CN2750507Y - An improved structure of LGA socket - Google Patents

An improved structure of LGA socket Download PDF

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Publication number
CN2750507Y
CN2750507Y CN 200420094830 CN200420094830U CN2750507Y CN 2750507 Y CN2750507 Y CN 2750507Y CN 200420094830 CN200420094830 CN 200420094830 CN 200420094830 U CN200420094830 U CN 200420094830U CN 2750507 Y CN2750507 Y CN 2750507Y
Authority
CN
China
Prior art keywords
cover
projection
lower cover
buckled
lga socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200420094830
Other languages
Chinese (zh)
Inventor
李重志
Original Assignee
蔡添庆
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蔡添庆 filed Critical 蔡添庆
Priority to CN 200420094830 priority Critical patent/CN2750507Y/en
Application granted granted Critical
Publication of CN2750507Y publication Critical patent/CN2750507Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

An improved structure of an LGA socket is provided. The upper cover of the socket is buckled on the lower cover, an adsorbing cover is buckled on the upper cover and a projection is arranged on the adsorbing cover. A projection is arranged on the adsorbing cover, when a CPU is installed on the lower cover, the upper cover and the lower cover are buckled to the upper surface of the CPU to jack up the adsorbing cover, the adsorbing cover does not need manual work to tear down the adsorbing cover, the labor is saved and the time is saved. When the upper cover is buckled to the lower cover, protrusions on the upper cover press the lower part of a rocker, and meanwhile, the rocker is buckled on the inverted buckle of the lower cover to cause the upper cover and the lower cover of the utility model are tightly and firm buckled.

Description

A kind of lga socket structure-improved
Technical field:
The utility model relates to the CPU socket technical field, more specifically to a kind of lga socket structure-improved.
Background technology:
Lga socket is used for having on connection line plate and the bottom surface IC sealing of some contact chips.Existing lga socket covers on lga socket and is provided with adsorption cover when dispatching from the factory, the effect that two aspects are stamped in absorption, and the one, the protection terminal, protection lga socket terminal is injury-free in product assembling, packing, transportation; The 2nd, when production line is assembled automatically, lga socket is adsorbed onto on the production line by the adsorption cover on the absorption lga socket.Its weak point is, when the user is installed in CPU in the lga socket main body, must take off adsorption cover, and it is very inconvenient to take off adsorption cover by hand.
The utility model content:
Technical problem to be solved in the utility model is that to overcome the manual adsorption cover that takes off of above-mentioned lga socket very inconvenient and a kind of lga socket structure-improved is provided.
Technology solution of the present utility model is:
A kind of lga socket structure-improved, the loam cake of socket is fastened on down and covers, on cover buckle adsorption cover arranged, adsorption cover is provided with a projection.
Described this projection is injection-moulded in the position after the leaning on of adsorption cover.
The front end of described loam cake is provided with projection, and rocking bar is contained in down and covers, this projection be crushed on rocking bar the arc folding part below.
One side of described lower cover is provided with back-off, and rocking bar is buckled on the back-off.
Outstanding effect of the present utility model is:
1), adsorption cover is provided with a projection, when CPU is installed to down cover after, loam cake and lower cover are fastened, the upper surface of CPU can back down adsorption cover, need not the hand disassembly adsorption cover, and is time saving and energy saving.
2), when loam cake and lower cover fasten, on cover the below that projection is pressed in rocking bar, rocking bar is fastened on the back-off of lower cover simultaneously, makes to fasten between the utility model loam cake and the lower cover closely, firmly.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the schematic perspective view of adsorption cover;
Fig. 3 is the schematic perspective view of lower cover.
Embodiment
Embodiment sees Fig. 1~3, a kind of lga socket structure-improved, and the loam cake 1 of socket is fastened on the lower cover 2, and buckle has adsorption cover 3 on the loam cake 1, and adsorption cover 3 is provided with a projection 31.This projection 31 is injection-moulded in the position after the leaning on of adsorption cover 3.The front end of loam cake 1 be provided with the projection 11, rocking bar 4 is contained on the lower cover 2, this projection 11 should be pressed in rocking bar 4 arc folding part 41 below.One side of lower cover 2 is provided with back-off 21, and rocking bar 4 is buckled on the back-off 21.
Operation principle: adsorption cover 3 is provided with a projection 31, and after CPU being installed on the lower cover 2, when loam cake 1 was fastened with lower cover 2, the upper surface of CPU5 can back down adsorption cover, need not the hand disassembly adsorption cover, and was time saving and energy saving.When loam cake 1 and lower cover 2 fastenings, there is projection 11 to be pressed in the below of rocking bar 4 on the loam cake 1, rocking bar 4 is fastened on the back-off 21 of lower cover 2 simultaneously, makes that fastening is more tight, firm between the utility model loam cake 1 and the lower cover 2.

Claims (4)

1, a kind of lga socket structure-improved, the loam cake of socket (1) are fastened on the lower cover (2), and loam cake (1) is gone up buckle adsorption cover (3), and it is characterized in that: adsorption cover (3) is provided with a projection (31).
2, a kind of lga socket structure-improved according to claim 1, it is characterized in that: this projection (31) is injection-moulded in the position after the leaning on of adsorption cover (3).
3, a kind of lga socket structure-improved according to claim 1, it is characterized in that: the front end of loam cake (1) is provided with projection (11), rocking bar (4) is contained on the lower cover (2), this projection (11) be pressed in rocking bar (4) arc folding part (41) below.
4, a kind of lga socket structure-improved according to claim 1, it is characterized in that: a side of lower cover (2) is provided with back-off (21), and rocking bar (4) is buckled on the back-off (21).
CN 200420094830 2004-11-09 2004-11-09 An improved structure of LGA socket Expired - Fee Related CN2750507Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420094830 CN2750507Y (en) 2004-11-09 2004-11-09 An improved structure of LGA socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200420094830 CN2750507Y (en) 2004-11-09 2004-11-09 An improved structure of LGA socket

Publications (1)

Publication Number Publication Date
CN2750507Y true CN2750507Y (en) 2006-01-04

Family

ID=35823883

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200420094830 Expired - Fee Related CN2750507Y (en) 2004-11-09 2004-11-09 An improved structure of LGA socket

Country Status (1)

Country Link
CN (1) CN2750507Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113414563A (en) * 2021-07-16 2021-09-21 重庆航天职业技术学院 Computer CPU's dismantlement equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113414563A (en) * 2021-07-16 2021-09-21 重庆航天职业技术学院 Computer CPU's dismantlement equipment
CN113414563B (en) * 2021-07-16 2022-07-05 重庆航天职业技术学院 Computer CPU's dismantlement equipment

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060104

Termination date: 20091209