CN2783400Y

CN2783400Y - Wind stop board for mainboard

Info

Publication number: CN2783400Y
Application number: CN 200520000618
Authority: CN
Inventors: 张林伟
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2005-01-24
Filing date: 2005-01-24
Publication date: 2006-05-24
Anticipated expiration: 2015-01-24

Abstract

The utility model discloses a wind stop board for a main board. Primarily, a heat source of the main board is isolated and is guided to a venting port by the wind stop board, and a plurality of grooves are arranged on the wind stop board. Thus, cables on the main board are penetrated for defining the displacement of an X shaft of the cables. In addition, a defining part which is vertical to the wind stop board is arranged at the side of each groove for defining the displacement of a Y shaft of the cables. Thus, the heat source on the main board can be quickly emitted, and the cables can run to speed up to discharge the heat source according to a preset configuration route.

Description

A kind of deep bead that applies to motherboard

Technical field

The utility model relates to a kind of deep bead, particularly relates to a kind of deep bead that limits the cabling mode of cable on the motherboard.

Background technology

Making rapid progress of electronics technology development now, electronic installation particularly miscellaneous has become indispensable indispensable device in people's life, and general along with electronic installation, the user also more payes attention to carrying out the size of speed and size for the requirement of electronic installation.

For instance, the execution speed of present computing machine executable platform 500 megahertzes (Mhz) before the several years is elevated to more than 2 kilo-mega cycles per seconds (Ghz), and mobile computer is also owing to the advantage of volume becomes main flow.With server, blade point type server also significantly reduces owing to its shared space, and becomes main flow gradually in addition.

The casing inside of please consulting at present general electronic installation shown in Figure 1 earlier is provided with figure.The casing inside of electronic installation may comprise power supply unit 10 and motherboard 20 at present as shown in the figure; Motherboard 20 running required electric powers then are to utilize power supply unit 10 to supply.For instance, power supply unit 10 can be connected to power supply jointing 22 on the motherboard 20 by the cable 12 with attachment plug to supply with motherboard 20 power supplys.In addition, power supply unit 10 also can offer other peripheral unit (as CD-ROM drive etc.) simultaneously by other cable 12 and operate required power supply.

Comprehensive power supply unit 10 as mentioned above is for providing the electronic installation running required power supply, thereby also relatively produce many heat energy, and this heat energy is at present mostly by attaching fans 30 behind power supply unit 10, quicken heat energy self-ventilation mouth 40 and discharge to produce cooling draught, overheated and damage in order to avoid power supply unit 10.

But since the size of power supply unit 10 with and default position may make fan 30 and ventilating opening 40 the position and keep off, so heat energy may intersperse among whole casing along with flowing of cooling draught, and causes motherboard 20 over-heated condition.And this over-heated condition will influence the execution speed of electronic installation, therefore is not allowed to.Hide resistance and be directed to ventilating opening 40 and avoid above-mentioned condition for solving cooling draught that the present many manufacturers of above-mentioned condition have utilized deep bead that fan 30 is produced.

See also the enforcement synoptic diagram that utilizes deep bead guiding cooling draught shown in Fig. 2 A and Fig. 2 B again.Wherein Fig. 2 A is that first enforcement synoptic diagram Fig. 2 B then is the second enforcement synoptic diagram.

See also the deep bead that is arranged at shown in Fig. 2 A in a main frame.It is by being directed to ventilating opening 40 at 40 installings of fan 30 and ventilating opening deep bead 50 with the cooling draught that fan 30 is produced, and power supply unit 10 heat energy that produces is intercepted outside motherboard 20.But because power supply unit 10 needs connect by cable, offering motherboard 20 and other device power supply, so deep bead 50 can keep a space usually with 30 in fan and allows cable 12 and sound source wire 24 cablings to be connected to motherboard 20 or other device.And invisible of this headspace has also limited the cabling mode of cable 12 with sound source wire 24, and the restriction of this restriction and cable 12 and sound source wire 24 original length may cause cable 12 can't reach position partly, and causes power supply unit 10 can't provide power supply can't receive the situations such as signal that come from main frame to each device and loudspeaker.

The deep bead that at present existing manufacturer proposes shown in Fig. 2 B improves the limited situation of above-mentioned cable.Walk line position according to default cable 12 and sound source wire 24 in the deep bead 60 as shown in the figure and offer groove 62, this groove 62 not only can make the cable 12 of power supply unit 10 pass with sound source wire 24, also can in order to limit other cable 12 and sound source wire 24 on the motherboard 20 (as, sound source wire and power lead) the position.But the displacement that direction only can limit the cable X-axis of offering owing to groove 62, can not limit it and produce displacement (making progress) to Y direction, therefore the cable 12 of part or sound source wire 24 can break away from former configuration route, and at random in motherboard 20, and then influence the assembling operation that motherboard 20 dispels the heat or influences motherboard 20.

Therefore, when the size of the execution speed of present electronic installation and size becomes the emphasis that research and development design, how the thermal source in the casing is derived, and with cable according to required fixed configurations promoting motherboard integral heat sink and assembling speed, the real emphasis that can further study for the researchist.

The utility model content

In view of above problem, the utility model provides a kind of deep bead that applies to motherboard in order to the main thermal source on the motherboard is derived, and the cable in the motherboard can be fixed in ad-hoc location.

Deep bead of the present utility model comprises can be in order to be fixed in deep bead the location division of this motherboard, and several grooves wear cable on the motherboard and not stopped by deep bead, and the displacement of restriction cable X-direction, it is characterized in that: also be provided with several limited sections on the deep bead, this limited section is vertically installed on the deep bead, produces displacement and breaks away from former configuration route to Y direction with the cable of avoiding wearing groove.

Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.

Description of drawings

Fig. 1 is provided with figure for the casing inside of existing general electronic installation;

Fig. 2 A implements synoptic diagram for existing first of the deep bead guiding cooling draught that utilizes;

Fig. 2 B implements synoptic diagram for existing second of the deep bead guiding cooling draught that utilizes; And

Fig. 3 is a use synoptic diagram of the present utility model.

Wherein, Reference numeral:

Casing 100

Power supply unit 10

Cable 12

Motherboard 20

Power connecting plug 22

Sound source wire 24

Fan 30

Ventilating opening 40

Deep bead 50

Deep bead 60

Groove 62

Deep bead 70

Location division 72

Through hole 73

Groove 74

Limited section 76

Embodiment

Please consult use synoptic diagram shown in Figure 3 earlier, in order to function mode of the present utility model to be described.Deep bead 70 of the present utility model includes several location divisions 72, in order to deep bead 70 is fixed on the casing 100 of ccontaining motherboard and power supply unit, and several grooves 74 can wear various cables on the motherboard and not stopped by deep bead 70, and the displacement of restriction cable X-direction, it is characterized in that: this deep bead 70 also has several limited sections 76, this limited section 76 that direction is set is vertical with deep bead 70, and be opened on the deep bead 70, with the displacement of the cable Y direction of avoiding wearing groove 74 and break away from former configuration route.

Wherein, above-mentioned location division 72 can utilize modes such as buckle, rivet clasp, welding to be fixed on the casing 100, and need have and location division 72 corresponding block button holes on this casing 100, to allow deep bead 70 can utilize mode such as buckle to be fixed on the casing 100 by location division 72.

And left side side or the right side of deep bead 70 and the opening of irresistible groove 74 are located at according to the configuration route of cable in limited section 76.And the quantity and the size of groove 74 and limited section 76 are not limited, but the displacement that needs to allow cable wear and limit its Y direction gets final product.Also can offer through hole 73 in addition on the deep bead 70 wears the cable that does not need often to plug.And above-mentioned cable can be the power supply cable 12 that is connected on the power supply unit 10, or is connected to sound source wire 24 of public address set etc. by motherboard 20.

In addition, the external form and the size of deep bead 70 are not particularly limited, and just can but the cooling draught that produces by fan 30 must be directed to ventilating opening 40.

As mentioned above, the heat energy that not only can intercept of the present utility model is dispersed among the motherboard 20, and can limit the line position of walking of cable 12 and sound source wire 24 etc., the effect that not only can reach best heat radiation also can make the setting of electronic installation inside more neat, more helps motherboard 20 maintenance activities backward.

Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.

Claims

1, a kind of deep bead that applies to motherboard is arranged on the motherboard in the casing, it is characterized in that, comprises: form the plate body that heat energy scatters the baffle area; Fix this plate body at least one location division on this casing; Limit at least one groove that a cable produces the X-direction displacement, this cable is arranged in this groove; Limit at least one limited section of this cable generation Y direction displacement; This location division and this groove are arranged on this plate body, and this limited section is vertically installed on this plate body.

2, the deep bead that applies to motherboard according to claim 1 is characterized in that, this casing is fixed in the mode of buckle in this location division.

3, the deep bead that applies to motherboard according to claim 1 is characterized in that, have on this casing more than one block button hole can with the mutual buckle in this location division.

4, the deep bead that applies to motherboard according to claim 1 is characterized in that, this casing is fixed in the mode of rivet clasp in this location division.

5, the deep bead that applies to motherboard according to claim 1 is characterized in that, this casing is fixed in the mode of welding in this location division.

6, the deep bead that applies to motherboard according to claim 1 is characterized in that, an avris of this plate body is located in this limited section according to the former configuration route of this cable.

7, the deep bead that applies to motherboard according to claim 1 is characterized in that, also can offer more than one through hole on this plate body, and this cable is arranged in this through hole.

8, the deep bead that applies to motherboard according to claim 1 is characterized in that, this cable is the power supply supply cable of power supply.

9, the deep bead that applies to motherboard according to claim 1 is characterized in that, this plate body is bending.