CN2788361Y - 用于封装发光二极管的模具 - Google Patents
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Abstract
一种用于封装发光二极管的模具,包括有:底板及多个支撑架。所述支撑架设置于该底板上,用于支撑一设置有多个未封装之裸晶于其上的焊垫(Pad),所述支撑架彼此相连接,以围成多个用于相对应容置所述裸晶的容置空间;藉此,当该焊垫通过一压板以压合所述裸晶于所述相对应的容置空间内时,通过所述支撑架平均分配该压板的压合力量,以必免容置于所述容置空间内的封装胶发生过度溢出至该焊垫的背面。进而达到不浪费封装胶、不须使用公知贴胶、且不需清除大量溢胶的优点。
Description
技术领域
本实用新型有关于一种用于封装发光二极管的模具,尤指一种通过具有多个容置空间的模具,以相对应容置多个未封装前的裸晶于所述容置空间内的用于封装发光二极管的模具。
现有技术
请参阅图1所示,其为公知支撑架未施以贴胶时,封装胶溢至支撑架及焊垫的示意图。由图中可知,公知用于封装发光二极管的模具10a具有一底板11a、一外围的支撑架12a、及一由外围支撑架12a所包围成形的容置空间13a,且该容置空间13a内容置有封装胶(图未示)。未封装前的发光二极管具有多个裸晶20a,且所述裸晶20a设置于一焊垫(Pad)30a上。藉由一压板40a压合该焊垫30a,使所述裸晶20a容置于该模具10a的容置空间13a内,以使该封装胶(图未示)封装于该裸晶20a上。
请参阅图2所示,其为公知焊垫受压时的压力分布示意图。一般的常理可知,当该焊垫30a横夸该模具10a时,因该焊垫30a受压的关系而产生压力梯度,亦即该焊垫30a的旁侧所受的压力最小,而中央为负荷集中处,其所受的压力最大。
因此,当该焊垫30a横夸于该模具10a时,不仅该焊垫30a及所述裸晶20a会因负荷集中而产生变形,更使得所述裸晶20a于封胶过程中,发生该封装胶过度溢胶(箭头50a为溢流的封装胶)于该焊垫30a背面,而造成封装胶的浪费及无法清除的缺点,更形成该溢胶于焊垫30a背面的封装胶通过该压板40a加压于负荷集中处,而造成再次溢胶的可能性。
为解决上述溢胶的问题,一般的作法是通过一贴胶(图未示)封住该焊垫30a与该模具10a间的容易产生溢胶处。然,该贴胶(图未示)于应用上的防溢胶效果不佳,且造成多余成本的浪费。
是以,由上可知,上述公知用于封装发光二极管的模块,在实际使用上,显然具有不便与缺失存在,而可待加以改善者。
缘是,本设计人有感上述缺失的可改善,且依据多年来从事此方面的相关经验,悉心观察且研究,并配合学理的运用,而提出一种设计合理且有效改善上述缺失的本实用新型。
实用新型内容
本发明所要解决的技术问题,在于提供一种用于封装发光二极管的模具,其通过模具的多个支撑架,以平均分配焊垫所受的压合力量,以必免封装胶发生过度溢出至焊垫背面,进而达到节省成本、且不需清除大量溢胶的优点。
为了解决上述技术问题,根据本实用新型的其中一种方案,提供一种用于封装发光二极管的模具,包括有:底板及多个支撑架。所述支撑架设置于该底板上,用于支撑一设置有多个未封装的裸晶于其上的焊垫(Pad),所述支撑架彼此相连接,以围成多个用于相对应容置所述裸晶的容置空间;藉此,当该焊垫通过一压板以压合所述裸晶于所述相对应的容置空间内时,通过所述支撑架平均分配该压板的压合力量,以必免容置于所述容置空间内的封装胶发生过度溢出至该焊垫的背面。
附图说明
图1是公知支撑架未施以贴胶时,封装胶溢至支撑架及焊垫的示意图;
图2是公知焊垫受压时的压力分布示意图;以及
图3是本发明发光二极管的封装示意图。
【主要组件符号说明】
[公知]
模具 10a 底板 11a
支撑架 12a
容置空间 13a
裸晶 20a
焊垫 30a
压板 40a
溢流的封装胶 50a
[本实用新型]
模具 10 底板 11
支撑架 12
容置空间 13
裸晶 20
焊垫 30
压板 40
具体实施方式
为了使贵审查委员能更进一步了解本实用新型为达成预定目的所采取的技术、手段及功效,请参阅以下有关本实用新型的详细说明与附图,相信本实用新型的目的、特征与特点,当可由此得一深入且具体的了解,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制者。
请参阅图3所示,其为本发明发光二极管的封装示意图。由图中可知,本发明提供一种用于封装发光二极管的模具10,该包括有:底板11及多个支撑架12。
其中所述支撑架12设置于该底板11上,用于支撑一设置有多个未封装的裸晶20于其上的焊垫(Pad)30,所述支撑架12彼此相连接,以围成多个用于相对应容置所述裸晶20的容置空间13,该容置空间13可形成一田梗状的容置空间。藉此,当该焊垫30通过一压板40以压合所述裸晶20于所述相对应的容置空间13内时,通过所述支撑架12平均分配该压板40的压合力量,以必免容置于所述容置空间13内的封装胶(图未示)发生过度溢出至该焊垫30的背面。
综上所述,本发明不仅可以必免容置于所述容置空间13内的封装胶发生过度溢出至该焊垫30的背面,更能达到不浪费封装胶、不须使用公知贴胶、且不需清除大量溢胶的优点。
因此,本实用新型实为一不可多得的新型创作产品,极具新颖性及进步性,完全符合新型专利申请要件,爰依专利法提出申请,敬请详查并赐准本案专利,以保障创作者的权益。
惟,以上所述,仅为本实用新型最佳的一的具体实施例的详细说明与图式,惟本实用新型的特征并不局限于此,并非用以限制本实用新型,本实用新型的所有范围应以下述的申请专利范围为准,凡合于本实用新型申请专利范围的精神与其类似变化的实施例,皆应包含于本实用新型的范畴中,任何熟悉该项技艺者在本实用新型的领域内,可轻易思及的变化或修饰皆可涵盖在以下本案的保护范围。
Claims (2)
1、一种用于封装发光二极管的模具,其特征在于,包括有:
底板;以及
多个支撑架,其设置于该底板上,用于支撑一设置有多个未封装的裸晶于其上的焊垫,所述支撑架彼此相连接,以围成多个用于相对应容置所述裸晶的容置空间;
藉此,当该焊垫通过一压板以压合所述裸晶于所述相对应的容置空间内时,通过所述支撑架平均分配该压板的压合力量,以必免容置于所述容置空间内的封装胶发生过度溢出至该焊垫的背面。
2、如权利要求1所述的用于封装发光二极管的模具,其特征在于,所述支撑架围成一田梗状的容置空间。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100394620C (zh) * | 2005-02-23 | 2008-06-11 | 宏齐科技股份有限公司 | 用于封装发光二极管的模具、及发光二极管的封装方法 |
CN102672141A (zh) * | 2012-05-31 | 2012-09-19 | 昆山拓安塑料制品有限公司 | 一种多功能led散热支撑架铝合金压铸模具 |
US8629475B2 (en) | 2012-01-24 | 2014-01-14 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9343444B2 (en) | 2014-02-05 | 2016-05-17 | Cooledge Lighting, Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
-
2005
- 2005-02-23 CN CNU2005200054046U patent/CN2788361Y/zh not_active Expired - Lifetime
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100394620C (zh) * | 2005-02-23 | 2008-06-11 | 宏齐科技股份有限公司 | 用于封装发光二极管的模具、及发光二极管的封装方法 |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9496472B2 (en) | 2012-01-24 | 2016-11-15 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US8680558B1 (en) | 2012-01-24 | 2014-03-25 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8748929B2 (en) | 2012-01-24 | 2014-06-10 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8759125B2 (en) | 2012-01-24 | 2014-06-24 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8785960B1 (en) | 2012-01-24 | 2014-07-22 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8884326B2 (en) | 2012-01-24 | 2014-11-11 | Cooledge Lighting Inc. | Polymeric binders incorporating light-detecting elements and related methods |
US9478715B2 (en) | 2012-01-24 | 2016-10-25 | Cooledge Lighting Inc. | Discrete phosphor chips for light-emitting devices and related methods |
US8629475B2 (en) | 2012-01-24 | 2014-01-14 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9190581B2 (en) | 2012-01-24 | 2015-11-17 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9184351B2 (en) | 2012-01-24 | 2015-11-10 | Cooledge Lighting Inc. | Polymeric binders incorporating light-detecting elements |
US9236502B2 (en) | 2012-01-24 | 2016-01-12 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
US9276178B2 (en) | 2012-01-24 | 2016-03-01 | Cooledge Lighting, Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9472732B2 (en) | 2012-01-24 | 2016-10-18 | Cooledge Lighting, Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
CN102672141B (zh) * | 2012-05-31 | 2014-02-26 | 昆山拓安塑料制品有限公司 | 一种多功能led散热支撑架铝合金压铸模具 |
CN102672141A (zh) * | 2012-05-31 | 2012-09-19 | 昆山拓安塑料制品有限公司 | 一种多功能led散热支撑架铝合金压铸模具 |
US9343443B2 (en) | 2014-02-05 | 2016-05-17 | Cooledge Lighting, Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9343444B2 (en) | 2014-02-05 | 2016-05-17 | Cooledge Lighting, Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
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