CN2816823Y - Microwave detecting device base on radiating substrate - Google Patents
Microwave detecting device base on radiating substrate Download PDFInfo
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- CN2816823Y CN2816823Y CN 200520079171 CN200520079171U CN2816823Y CN 2816823 Y CN2816823 Y CN 2816823Y CN 200520079171 CN200520079171 CN 200520079171 CN 200520079171 U CN200520079171 U CN 200520079171U CN 2816823 Y CN2816823 Y CN 2816823Y
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- heat
- substrate
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- detector diode
- medium substrate
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Abstract
The utility model relates to a microwave detecting device based on radiating substrates, which is provided with a heat conduction medium substrate, wherein a middle shaft line of the heat conduction medium substrate is provided with a front section of printing conductor and a rear section of printing conductor; a detector diode is arranged between the two sections of printing conductors; the input end of the detector diode is connected with the front section of printing conductor; the output end of the detector diode is connected with the rear section of printing conductor. Because the utility model uses a heat conduction medium substrate with good heat conduction coefficient as a carrier of the detector diode, and the detector diode carries out heat radiation through the carrier, the utility model not only has a large heat radiation area, but also has good heat radiation performance for materials. Therefore, the utility model can enhance heat radiation performance of the detector diode and improve bearing force for measured signal power. The maximum measured power of the utility model can achieve the W stage and the amplitude of output signals can achieve the V stage through actual measurement. Thus, one number stage is almost improved compared with the prior art. Therefore, the utility model can improve measured power and interference rejection of signals.
Description
Technical field
The utility model relates to a kind of microwave detector spare.Specifically, it is a kind of microwave detector spare based on heat dispersion substrate.
Background technology
In prior art, referring to Fig. 6, common microwave detector mainly comprises a coaxial configuration 11 and the microwave detector spare 12 that is located in this coaxial configuration, and wherein microwave detector spare is actually a semiconductor diode D.In actual microwave measurement, also be provided with resistance R, capacitor C and an inductance L in the coaxial configuration, wherein resistance R is used for the coupling with microwave input impedance, capacitor C and inductance L can also can replace with distributed capacitance and distributed inductance sometimes according to their parameter of different choice of tested microwave frequency.Its existing problem is: detector diode D does not possess good performance of heat dissipation, and this is caused by its physical construction.For example: it adopts physical construction as shown in Figure 7 usually, this structure has a minor axis 13 (referring to Fig. 8) that can be connected on the coaxial configuration heart yearn, on this minor axis, be provided with a sequin 14 that is used for installing and locating, described detector diode is contained on the sequin or is contained in the minor axis, location structure 15,16 in the coaxial configuration is clipped in the middle sequin, makes it axially obtain the location.Referring to Fig. 8,9, described sequin is sometimes also as slide glass, above aforementioned build-out resistor R and capacitor C can be integrated in.
Said structure is not considered the heat dissipation problem of detector diode D substantially, if heat radiation is arranged, dispels the heat by sequin yet, and not only its area of dissipation is little, and the thermal diffusivity of material also differs and reserve, so the heat dispersion of device is relatively poor.Because heat dispersion is bad, detection device is reduced the holding capacity of tested microwave signal power, generally its maximum is measured power about 0.1W, and the amplitude output signal maximum has only about 200mV, and antijamming capability is relatively poor.In addition, if measure the higher-wattage microwave of 10W, 100W or 1000W magnitude with this wave detector, need before it, to add one or more levels microwave attenuator, if attenuator configuration is bad, can influence measuring accuracy, when particularly adding multistage attenuator, simultaneously, also increased operation link, made measurement convenient inadequately.
The utility model content
The purpose of this utility model is at the shortcoming in the prior art, at first provide a kind of microwave detector device based on heat dispersion substrate that can improve measurement power and antijamming capability, next is an integrated level of utilizing heat dispersion substrate raising metering circuit, thus the simplified measurement link.
For achieving the above object, solution of the present utility model is as follows:
This microwave detector part has a heat-conducting medium substrate, on the axis of this heat-conducting medium substrate, be provided with forward and backward two sections printed circuit cables at least, and between these two sections printed circuit cables, be provided with a detector diode, the input end of described detector diode and leading portion printed circuit cable join, and its output terminal and back segment printed circuit cable join.
Above-mentioned heat-conducting medium substrate is advisable with the thick film or the thin film circuit substrate that adopt beryllia or aluminium oxide or aluminium nitride or low-carbon steel material to make.
On the end limit of two of above-mentioned heat-conducting medium substrates and parallel axes wherein, be provided with lead, and on this heat-conducting medium substrate, also be connected to build-out resistor R, capacitor C and inductance L.
The resistive layer of a horizontal cloth of serial connection on above-mentioned heat-conducting medium substrate leading portion printed circuit cable, and this resistive layer is across limit, the two ends lead of described substrate.
By above-mentioned solution as can be seen, the utility model has adopted a heat-conducting medium substrate with good coefficient of heat conductivity to make the carrier of detector diode, detector diode dispels the heat by this carrier, not only area of dissipation is big, and the heat dispersion of material might as well, so strengthened the heat dispersion of detector diode device greatly, improved holding capacity to measured signal power.Detector diode for same model, the amount of prior art is measured power greatly only for about 0.1W, the output amplitude of signal is about 200mV, and adopt this structure, and under equal conditions to measure, its maximum is measured power can reach the W level, the output amplitude of signal reaches the V level, improve nearly order of magnitude than prior art, therefore, improved the measurement power and the antijamming capability of signal greatly.Moreover, difference according to tested microwave power, the damping resistance network directly can be integrated on the heat-conducting medium substrate, not only simplified operation link, made things convenient for measurement, the more important thing is and to consider the problem of attenuation parameter and input impedance matching from integral body on the designs, thereby eliminate the influence of multistage decay, improve measuring accuracy measuring.
Description of drawings
Fig. 1, one-piece construction synoptic diagram of the present utility model.
Fig. 2, this detection device are installed in the structural representation in the coaxial configuration.
The A-A face structural representation of Fig. 3, Fig. 3.
Two of the one-piece construction synoptic diagram of Fig. 4, this detection device.
The rear view of Fig. 5, Fig. 5.
The measuring principle synoptic diagram of Fig. 6, existing coaxial wave detector.
The structural representation of Fig. 7, existing coaxial wave detector.
The enlarged diagram of Fig. 8, detection device physical construction.
The equivalent structure figure of Fig. 9, detection device (side view of Fig. 8).
Embodiment
Describe concrete structure of the present utility model in detail according to embodiment below.
Referring to Fig. 1, this detection device with a heat-conducting medium substrate 1 as slide glass, on the axis of substrate 1, be provided with leading portion printed circuit cable 2 and back segment printed circuit cable 3, between these two sections printed circuit cables, be provided with a detector diode 4, and the input end of this detector diode and leading portion printed circuit cable 2 join, and its output terminal and back segment printed circuit cable 3 join.Described substrate 1 can adopt thick film or thin film circuit substrate, and preferably adopts beryllia or aluminium oxide or aluminium nitride or low-carbon steel material making, to guarantee its good heat-conducting.The area of substrate 1 is very big, is several times of existing sequin, and material has good heat dispersion in addition, so can make detector diode 4 heat dispersions be much higher than prior art.
Referring to Fig. 2,3, because chip area is bigger, its mounting structure also differs widely with prior art.In coaxial configuration 6, be provided with a cylinder 5, the inwall two ends of cylinder 5 are respectively equipped with the substrate slot, substrate 1 is installed in the cylinder 5 by slot, and carry out the axial location of cylinder 5 by the locating piece in the coaxial configuration 7, wherein the heart yearn in the coaxial configuration 8 and 8 ' is conflicted with on-chip leading portion printed circuit cable and back segment printed circuit cable respectively and is joined.
Referring to Fig. 4,5, for aforesaid build-out resistor R, capacitor C and inductance L are arranged on the substrate 1, need the sideline, two ends of substrate 1 is provided with lead 9,9 ', they are used for being electrically connected with the shell of coaxial configuration, and then build-out resistor R, capacitor C and inductance L be located on the substrate 1, constitute the detection metering circuit.Can directly measure the higher-wattage microwave of different capacity in order to make this device, on the leading portion printed circuit cable 2 of this substrate, can be connected in series the resistive layer 10 of a horizontal cloth, that is to say, the middle part of leading portion printed circuit cable 2 is cut out one section, then will be with cutting out part wide resistive layer 10 be arranged in and cut out the position, and this resistive layer is across limit, two ends lead 9,9 ', in fact, this resistive layer forms a resistors match network at the signal input part of this wave detector, regulate the parameter of this resistive layer 10, can change the size of resistors match network values, can make the device of several corresponding specifications according to this, be used for measuring the higher-wattage microwave of several different capacities (as 10W, 100W, 1000W etc.).
Claims (4)
1, a kind of microwave detector spare based on heat dispersion substrate, it is characterized in that: it has a heat-conducting medium substrate (1), on the axis of this heat-conducting medium substrate, be provided with forward and backward two sections printed circuit cables (2), (3) at least, and between these two sections printed circuit cables, be provided with a detector diode (4), the input end of described detector diode (4) and leading portion printed circuit cable (2) join, and its output terminal and back segment printed circuit cable (3) join.
2, the microwave detector spare based on heat dispersion substrate according to claim 1 is characterized in that: described heat-conducting medium substrate (1) is thick film or the thin film circuit substrate that adopts beryllia or aluminium oxide or aluminium nitride or low-carbon steel material to make.
3, the microwave detector spare based on heat dispersion substrate according to claim 1 and 2, it is characterized in that: on two of described heat-conducting medium substrate (1) the end limits with parallel axes wherein, be provided with lead (9), (9 '), and on this heat-conducting medium substrate (1), also be connected to build-out resistor R, capacitor C and inductance L.
4, the microwave detector spare based on heat dispersion substrate according to claim 3, it is characterized in that: go up the resistive layer (10) that is connected in series a horizontal cloth at described heat-conducting medium substrate leading portion printed circuit cable (9), and this resistive layer is across limit, two ends lead (9), (9 ') of described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520079171 CN2816823Y (en) | 2005-08-01 | 2005-08-01 | Microwave detecting device base on radiating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520079171 CN2816823Y (en) | 2005-08-01 | 2005-08-01 | Microwave detecting device base on radiating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2816823Y true CN2816823Y (en) | 2006-09-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520079171 Expired - Fee Related CN2816823Y (en) | 2005-08-01 | 2005-08-01 | Microwave detecting device base on radiating substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2816823Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115598427A (en) * | 2022-12-14 | 2023-01-13 | 四川斯艾普电子科技有限公司（Cn） | Coupling detector based on thick film and thin film integration and implementation method thereof |
-
2005
- 2005-08-01 CN CN 200520079171 patent/CN2816823Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115598427A (en) * | 2022-12-14 | 2023-01-13 | 四川斯艾普电子科技有限公司（Cn） | Coupling detector based on thick film and thin film integration and implementation method thereof |
| CN115598427B (en) * | 2022-12-14 | 2023-03-14 | 四川斯艾普电子科技有限公司 | Coupling detector based on thick film and thin film integration and implementation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060913 Termination date: 20090901 |