CN2786910Y - Printed circuit compound board - Google Patents
Printed circuit compound board Download PDFInfo
- Publication number
- CN2786910Y CN2786910Y CN 200520018581 CN200520018581U CN2786910Y CN 2786910 Y CN2786910 Y CN 2786910Y CN 200520018581 CN200520018581 CN 200520018581 CN 200520018581 U CN200520018581 U CN 200520018581U CN 2786910 Y CN2786910 Y CN 2786910Y
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- CN
- China
- Prior art keywords
- conductive layer
- printed circuit
- insulating barrier
- composite plate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a printed circuit compound board which comprises a soft board, two first insulating layers, at least one first conductive layer and a second insulating layer, wherein the overlapped two first insulating layers are respectively arranged on both faces on one side of the soft board; the overlapped first conductive layers are arranged on one face of the first insulating layer; the second insulating layer is arranged between the two first conductive layers. Therefore, the utility model in a soft and hard compound board mode can be applied to the field of TFT-LCD to replace the welding mode used between TFT-LCD soft and hard boards and the connecting mode used among ACF, a connector and HOT-BAR currently, and thus has the effect of easy assembly and connection.
Description
Technical field:
The utility model relates to a kind of printed circuit composite plate.
Background technology:
The TFT-LCD that generally is used for mobile computer or desktop PC, the accompanying transparent indium tin oxide target of its face glass (Indium Tin Oxide; ITO) circuit, desire directly to carry out electrical interconnects with custom circuit plate (as the soft board class of TCP) or some assembly, general common connected mode as shown in Figure 1, it is to utilize its contact 61 with welding manner (or ACF on a circuit board 6, HOT-BAR, connector etc.) be connected with the conductor 71 of soft board 7, but because the contact 61 of this circuit board 6 is all less with the volume of the conductor 71 of soft board 7, and the two must accurate correspondence weld, therefore when contact 61 and conductor 71 both to the seasonable accurately location that is difficult for fast, cause the difficulty when making higher, and the time that is spent and cost are all more; Therefore, with present connected mode and required can't realistic utilization the time.
The utility model content:
Technical problem to be solved in the utility model is: at the deficiencies in the prior art, provide a kind of TFT-LCD of can be used for, be easy to assemble the printed circuit composite plate that connects effect and reach.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of printed circuit composite plate, it comprises: a soft board, first insulating barrier, at least more than one first conductive layer, second insulating barrier, this first insulating barrier is laminated in respectively on two of soft board one side, each first conductive layer is laminated in respectively on the one side of each first insulating barrier, and this second insulating barrier is arranged between two first conductive layers.
Described soft board further includes a base material, is laminated with one second conductive layer on the one side of this base material, is laminated with a protective layer on the one side of this second conductive layer, and described first insulating barrier is stacked at respectively on the another side of protective layer and base material.Described protective layer has one makes described second conductive layer can supply the notch part that contacts with external equipment.Described second conductive layer is a copper material.The conducting of described composite plate is to hole and to cooperate copper facing or elargol metallization for it.
Compared with prior art, the utility model has the advantages that: mode that can soft-hard composite board is applied in the TFT-LCD field, replacing the connection practice of welding, ACF, connector and HOT-BAR between present TFT-LCD rigid-flex, and reach the effect that is easy to assemble connection.
Description of drawings:
Fig. 1 is the profile status schematic diagram that the available circuit plate is connected with soft board.
Fig. 2 is a three-dimensional appearance schematic diagram of the present utility model.
Fig. 3 is a profile status schematic diagram of the present utility model.
Fig. 4 is a user mode schematic diagram of the present utility model.
Fig. 5 is a user mode schematic diagram of the present utility model.
Label declaration:
Second conductive layer 12
Notch part 131
First insulating barrier 2
First conductive layer 3
Second insulating barrier 4
Contact 61
Soft board 7
Embodiment:
See also Fig. 2 and shown in Figure 3, be three-dimensional appearance schematic diagram of the present utility model and profile status schematic diagram.As shown in the figure: a kind of printed circuit composite plate, it is made of a soft board 1, first insulating barrier 2, at least more than one first conductive layer 3 and second insulating barrier 4, for can be used for the soft-hard composite board of TFT-LCD, and reaches the effect that is easy to assemble connection.
The above-mentioned soft board of carrying 1 further includes a base material 11; stacking on the one side of this base material 11 have one second conductive layer 12; stacking on the one side of this second conductive layer 12 have a protective layer 13; and this protective layer 13 has a notch part 131; so that this second conductive layer 12 can be for contacting with required external equipment, and this second conductive layer 12 is the material of copper.
This first insulating barrier 2 is stacking respectively on the another side of above-mentioned protective layer 13 and base material 11.
First conductive layer 3 with at least more than one, each first conductive layer 3 is stacking respectively on the one side of above-mentioned each first insulating barrier 2.
This second insulating barrier 4 is arranged between above-mentioned two first conductive layers 3.Constitute a brand-new printed circuit composite plate structure by above-mentioned arrangement.
See also Fig. 4 and shown in Figure 5, be user mode schematic diagram of the present utility model.As shown in the figure: when utilization, the user can be provided with required according to its circuit, selected its required conduction position on outermost first conductive layer 3, be drilled with a perforation 5 in its selected position with an instrument (not shown) afterwards, and this perforation 5 runs through soft board 1, first insulating barrier 2, first conductive layer 3 and second insulating barrier 4, be poured in this perforation 5 with conductive materials 51 afterwards, and this conductive materials 51 can be elargol or copper facing, makes second conductive layer 12 of this soft board 1 and each first conductive layer 3 utilize conductive materials 51 to form the contact of a conducting state.
In sum, the utility model printed circuit composite plate can effectively be improved the various shortcoming of prior art, for acting on the soft-hard composite board that is easy to assemble connection of TFT-LCD, and then make the utility model can produce more progressive, more practical, more meet the user the institute must, really meet the important document of patent application, proposed patent application in accordance with the law.
Claims (5)
1, a kind of printed circuit composite plate, it is characterized in that: it comprises: a soft board, first insulating barrier, at least more than one first conductive layer, second insulating barrier, this first insulating barrier is laminated in respectively on two of soft board one side, each first conductive layer is laminated in respectively on the one side of each first insulating barrier, and this second insulating barrier is arranged between two first conductive layers.
2, a kind of printed circuit composite plate according to claim 1; it is characterized in that: described soft board further includes a base material; be laminated with one second conductive layer on the one side of this base material; be laminated with a protective layer on the one side of this second conductive layer, described first insulating barrier is stacked at respectively on the another side of protective layer and base material.
3, a kind of printed circuit composite plate according to claim 2 is characterized in that: described protective layer has one makes described second conductive layer can supply the notch part that contacts with external equipment.
4, a kind of printed circuit composite plate according to claim 2, it is characterized in that: described second conductive layer is a copper material.
5, a kind of printed circuit composite plate according to claim 1 is characterized in that: the conducting of described composite plate is to hole and to cooperate copper facing or elargol metallization for it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520018581 CN2786910Y (en) | 2005-05-13 | 2005-05-13 | Printed circuit compound board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520018581 CN2786910Y (en) | 2005-05-13 | 2005-05-13 | Printed circuit compound board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2786910Y true CN2786910Y (en) | 2006-06-07 |
Family
ID=36775470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520018581 Expired - Fee Related CN2786910Y (en) | 2005-05-13 | 2005-05-13 | Printed circuit compound board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2786910Y (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008095337A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
WO2008095338A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A mutual connection structure between multi-layer boards and manufacturing method thereof |
US7687312B2 (en) | 2006-12-06 | 2010-03-30 | Princo Corp. | Method of manufacturing hybrid structure of multi-layer substrates |
CN101742822B (en) * | 2008-11-25 | 2011-07-06 | 华通电脑股份有限公司 | Method for peeling rigid board from flexible board area of flexible-rigid board |
US8014164B2 (en) | 2006-12-06 | 2011-09-06 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
WO2015124036A1 (en) * | 2014-02-19 | 2015-08-27 | 刘晓霖 | Switching circuit structure based on printed circuit board |
WO2020181559A1 (en) * | 2019-03-14 | 2020-09-17 | 华为技术有限公司 | Method for machining circuit board, circuit board, electronic devices, terminal device |
-
2005
- 2005-05-13 CN CN 200520018581 patent/CN2786910Y/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7687312B2 (en) | 2006-12-06 | 2010-03-30 | Princo Corp. | Method of manufacturing hybrid structure of multi-layer substrates |
US7948079B2 (en) | 2006-12-06 | 2011-05-24 | Princo Corp. | Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof |
US8014164B2 (en) | 2006-12-06 | 2011-09-06 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
US8023282B2 (en) | 2006-12-06 | 2011-09-20 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
US8111519B2 (en) | 2006-12-06 | 2012-02-07 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
WO2008095337A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
WO2008095338A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A mutual connection structure between multi-layer boards and manufacturing method thereof |
CN101742822B (en) * | 2008-11-25 | 2011-07-06 | 华通电脑股份有限公司 | Method for peeling rigid board from flexible board area of flexible-rigid board |
WO2015124036A1 (en) * | 2014-02-19 | 2015-08-27 | 刘晓霖 | Switching circuit structure based on printed circuit board |
WO2020181559A1 (en) * | 2019-03-14 | 2020-09-17 | 华为技术有限公司 | Method for machining circuit board, circuit board, electronic devices, terminal device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060607 |