CN2795340Y - Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate - Google Patents

Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate Download PDF

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Publication number
CN2795340Y
CN2795340Y CN 200520101747 CN200520101747U CN2795340Y CN 2795340 Y CN2795340 Y CN 2795340Y CN 200520101747 CN200520101747 CN 200520101747 CN 200520101747 U CN200520101747 U CN 200520101747U CN 2795340 Y CN2795340 Y CN 2795340Y
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China
Prior art keywords
board
heat
base plate
layer
thermal hole
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Expired - Fee Related
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CN 200520101747
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Chinese (zh)
Inventor
姚根法
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Individual
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Individual
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Priority to CN 200520101747 priority Critical patent/CN2795340Y/en
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Publication of CN2795340Y publication Critical patent/CN2795340Y/en
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Abstract

The utility model discloses a moisture-proof and heat-proof solid wood structure floor board with heat conductive holes on a bottom board, wherein the purpose of which is to provide a moisture-proof and heat-proof solid wood structure floor board with the characteristics of small deformation and little warping. The utility model comprises a surface board on the uppermost side, a second layer surface base board, a third layer core board and a fourth bottom board, wherein interval grooves are arranged on the core board, the surface board, the surface base board, the core board and the bottom board are glued integrally, both side surfaces of a long edge of the core board are provided with a recess and a tenon which correspond to each other, and the heat conduction holes are arranged on the bottom board. The heat conduction holes and the grooves of the core board are communicated. Hot air is in contact with the surface base board through the grooves between the heat conduction holes of the bottom board and the core board, and the hot air is led to the surface board through the surface base board to cause the upper surface of the floor board to be heated. The for board has the advantages of high heat transfer speed, strong integrality and small deformation, and is especially suitable in the north.

Description

The damp proofing and heat-resistant floorboard in solid wood structure of base plate band thermal hole
Technical field
The utility model relates to a kind of wood flooring, particularly a kind of moisture resistance heat-resisting solid wood structure floor.
Background technology
North cold weather generally adopts heating, is provided with thermal source below the indoor floor of many top grades, and heating installation is transmitted on the floor, even step in winter so warm sensation is arranged also on the floor.This floor generally is made up of multilayer, is that the top layer is generally thinner topmost, and material is good, and is not only attractive in appearance but also wear-resisting, and price is higher; The second layer is the table substrate; The 3rd layer is central layer, and thicker, the bottom has groove, and the two sides on the long limit of central layer have corresponding groove and tenon, is base plate below again, is by being arranged in parallel with a gap each other with the isometric strip solid wood in floor, and becomes cross-like with the groove of central layer; Four layers of plank are bonding through adhesive, floor into strips, the floor of every strip is by cooperatively interacting between the groove of two sides, the long limit of central layer and the tenon, be spliced into large-area floor, the gap of heating installation between base plate and central layer and table substrate contacts, be transmitted to dash board by the table substrate, make the floor upper surface heating.Because base plate is by making with the isometric fine strip shape solid wood in floor, generally have 1-2 rice long, therefore, globality is poor, distortion is big, and warpage takes place easily on the floor, influences attractive in appearance and functional performance.
The utility model content
The utility model has overcome the shortcoming that exists in the existing product, provides a kind of distortion little, is difficult for the damp proofing and heat-resistant floorboard in solid wood structure of the base plate band thermal hole of warpage.
In order to address the above problem, the utility model is achieved through the following technical solutions: comprise uppermost dash board, second layer table substrate, the 3rd layer of central layer, the 4th layer of base plate, be shaped on spaced trenches on the central layer, dash board, table substrate, central layer, base plate, gummed are one, two sides, long limit at central layer are shaped on corresponding groove and tenon, be shaped on thermal hole on base plate, thermal hole communicates with the groove of central layer.Heating installation is transmitted to dash board through thermal hole and the gap between the central layer and table substrate contacts of base plate by the table substrate, makes the floor upper surface heating.
Damp proofing and heat-resistant floorboard in solid wood structure according to the base plate band thermal hole of such scheme manufacturing has the advantage that heat transfer rate is fast, globality strong, distortion is little.
Description of drawings
Fig. 1 is the bottom view of the damp proofing and heat-resistant floorboard in solid wood structure of base plate band thermal hole;
Fig. 2 is the A-A cutaway view Amplified image of Fig. 1;
Fig. 3 is that Fig. 1 is at the B-B sectional view.
The specific embodiment
The utility model will be further described below in conjunction with the drawings and specific embodiments.
Fig. 1, Fig. 2, Fig. 3, be the structural representation of the damp proofing and heat-resistant floorboard in solid wood structure of base plate band thermal hole.Uppermost dash board 1, second layer table substrate 2, the 3rd layer of central layer 3, the 4th layer of base plate 4, be shaped on spaced trenches 5 on the central layer 3, be shaped on thermal hole 6 on the base plate 4, thermal hole 6 be shaped as oval shape, thermal hole 6 communicates with the groove 5 of central layer, and base plate 4 is to be made by composite board.Dash board 1, table substrate 2, central layer 3, base plate 4 gummeds are shaped on corresponding groove 7 and tenon 8 for one in the two sides, long limit of central layer.
The shape of diagram thermal hole 6 is the oval shape in embodiment, the shape of thermal hole 6 can also be rectangle or/and circular or/and trapezoidal or/and square or/and triangle or/and ellipse or/and polygon and their combined shaped.Described base plate 4 also can be made with lamina.

Claims (3)

1, a kind of damp proofing and heat-resistant floorboard in solid wood structure of base plate band thermal hole, comprise uppermost dash board, second layer table substrate, the 3rd layer of central layer, the 4th layer of base plate, be shaped on spaced trenches on the central layer, dash board, table substrate, central layer, bottom plate glue are integrated, two sides, long limit at central layer are shaped on corresponding groove and tenon, it is characterized in that being shaped on thermal hole on the described base plate, thermal hole communicates with the groove of central layer.
2, the damp proofing and heat-resistant floorboard in solid wood structure of base plate band thermal hole according to claim 1 is characterized in that described base plate is to be made by lamina or multilayer.
3, the damp proofing and heat-resistant floorboard in solid wood structure of base plate band thermal hole according to claim 1, it is characterized in that thermal hole shape on the described base plate be rectangle or/and circle or/and oval shape or/and trapezoidal or/and square or/and triangle or/and ellipse or/and polygon and their combined shaped.
CN 200520101747 2005-04-21 2005-04-21 Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate Expired - Fee Related CN2795340Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520101747 CN2795340Y (en) 2005-04-21 2005-04-21 Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520101747 CN2795340Y (en) 2005-04-21 2005-04-21 Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate

Publications (1)

Publication Number Publication Date
CN2795340Y true CN2795340Y (en) 2006-07-12

Family

ID=36813100

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200520101747 Expired - Fee Related CN2795340Y (en) 2005-04-21 2005-04-21 Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate

Country Status (1)

Country Link
CN (1) CN2795340Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103528111A (en) * 2012-07-02 2014-01-22 江苏德威木业有限公司 Integrated water heating floor block and heat conducting component thereof
CN104074338A (en) * 2014-07-23 2014-10-01 李登刚 Wooden floor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103528111A (en) * 2012-07-02 2014-01-22 江苏德威木业有限公司 Integrated water heating floor block and heat conducting component thereof
CN103528111B (en) * 2012-07-02 2016-01-20 江苏德威木业有限公司 Integrated water heating floor block and heat conduction member thereof
CN104074338A (en) * 2014-07-23 2014-10-01 李登刚 Wooden floor

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060712

Termination date: 20120421