described T font insulator detent that two and each are complementary with the top of resistance chip respectively that be arranged in parallel, described two resistance chips are embedded in respectively in this groove and are bonding in aggregates.
2. microminiature ceramic thermistor structure according to claim 1 is characterized in that: the middle part, vertical part of described T font insulator is provided with a parallel spacing block that the electrode slice that is provided with on two chip forward surfaces is kept apart.
3. microminiature ceramic thermistor structure according to claim 1 is characterized in that: described T font insulator adopts the industrial glue with hot setting performance with being connected of resistance chip.
4. microminiature ceramic thermistor structure according to claim 1 is characterized in that: described T font insulator adopts ceramic material to make.
5. microminiature ceramic thermistor structure according to claim 1 is characterized in that: described T font insulator adopts high-temperature resistance plastice to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520042974 CN2840279Y (en) | 2005-06-29 | 2005-06-29 | A kind of microminiature ceramic thermistor structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520042974 CN2840279Y (en) | 2005-06-29 | 2005-06-29 | A kind of microminiature ceramic thermistor structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2840279Y true CN2840279Y (en) | 2006-11-22 |
Family
ID=37428258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520042974 Expired - Fee Related CN2840279Y (en) | 2005-06-29 | 2005-06-29 | A kind of microminiature ceramic thermistor structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2840279Y (en) |
-
2005
- 2005-06-29 CN CN 200520042974 patent/CN2840279Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |