CN2831719Y - Interference resistance snap - Google Patents
Interference resistance snap Download PDFInfo
- Publication number
- CN2831719Y CN2831719Y CN 200520045324 CN200520045324U CN2831719Y CN 2831719 Y CN2831719 Y CN 2831719Y CN 200520045324 CN200520045324 CN 200520045324 CN 200520045324 U CN200520045324 U CN 200520045324U CN 2831719 Y CN2831719 Y CN 2831719Y
- Authority
- CN
- China
- Prior art keywords
- shell fragment
- joint face
- arc joint
- interference shell
- interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an interference resisting elastic sheet, which comprises an upper welding surface of a plane, a lower welding surface of a plane, and an arc connecting surface connecting the upper welding surface with the lower welding surface to form a closed structure, wherein the arc connecting surface connects the upper welding surface with the lower welding surface to form the closed structure, other components can not be hooked in a using process, and the arc connecting surface has uniform stress, and thus, the breaking situation of the elastic sheet caused by over-stress concentration can not be caused.
Description
[technical field]
The utility model relates to a kind of anti-interference shell fragment of anti-interference shell fragment, particularly a kind of surperficial adhesive type.
[background technology]
Because the height of electronics and IT products is evolved, arithmetic speed improves constantly, and structural requirement is compact, so that the area of printed circuit board (PCB) must dwindle the raising that the parts density that put on the surface is relative, the increase that has caused product electromagnetism wave amplitude to penetrate accordingly.In order to cooperate the requirement of appearance and modeling, the shape of printed circuit board (PCB) also must and then change; In order to simplify the operation of assembling, the use amount of screw also significantly reduces simultaneously, has limited and has reduced the effective ways that the electromagnetism wave amplitude is penetrated.For the width of cloth of the common-mode noise that reduces printed circuit board (PCB) is penetrated, just must reduce the impedance of its ground plane layer, effective method is exactly the metal shell that the ground plane layer of printed circuit board (PCB) is connected to product with abundant tie point; Just as the metal shell that is connected to product with abundant screw.But often operation or the structural restriction in order to simplify assembling can't design abundant screw hole position, therefore develops EMI (ElectroMagnetic Interference, EMI) this part of shell fragment.
The EMI shell fragment of volume production is applied in the printed circuit board (PCB) for easy for installation reaching widely on the market at present, mostly be designed to the model of can the surface pasting, so automatically, SMT equipment is welded on the printed circuit board (PCB), significantly reduces the inconvenience of artificial hand weldering and assembles man-hour with minimizing.
As shown in Figure 1, present surperficial adhesive type EMI shell fragment is easy to collude mutually with other assembly in the process of transporting or the process of storage and pulls after being assembled in printed circuit board (PCB), causes coming off or the damage of other assembly of shell fragment; More likely in the process that printed circuit board (PCB) is assembled in casing because collude and pull and come off, if the operator of assembling is not noted causing system short-circuit and product is burnt.
In addition, if the improper or excessive application of force of angle of the present surperficial adhesive type EMI shell fragment application of force is very likely in the fracture of the stress point of corner, just and the part of fracture can drop and causes short circuit to burn product in printed circuit board (PCB).
In view of the foregoing, necessary existing anti-interference shell fragment is improved, to overcome defective of the prior art.
[utility model content]
The purpose of this utility model is to provide a kind of assembling reliable and non-damageable anti-interference shell fragment.
The purpose of this utility model is achieved through the following technical solutions: a kind of anti-interference shell fragment, and it comprises the last solder side on plane and the following solder side on plane, it also comprises the connection arc joint face of solder side formation closing structure up and down.
Compared with prior art, the utility model since the arc joint face up and down solder side be connected to form closing structure, can not exist existing shell fragment to collude the phenomenon of pulling with other elements, make the shell fragment difficult drop-off, installation is reliably.And the arc joint face is when stressed, and stress point can be too unconcentrated, can not produce stress and concentrate and the situation of fracture.
[description of drawings]
Fig. 1 is the structural representation of existing shell fragment.
Fig. 2 is the structure chart of first execution mode of the anti-interference shell fragment of the utility model.
Fig. 3 is the structure chart of second execution mode of the anti-interference shell fragment of the utility model.
Fig. 4 is the structure chart of the 3rd execution mode of the anti-interference shell fragment of the utility model.
Fig. 5 is the vertical view of first execution mode.
[embodiment]
See also shown in Figure 2, anti-interference shell fragment first execution mode of the utility model, the following solder side 12 that it comprises the last solder side 11 that is the plane and is the plane, it is middle that what connect upper and lower solder side 11,12 is spherical circular arc joint face 13.This sphere circular arc joint face 13 is connected to form upper and lower solder side the hollow sphere structure of sealing.Please in conjunction with shown in Figure 5, cutting forms equally distributed eight cutting seams 14 to strengthen the elastic force of joint face 13 on spherical circular arc joint face.Every the cutting seam is 1/2 of sphere diameter length.Whole shell fragment is made by the beryllium copper material.Upper and lower solder side 11,12 is smooth plane, and an end is in order to being welded on the printed circuit board (PCB), the other end in surperficial taping process as the absorption plane of vacuum suction.
See also shown in Figure 3, because spherical shell fragment occupation space is bigger, also can adopt second execution mode of the anti-interference shell fragment of the utility model, it comprises draws together last solder side 21 that is the plane and the following solder side 22 that is the plane, and what the centre connected upper and lower solder side 21,22 is oval spherical circular arc joint face 23.The spherical circular arc joint face 23 of this ellipse is connected to form upper and lower solder side the oval spherical structure of hollow of sealing.Same cutting forms equally distributed some cutting seams 24 on the spherical circular arc joint face of ellipse.Whole shell fragment is made by the beryllium copper material.Upper and lower solder side 21,22 is smooth plane, and an end is in order to being welded on the printed circuit board (PCB), the other end in surperficial taping process as the absorption plane of vacuum suction.
See also shown in Figure 4, aforementioned solder side up and down is if area is not enough, also can adopt the 3rd execution mode of the anti-interference shell fragment of the utility model, it comprises draws together last solder side 31 that is the plane and the following solder side 32 that is the plane, and what the centre connected upper and lower solder side 31,32 is oval spherical circular arc joint face 33.Owing to increase the area of upper and lower solder side, the spherical circular arc joint face 33 of this ellipse is connected to form upper and lower solder side the hollow near cylindrical structure of sealing.Same cutting forms equally distributed some cutting seams 34 on the spherical circular arc joint face 33 of ellipse.Whole shell fragment is made by the beryllium copper material.Upper and lower solder side 31,32 is smooth plane, and an end is in order to being welded on the printed circuit board (PCB), the other end in surperficial taping process as the absorption plane of vacuum suction.
Certainly, also can will cut the width expansion of seam and form incoherent circular arc joint face at other execution modes.
Shell fragment of the present utility model and since the arc joint face up and down solder side be connected to form closed structure, can in use not collude and pull other elements, this arc joint face is stressed evenly simultaneously, can not cause stress too to concentrate so that the situation of shell fragment fracture.
Claims (9)
1. anti-interference shell fragment, it comprises welding plane and welding plane down, it is characterized in that: it also comprises and connects the arc joint face that solder side up and down forms closing structure.
2. anti-interference shell fragment as claimed in claim 1 is characterized in that: aforementioned arc joint face is a spheroidal.
3. anti-interference shell fragment as claimed in claim 1 is characterized in that: aforementioned arc joint face is for oval spherical.
4. anti-interference shell fragment as claimed in claim 1 is characterized in that: offer several cutting seams on aforementioned arc joint face.
5. anti-interference shell fragment as claimed in claim 4 is characterized in that: aforementioned cutting seam is for being uniformly distributed on the arc joint face.
6. anti-interference shell fragment as claimed in claim 1 is characterized in that: this anti-interference shell fragment is made by the beryllium copper material.
7. anti-interference shell fragment as claimed in claim 1 is characterized in that: this arc joint face is connected to form upper and lower welding plane the hollow sphere structure of sealing.
8. anti-interference shell fragment as claimed in claim 1 is characterized in that: this arc joint face is connected to form upper and lower welding plane the oval spherical structure of hollow of sealing.
9. anti-interference shell fragment as claimed in claim 1 is characterized in that: this arc joint face is connected to form upper and lower welding plane the hollow cylindrical structure of sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520045324 CN2831719Y (en) | 2005-09-27 | 2005-09-27 | Interference resistance snap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520045324 CN2831719Y (en) | 2005-09-27 | 2005-09-27 | Interference resistance snap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2831719Y true CN2831719Y (en) | 2006-10-25 |
Family
ID=37136639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520045324 Expired - Fee Related CN2831719Y (en) | 2005-09-27 | 2005-09-27 | Interference resistance snap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2831719Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109507182A (en) * | 2018-12-04 | 2019-03-22 | 罗永学 | A kind of soil acidity or alkalinity is unbalance testing equipment and its application method |
-
2005
- 2005-09-27 CN CN 200520045324 patent/CN2831719Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109507182A (en) * | 2018-12-04 | 2019-03-22 | 罗永学 | A kind of soil acidity or alkalinity is unbalance testing equipment and its application method |
| CN109507182B (en) * | 2018-12-04 | 2021-07-30 | 中山市中能检测中心有限公司 | Soil pH value imbalance detection equipment and use method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061025 Termination date: 20130927 |