CN2821681Y - Power supplier with cooling function - Google Patents
Power supplier with cooling function Download PDFInfo
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- CN2821681Y CN2821681Y CN 200520104040 CN200520104040U CN2821681Y CN 2821681 Y CN2821681 Y CN 2821681Y CN 200520104040 CN200520104040 CN 200520104040 CN 200520104040 U CN200520104040 U CN 200520104040U CN 2821681 Y CN2821681 Y CN 2821681Y
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- power supply
- supply unit
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- fan
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- 238000001816 cooling Methods 0.000 title claims abstract description 53
- 238000012545 processing Methods 0.000 claims description 24
- 238000005057 refrigeration Methods 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
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- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to a power supplier with a cooling function. The utility model comprises a casing of the power supplier, a refrigerating chip and a cold side heat radiation component, wherein the refrigerating chip is arranged at a surface provided mouth of the refrigerating chip on the casing of the power supplier and is provided with a cold side and a hot side. The hot side is convex out of the inner part of the casing of the power supplier. The cold side is coupled with the cold side heat radiation component which is convex out of the outer part of the casing of the power supplier. The cold side heat radiation component is used for promoting the heat exchange of the cold side.
Description
Technical field
The utility model relates to a kind of power supply unit, and particularly relevant for a kind of power supply unit with refrigerating function.
Background technology
The power source approach of electronic installation generally is to be delivered to socket by the generating plant, and power supply unit is connected on the socket, is primarily aimed at alternating current and carries out treatment schemees such as rectification, transformation and filtering, offers each device at last again.Especially in computer system, it supplies the power supply of most devices running institute palpus simultaneously.The position of power supply unit, general design is near CPU (central processing unit), and power supply unit and CPU (central processing unit) (central processing unit; CPU) the two does not have reciprocation usually, is to be independent running separately.
The CPU (central processing unit) running time can produce a large amount of heat energy, therefore is equipped with a heat abstractor usually, and a CPU radiator fan for example is too high and cause the situation of component failure to reduce Yin Wendu.Under the situation that above-mentioned power supply unit and CPU (central processing unit) independently operate, the air-flow that the CPU radiator fan attracts to be used for to cool off CPU (central processing unit) is from computer system inside, yet this has attracted airflow influence for the effect of CPU (central processing unit) cooling, if this attracts the temperature of air-flow low more, must be good more on cooling effect.The environment temperature of inside be because inner member can produce heat during general computer system running, thereby temperature is than ambient temperature, or claims that room temperature be a height, also so only relies on cpu fan to come that the CPU (central processing unit) temperature reduction way is had its restriction.
This shows that above-mentioned existing power supply unit obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that power supply unit exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of power supply unit of new structure, just become the current industry utmost point to need improved target with refrigerating function.
Because the defective that above-mentioned existing power supply unit exists, the design people is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of power supply unit of new structure with refrigerating function, can improve general existing power supply unit, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the utility model that has practical value finally.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing power supply unit exists, and provide a kind of power supply unit of new structure with refrigerating function, technical matters to be solved is to make it not only have the function of power supply supply, the function that cooling effect is provided is more arranged, thereby be suitable for practicality more.
Another purpose of the present utility model is, a kind of power supply unit with refrigerating function is provided, and technical matters to be solved is to make it in general computer system configuration frame, strengthens the radiating efficiency for CPU (central processing unit), thereby is suitable for practicality more.
The purpose of this utility model and to solve its technical matters be to adopt following technical scheme to realize.According to a kind of power supply unit with refrigerating function that the utility model proposes, it comprises at least: a power supply unit housing has a refrigeration wafer face opening is set; One refrigeration wafer is installed in this cooling wafer the face opening is set, and has a cold side and a heat example, the side-prominent inside to this power supply unit housing of this heat; And a cold side radiating component radiating component, coupling and project to the outside of this power supply unit housing with this cold side, the air with the power supply unit outside carries out heat interchange by this, reduces the temperature of outside air.
The purpose of this utility model and solve its technical matters and also can adopt following technical measures further to realize.
Aforesaid power supply unit with refrigerating function, it more comprises a hot lateral fin sheet, is coupled to this hot side.
Aforesaid power supply unit with refrigerating function, it more comprises a thermal-arrest cavity and one first fan, this power supply unit housing more comprises an outside opening and an inside opening, this thermal-arrest cavity has a first passage opening and a second channel opening, this first fan is positioned at this first passage opening, and in abutting connection with this outside opening, this second channel opening is adjacent to this inside opening, in order to the heat of concentrating this hot side to disperse, and with this thermal steering to one external environment condition.
Aforesaid power supply unit with refrigerating function, it more comprises a tinfoil paper, is attached at the inside of this thermal-arrest cavity.
Aforesaid power supply unit with refrigerating function, it more comprises a temperature control die set, be connected with a fan power supply, this temperature control die set comprises a temperature-sensitive sticker and a temperature regulator at least, this temperature-sensitive sticker sensing one temperature information, and this temperature information is passed to this temperature regulator, this temperature regulator is regulated a power supply supply of this fan power supply according to this temperature information, to control a rotating speed of this fan.
Aforesaid power supply unit with refrigerating function, it more comprises a humidity control die set, be connected with a refrigeration wafer power supply, this humidity control die set comprises a humidity sensor and a humidistat at least, this humidity sensor sensing one humidity information, and this humidity information is passed to this humidistat, this humidistat is regulated a power supply supply of this cooling wafer power supply according to this humidity information, to control an output power of this cooling wafer.
Aforesaid power supply unit with refrigerating function, wherein said humidity sensor are arranged in this cold side radiating component and the formed slit of this power supply unit housing.
Aforesaid power supply unit with refrigerating function, wherein said cold side radiating component has a sunk structure, and this sunk structure has a projection.
Aforesaid power supply unit with refrigerating function, wherein said cold side radiating component comprises a pedestal, a linking part and a radiator, and this pedestal is coupled in this cold side, and this linking part is connected in this pedestal, and this radiator is coupled in this linking part.
Aforesaid power supply unit with refrigerating function, a wherein said cold side radiating component part is coated in the CPU (central processing unit) heat radiator.
The utility model compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, the utility model relates to a kind of power supply unit with refrigerating function, comprises a power supply unit housing, a refrigeration wafer and a cold side radiating component.The cooling wafer that cooling wafer is installed on the power supply unit housing is provided with the face opening, has cold side and hot side.Hot pleurapophysis is for the inside of power supply unit housing, and cold side couples the cold side radiating component, and the cold side radiating component projects to the outside of power supply unit housing, in order to promote the heat interchange of cold side.
By technique scheme, the power supply unit that the utlity model has refrigerating function has following advantage at least:
Power supply unit of the present utility model has reached when using power supply unit by integrating cooling wafer, the function of cooling system internal temperature additionally is provided, especially under existing most computer framework, the position of power supply unit installing has belonged to normalization, the utility model has made full use of existing normalized power supply unit configuration, the CPU (central processing unit) fan is drawn through heat interchange, thereby air-flow in the system of lower temperature is arranged, also therefore promoted cooling effectiveness to CPU (central processing unit).
In sum, the power supply unit with refrigerating function of the utility model special construction, the function that not only has the power supply supply, the function that cooling effect is provided is more arranged, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing power supply unit has the multinomial effect of enhancement, thereby is suitable for practicality more, really is a novelty, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1A is the exploded view that illustrates according to this novel power supply unit one preferred embodiment.
Figure 1B is the plan view that illustrates according to a part of assembly in this novel power supply unit one preferred embodiment.
Fig. 2 A is the synoptic diagram that illustrates according to temperature control system in this novel another preferred embodiment of power supply unit.
Fig. 2 B is the synoptic diagram that illustrates according to moisture control system in this novel another preferred embodiment of power supply unit.
Fig. 3 illustrates to use this novel power supply unit in the synoptic diagram of a computer system.
Fig. 4 A is the synoptic diagram that illustrates according to cold survey radiating component in this novel another preferred embodiment of power supply unit.
Fig. 4 B is the synoptic diagram that illustrates cold another aspect of survey radiating component among the 4A figure.
100: power supply unit housing 100a: first cover plate
100b: the second cover plate 102a: first outside opening
102b: second outside opening 104: inside opening
106: cooling wafer is provided with face opening 108: cooling wafer is provided with face
110: power-supply unit 112: circuit module
114: power supply unit fan 120: cooling wafer
122: cold side 124: hot side
130: cold side radiating component 132: sunk structure
134: projection 136: hot lateral fin sheet
140: thermal-arrest cavity 142: cavity wall
144: thermal-arrest passage 144a: first passage opening
144b: second channel opening 146: connect sidewall
148: aluminium foil 150a: first fan
150b: second fan 160: slit
170: control circuit board 174: the power supply unit switch
176: cooling wafer switch 180: light-emitting device
210a: temperature control die set 210b: humidity control die set
212a: temperature-sensitive sticker 212b: humidity sensor
214a: temperature regulator 214b: humidistat
230a: fan power supply 230b: cooling wafer power supply
240a: fan 240b: cooling wafer
300: casing 310: power supply unit
312: cooling wafer 314: the cold side radiating component
320: motherboard 330:CPU fan
340: system airflow 402: pedestal
404: linking part 406: radiator
406a: terminal 408: rotating disk
414: the second rotation directions of 412: the first rotation directions
420: cooling wafer 422: cold side
430: through hole 470: CPU (central processing unit)
The 472:CPU heat radiator
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of the power supply unit with refrigerating function, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
The utility model is the power supply unit that has refrigerating function for a kind of, by the integration of a refrigeration wafer and power supply unit, has more added the function of cooling system air-flow outside the function of power supply supply.
Please consult simultaneously shown in Figure 1A and the 1B, Figure 1A is the exploded view that illustrates according to this novel power supply unit one preferred embodiment, and Figure 1B is the plan view that illustrates according to a part of assembly in this novel power supply unit one preferred embodiment.Power supply unit with refrigerating function of the present utility model mainly comprises a power supply unit housing 100, a refrigeration wafer 120 and a cold side radiating component 130.Power supply unit housing 100 has a refrigeration wafer face opening 106 is set.Cooling wafer 120 is installed in cooling wafer and face is set opens 106, have a cold side 122 and a hot side 124, hot side 124 projects to the inside of power supply unit housing 100, cold side radiating component 130 couples with cold side 122, and project to the outside of power supply unit housing 100, in order to quicken the heat interchange of cold side 122.
In a preferred embodiment, power supply unit comprises a power supply unit housing 100, a power-supply unit 110 and a thermal-arrest cavity 140, power supply unit housing 100 is cooperated with one second cover plate 100b by one first cover plate 100a and constitutes, the second cover plate 100b has one first outside opening 102a, one second outside opening 102b and an inside opening 104, and wherein the second outside opening 102b has a reticulate texture.Power-supply unit 110 is arranged at power supply unit housing 100 inside, comprise a power supply unit fan 114 and a circuit module 112, power supply unit fan 114 is installed on this circuit module 112, for example is positioned at the position at edge, and in abutting connection with or protrude in the first outside opening 102a.The startup of one power supply unit switch, 174 control power supply units and/or power supply unit fan 114, for example when power supply unit started, power supply unit fan 114 is running simultaneously also.
Thermal-arrest cavity 140 has a thermal-arrest passage 144, and its two ends are a first passage opening 144a and a second channel opening 144b, respectively in abutting connection with or protrude in the second outside opening 102b and inside opening 104.Have a refrigeration wafer on the first cover plate 100a face 108 is set, cooling wafer is provided with face 108 and offers a refrigeration wafer face opening 106 is set, and cooling wafer 120 is positioned at this refrigeration wafer face opening 106 is set.The cold side 122 of cooling wafer 120 couples a cold side radiating component 130, and this cold side radiating component 130 is preferable to have at least one sunk structure 132, more comprises a projection 134 in sunk structure 132, accumulates more multi-freezing pipe energy by this.
The hot side 124 of cooling wafer 120 more couples a hot lateral fin sheet 136, protrude in the internal range of power supply unit housing 100, preferably, comprise that more one connects sidewall 146, be coupled with cavity wall 142, in order to hot lateral fin sheet 136 is shrouded, heat is concentrated in the thermal-arrest passage 144, reduce even prevent that heat from dissipating to power-supply unit 110.More preferably, connect sidewall 146 and/or the adiabatic material of cavity wall 142 uses.Aluminium foil 148 more can be laid in thermal-arrest cavity 140 inside, strengthens preventing photothermal dispersing.
Thermal-arrest cavity 140 both ends open 144a, 144b are provided with one first fan 150a and one second fan 150b more respectively, and the first fan 150a is arranged at first passage opening 144a, and the second fan 150b is arranged at second channel opening 144b.The second fan 150b is except drawing the computer system internal gas flow to thermal-arrest passage 144, and the thermal current in the thermal-arrest of the help promotion simultaneously passage 144 is towards the first fan 150a, and the first fan 150a then discharges the thermal currents in the thermal-arrest passage 144 outside system.
The power supply unit refrigeration wafer switch 176 of can arranging in pairs or groups, control cooling wafer 120 startup or close, and be connected to a light-emitting device 180 with a circuit, when cooling wafer switch 176 is in opening, that is its electronic circuit is connected, light-emitting device 180 is also connected and luminous simultaneously, the unlatching of prompting user cooling wafer 120.
When power supply unit was installed on a system, two outside opening 102a, 102b were towards external environment condition, and inside opening 104 is towards the internal system environment.Be installed in the computer system, it is near CPU (central processing unit) (not shown) that cooling wafer is provided with face 108.
See also shown in Fig. 2 A and the 2B, it illustrates the synoptic diagram according to temperature control system in this novel another preferred embodiment of power supply unit and moisture control system respectively.Power supply unit of the present utility model is more integrated a temperature control die set 210a and a humidity control die set 210b, constitutes a temperature control system and a moisture control system.Temperature control die set 210a monitoring of environmental temperature, and, for example set one or more snippets temperature standard according to environment temperature control fan power supply 230a, correspond to different rotation speeds of the fan, to reduce the noise of fan 240a running.
Temperature control die set 210a comprises a temperature-sensitive sticker 212a and a temperature regulator 214a in the present embodiment.Temperature-sensitive sticker 212a sensing one environment temperature, for example be arranged near the hot lateral fin sheet or on it, temperature-sensitive sticker 170b shown in Figure 1B, the sensed temperature information is passed to temperature regulator 214a, temperature regulator 214a regulates the power supply supply condition of fan power supply 230a according to this temperature information, for example raise or the reduction curtage, and then the rotating speed of control fan 240a.
The humidity information of humidity control die set 210b monitoring system, for example relative humidity.Because when relative humidity reaches 100%, have the dew point effect, relative humidity is high more, dewpoint temperature is high more, so humidity control die set 210b regulates the power supply supply of cooling wafer power supply 230b for cooling wafer 240b according to the detect humidity information that obtains.Ambient humidity is high more when detecting, and humidity control die set 210b just regulates cooling wafer power supply 230b, and the output power of cooling wafer 240b is descended, and prevents that temperature from crossing low and arrive dewpoint temperature.
Humidity control die set 210b comprises a humidity sensor 212b and a humidistat 214b in the present embodiment, humidity sensor 212b sensing one humidity information, preferably, shown in Figure 1B, humidity sensor 170a is arranged in cold side radiating component 130 and the formed slit 160 of the first cover plate 100a, for example be attached to the first cover plate 100a or cold side radiating component 130, herein because the singularity of structure has lower temperature usually.Humidistat 214b accepts and regulates cooling wafer power supply 230b according to this humidity information the power supply of cooling wafer 240b is supplied with, and the power of cooling wafer 240b is changed.
Above-mentioned cooling wafer power supply and fan power supply can utilize power-supply unit as power source, and independently supply unit is perhaps respectively arranged, this be have the knack of in this skill person can think easily and simple change.In the present embodiment, humidity control die set and temperature control die set are integrated on the control circuit board 170 (being illustrated in Figure 1A).
See also shown in Figure 3ly, it illustrates uses this novel power supply unit in the synoptic diagram of a computer system.When power supply unit of the present utility model is applied to a computer system, vertical type desktop (desktop) computer for example, the position of power supply unit 310 is near the top of casing 300, and ornaments direction be for: a side at cold side radiating component 314 places is the top of cpu fan 330 among the figure towards cpu fan 330.During cooling wafer 312 runnings, the cold side heat absorption reduces environment temperature, 314 of cold side radiating components have been strengthened the heat interchange of contiguous system airflow 340, therefore the cpu fan 330 on the motherboard 320 at extraction system air-flow 340 when carrying out the cooling to CPU (central processing unit), system airflow 340 parts come from the cold side ambient air that has carried out heat interchange with cold side radiating component 314 thereby lower temperature is arranged, and therefore the cooling effect of CPU (central processing unit) significantly promotes.
See also shown in Fig. 4 A, it illustrates the synoptic diagram of cold survey radiating component in this novel another preferred embodiment of power supply unit.In another preferred embodiment, the cold side radiating component forms a structure of extending near CPU (central processing unit) 470, comprises a pedestal 402, a linking part 404 and a radiator 406.Pedestal 402 is coupled in the cold side 422 of cooling wafer 420, and linking part 404 is connected in pedestal 402, preferably, is connected in the pivot joint mode, makes linking part 404 carry out a left-right rotation with respect to pedestal 402, i.e. first rotation direction 412.Radiator 406 is coupled in linking part 404, and can rotate with respect to linking part 404, as second rotation direction 414 of figure.Above-mentioned rotation is with a rotating disk 408 controls.
The terminal 406a of the radiator of radiator 406 forms one and has the structure of through hole 430, promotes cold and hot exchange.The cold side radiating component is made with a good thermal conductive material, and preferable outside surface at pedestal 402, linking part 404 and a part of radiator 406 is coated with the usefulness of a leather dope as thermal insulation, makes low-temperature receiver concentrate on the terminal 406a of radiator and distributes.The low-temperature receiver of cold side 422 is through pedestal 402 and linking part 404, reach radiator 406 at last, to make in the system effect of cooling draught concentrate on more around the CPU (central processing unit) 470 by this kind cold side radiating component, and make the cooling effect of CPU (central processing unit) 470 better.
See also shown in Fig. 4 B, it illustrates the synoptic diagram of cold another aspect of survey radiating component among Fig. 4 A.Embodiment according to Fig. 4 A, cold another aspect of survey radiating component is, radiator 406 more is coupled in the CPU radiating fin 472 on the CPU (central processing unit) 470, for example the terminal 406a of radiator is coated on CPU radiating fin 472 inside, directly low-temperature receiver is imported CPU radiating fin 472, the low-temperature receiver that cooling wafer 420 is produced cools off CPU radiating fin 472 in the most direct mode, for a cooling effect lifting greatly especially of CPU (central processing unit) 470.Wherein the terminal 406a of radiator can utilize good thermal conductive material to be packaged into bundle with the filament kenel, so be easier to adjust its expanded range, for example with copper wire or aluminium wire with adiabatic and flexible material packing, and expose a part and make it be coated on CPU radiating fin 472 inside.
By above-mentioned novel preferred embodiment as can be known, use the originally novel following advantage that has.Power supply unit of the present utility model is by integrating a refrigeration wafer, additionally has the function of cooling system internal gas flow when making the computer system running, and then the air-flow that the fan that makes CPU (central processing unit) is drawn is a low-temperature airflow, therefore improved the radiating efficiency for CPU (central processing unit).More reach and prevent that dewpoint temperature from producing, and improves the security that device uses by the cooperation of moisture control system.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1, a kind of power supply unit with refrigerating function is characterized in that it comprises at least:
One power supply unit housing has a refrigeration wafer face opening is set;
One refrigeration wafer is installed in this cooling wafer the face opening is set, and has a cold side and a hot side, the side-prominent inside to this power supply unit housing of this heat; And
One cold side radiating component radiating component couples and projects to the outside of this power supply unit housing with this cold side.
2, power supply unit according to claim 1 is characterized in that it more comprises a hot lateral fin sheet, is coupled to this hot side.
3, power supply unit according to claim 1, it is characterized in that it more comprises a thermal-arrest cavity and one first fan, this power supply unit housing more comprises an outside opening and an inside opening, this thermal-arrest cavity has a first passage opening and a second channel opening, this first fan is positioned at this first passage opening, and in abutting connection with this outside opening, this second channel opening is adjacent to this inside opening, in order to the heat of concentrating this hot side to disperse, and with this thermal steering to one external environment condition.
4, power supply unit according to claim 3 is characterized in that it more comprises a tinfoil paper, is attached at the inside of this thermal-arrest cavity.
5, power supply unit according to claim 3, it is characterized in that it more comprises a temperature control die set, be connected with a fan power supply, this temperature control die set comprises a temperature-sensitive sticker and a temperature regulator at least, this temperature-sensitive sticker sensing one temperature information, and this temperature information is passed to this temperature regulator, this temperature regulator is regulated a power supply supply of this fan power supply according to this temperature information, to control a rotating speed of this fan.
6, power supply unit according to claim 1, it is characterized in that it more comprises a humidity control die set, be connected with a refrigeration wafer power supply, this humidity control die set comprises a humidity sensor and a humidistat at least, this humidity sensor sensing one humidity information, and this humidity information is passed to this humidistat, this humidistat is regulated a power supply supply of this cooling wafer power supply according to this humidity information, to control an output power of this cooling wafer.
7, power supply unit according to claim 6 is characterized in that wherein said humidity sensor is arranged in this cold side radiating component and the formed slit of this power supply unit housing.
8, power supply unit according to claim 1 is characterized in that wherein said cold side radiating component has a sunk structure, and this sunk structure has a projection.
9, power supply unit according to claim 1, it is characterized in that wherein said cold side radiating component comprises a pedestal, a linking part and a radiator, this pedestal is coupled in this cold side, and this linking part is connected in this pedestal, and this radiator is coupled in this linking part.
10, power supply unit according to claim 1 is characterized in that a wherein said cold side radiating component part is coated in the CPU (central processing unit) heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520104040 CN2821681Y (en) | 2005-08-16 | 2005-08-16 | Power supplier with cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520104040 CN2821681Y (en) | 2005-08-16 | 2005-08-16 | Power supplier with cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2821681Y true CN2821681Y (en) | 2006-09-27 |
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ID=37018235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520104040 Expired - Fee Related CN2821681Y (en) | 2005-08-16 | 2005-08-16 | Power supplier with cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2821681Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100399242C (en) * | 2005-03-10 | 2008-07-02 | 中国科学院自动化研究所 | Distributed video processing device and method |
| CN105487625A (en) * | 2015-11-26 | 2016-04-13 | 国家电网公司 | Dampproof and dustproof computer CPU cooling fan |
-
2005
- 2005-08-16 CN CN 200520104040 patent/CN2821681Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100399242C (en) * | 2005-03-10 | 2008-07-02 | 中国科学院自动化研究所 | Distributed video processing device and method |
| CN105487625A (en) * | 2015-11-26 | 2016-04-13 | 国家电网公司 | Dampproof and dustproof computer CPU cooling fan |
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Granted publication date: 20060927 Termination date: 20090916 |