CN2798500Y

CN2798500Y - Improved electronic ballast for fluorescent lamp

Info

Publication number: CN2798500Y
Application number: CN 200520042464
Authority: CN
Inventors: 杨长根; 杨怀慧
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-06-15
Filing date: 2005-06-15
Publication date: 2006-07-19
Anticipated expiration: 2015-06-15

Abstract

The utility model relates to an electronic ballast for a fluorescent lamp with an improved structure, which comprises electronic components and a basal plate. The utility model is characterized in that the electronic components are directly arranged on the basal plate. The utility model does not adopt a traditional structure that the electronic components are assembled on a printed circuit board, and then the printed circuit board is arranged in a housing; instead, the electronic components are directly arranged on the metal or non-metal basal plate; the basal plate can be one part of the electron ballast housing, and can be also a bracket of a light fitting, a housing or one part of the other structural parts. The electronic ballast has the characteristics of simple structure, high reliability and low cost.

Description

A kind of improved electronic ballast for fluoresent lamp

Technical field

The utility model relates to a kind of circuit arrangement that is used for gaseous discharge lamp igniting or control, relates in particular to a kind of electronic ballast for fluoresent lamp of the no printed circuit board arrangement of forming with electronic devices and components.

Background technology

Traditional electronic ballast for fluoresent lamp structure as shown in Figure 1, by the electronic devices and components 11 that are contained on the printed circuit board (PCB), printed circuit board (PCB) 12, the shell 13 that has loam cake 131, lower cover 132, lead terminal 14, the lead terminal here can be wiring plug-in unit or lead, inserts 15 (some electric ballast does not adopt inserts), and insulating barrier 16 compositions such as (some electric ballast are without insulating barrier).The electric ballast of said structure has used for many years, becomes the universal architecture of electronic ballast for fluoresent lamp.When the assembling light fixture, above-mentioned electric ballast is mounted to again on the shell or support of light fixture, use lead and fluorescent tube (, also having direct coupled) to be connected again by connector assembly, form the circuit of a telotism.

With regard to the structure of whole electric ballast, the function that is realized is: civil power is changed into direct current (having certain ripple component) earlier, become high frequency (tens KHz) again and exchange, remove to light and realize the steady operation of fluorescent tube.In the electric ballast of above-mentioned functions, what work only is electronic devices and components and relevant tie, remainder: as printing forme, role is to connect and fixing electronic devices and components; Shell, such as loam cake have played sealing process (metal shell has electromagnetic shielding action concurrently).If these parts that work there is no the contribution of any essence to rectifier can be omitted, do not influence the function of electric ballast simultaneously again, but economical with materials so not only reduce again and make man-hour, simultaneously can also weight reduction, reduced volume.In addition, the electronic devices and components that adopted as resistance, electric capacity, diode, triode etc., itself all have encapsulation (as plastics, resin, metal shell etc.) and lead-in wire and paint etc.The effect of these parts is packings and connects for the function of above-mentioned electric ballast, both not had direct effect, is again essential.Electric ballast for present conventional structure is like this, also nature can be expected, if also can remove self packing of part with lead-in wire, do not influence the function of electric ballast again, also further economical with materials when reducing worker, reduces volume and weight, save cost, can also improve reliability.

Summary of the invention

The purpose of this utility model is intended to address the above problem, promptly only keep the part that realizes required function in the existing ballast, but and the clipped omission as far as possible in the whole and electronic devices and components material with electric ballast, the function that can keep and improve electric ballast again (guarantees technical indicator, increase reliability), save cost simultaneously, reduced volume, weight reduction.

In order to address the above problem, the utility model has adopted following technical scheme, and a kind of improved electronic ballast for fluoresent lamp comprises electronic devices and components, substrate, it is characterized in that:

Described electronic devices and components are directly installed on the substrate.

Description of drawings

Below, with reference to accompanying drawing, for those skilled in the art that, to the detailed description of the present utility model, above-mentioned and other purposes of the present utility model, feature and advantage will be apparent.

Fig. 1 is the structural representation of electric ballast in the prior art;

Fig. 2 is the structural representation of the utility model electric ballast;

Fig. 3 is the vertical view of Fig. 2;

Fig. 4 is the utility model electric ballast tread flaking structural representation;

Fig. 5 is an Application Example of the present utility model.

Embodiment

See also shown in the accompanying drawing 2, electric ballast of the present utility model adopts and directly each components and parts is installed on the shell, be on the metal or nonmetallic substrate 21 of lower cover or loam cake, as be metal substrate, one layer insulating 22 also need be set, on this substrate 21, arrange some needed electronic devices and components 23.Between each components and parts, lean on their conductive electrodes own or the conducting film of adding up in addition or electric wire to link, constitute entire circuit.And electronic devices and components 23 adopt as far as possible self does not have film like, the paster shape structure of packing separately and not having independent lead-in wire.Wherein, resistance available metal film, carbon film or metal oxide film evaporation, photoetching making, also the method for available paster is pasted up pellet resistance; The capacitor of low capacity can use the method for evaporation electrode-insulating barrier-electrode to make, and jumbo capacitor can be beforehand with the electric capacity chip of flakiness shape, pastes again; Electrolytic capacitor, inductance etc. should be made suitable laminar rectangular element, paste again; Diode, triode etc. can adopt the paster dedicated pipe or directly adopt the silicon chip tube core to paste up, and point is with contact conductor, and so on.The electronic devices and components 23 that install only as long as can satisfy and can realize circuit function and can install, can remove the part that all additional package materials that can remove, outer lead, paint, symbol etc. directly do not work like this.After the integral body of above-mentioned electric ballast was finished, the solid packing that applies one deck insulation more in the above filled material 24, as die casting plastics, sealing resin etc., played the effects such as typing, insulation, protection, heat conduction, noise resistance of globality.This packing material 24 has also played second half shell (substrate 21 is a half-shells) simultaneously.With lead 25, electrode outlet line or draw binding post 26 etc. and all be fixed up.In order to reach electromagnetic shielding, can fill the outside of material 24 again at solid packing, coating last layer conductive film or have the conductive film 26 of good permeance has simultaneously so just been realized the assembling from components and parts to integral body, sees shown in Fig. 2,3.What need supplementary notes is that substrate 21 fills material 24 (together with surface conductive film 26) with solid packing and played shell and fin simultaneously.Substrate 21 can individualism, and also individualism not replaces it and fill material 24 (together with conductive film 26) with solid packing, " tread flaking " structure that can become whole fillings of upper and lower surface symmetry (equally) to seal, as shown in Figure 4.Wherein 41 is components and parts, and 43 is inserts, and 44 is the lead-out wire terminal, and 45 is conductive film.

The shape of electric ballast of the present utility model can be the single face or the solid of rectangle, cylindrical, half-cylindrical, spherical, polygon and other different shapes, also can be one or split.The electrical schematic diagram of the internal circuit that is adopted is suitable for various electrical schematic diagrams existing and that develop in the future.In addition, this electric ballast can be discrete separately when producing and use, also can be set (integrated) formula, promptly on a substrate, can make one or more independently unit simultaneously, also can join these unit with certain form, use simultaneously, as Fig. 5.

In addition, the top substrate of talking 21 can be independent metal or nonmetallic materials, also can be shell, support or certain structural member of light fixture, lamp apparatus, velocitron, electric ballast directly be made in it above, be mounted thereon again and needn't make independent electric ballast earlier.As shown in Figure 5, its general structure is support (substrate) or lamp outer casing (connecting insulating barrier) 51, electric ballast components and parts and encapsulating material 52, and fluorescent tube 53 constitutes.

The electric ballast of said structure is applicable to that voltage is 85～265V, the single tube power of 50～60Hz is the x1 of 5～250W, x2, x3, various electrical schematic diagrams such as x4, as low power factor, multiplication of voltage, by the multiple electric ballast of stream, double pump, high pump, multiple pump, circuit such as active, also be applicable to the inversion electron-like ballast of direct current → high-frequency ac conversion.

Should be pointed out that the electric ballast structure of this no printed circuit board (PCB), also be applicable to the electric ballast of other electric light source products except that fluorescent lamp and the power supply of lighting a lamp, as the electric ballast and the electronic transformer of Metal halogen lamp, sodium vapor lamp, neon light etc.

More than all embodiment only for the explanation the utility model usefulness, but not to restriction of the present utility model, person skilled in the relevant technique, under the situation that does not break away from spirit and scope of the present utility model, can also make various conversion or variation, so all technical schemes that are equal to also should belong to category of the present utility model and should be limited by each claim.

Claims

1. an improved electronic ballast for fluoresent lamp comprises electronic devices and components, substrate, it is characterized in that:

2, improved electronic ballast for fluoresent lamp as claimed in claim 1, its feature also is:

Connect by its conductive electrode, conducting film or electric wire between the described electronic devices and components.

3, improved electronic ballast for fluoresent lamp as claimed in claim 1 or 2, its feature also is:

Described substrate can be the part of electronic ballast shell, also can be support, the housing parts of light fixture, or the parts such as housing of fluorescent tube.

4, improved electronic ballast for fluoresent lamp as claimed in claim 3, its feature also is:

By the electric ballast of described substrate and electronic devices and components assembled package is integral type or split type rectangle, cylindrical, hemisphere, sphere.

5, improved electronic ballast for fluoresent lamp as claimed in claim 3, its feature also is:

Described substrate is nonmetal, and described ballast further comprises an insulating barrier, is arranged on the described substrate.