CN2747707Y - Automatic temperature-controlling, cooling and pressuring chip-sticking machine - Google Patents
Automatic temperature-controlling, cooling and pressuring chip-sticking machine Download PDFInfo
- Publication number
- CN2747707Y CN2747707Y CN 200420113106 CN200420113106U CN2747707Y CN 2747707 Y CN2747707 Y CN 2747707Y CN 200420113106 CN200420113106 CN 200420113106 CN 200420113106 U CN200420113106 U CN 200420113106U CN 2747707 Y CN2747707 Y CN 2747707Y
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- CN
- China
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- platform
- cooling
- heating
- pressurization
- casing frame
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- Expired - Fee Related
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Abstract
The utility model relates to a machine work appliance, particularly relates to an automatic temperature-controlling, cooling and pressuring chip-sticking machine for grinding and polishing. Heating, wind cooling and pressurization which are taken as ordinary mature technology are combined into a whole artfully according to chip-sticking technology requirements, and thereby, divided procedures are designed into one procedure. The utility model is composed of a heating platform, a cooling platform, a pressurization cover and a casing framework, three procedures of heating, cooling and pressurization are integrated into a whole, and the heating platform is arranged in heat insulation material filled in an inner surface layer of a concave square body of a casing frame. A blower is arranged in the cooling platform at the right side of the casing frame, a plurality of ventilation holes are arranged on the casing frame, the heating platform is provided with a pressurization platform and a plurality of poises with different weights, and the cooling platform is provided with an air pressure or hydraulic device.
Description
Technical field
The utility model relates to a kind of machining equipment, particularly a kind of can be temperature automatically controlled, cool off, be pressurised into one for grind, the die Bonder of polishing usefulness.
Background technology
Heater, blower fan technology that existing market is sold are all very ripe, and the gravity block pressurization is more original, adopt adjustable air pressure or the hydraulic pressure neither what difficult problem exactly.And cooperate to grind, during the polishing sizing, technology is in the past separated, i.e. heating platform use in heating, is placed on during cooling that natural room temperature cools off on the workbench, pressurizes often with hand once.Especially produce in the experiment at IC, the grinding that this method is brought, polishing consequence are serious, directly have influence on grinding, quality of finish or rate of finished products.The purpose of heating is to make bonding waxization, and temperature control is to reach the molten point of wax get final product, can not height can not be low, heating-up temperature is higher than the molten point of wax, wax just can the Xi makes the attenuation of wax layer, the reduction adhesive strength.Heating-up temperature is lower than the molten point of wax, and wax has granule because of changing not open, and makes bonding plane uneven and cause by the plane misalignment of adhesives and material containing piece basal plane, and this is one of factor that causes in waste product.Adopting air-cooledly, mainly is to raise the efficiency to save time, and pressurization is an important ring, main get rid of the bubble that dissolves in the wax solution of back and pressure make by adhesives parallel with material containing piece basal plane, the distortion when solution reduces to cool off simultaneously.
Summary of the invention
The purpose of this utility model provides a kind of die Bonder that heating, cooling, pressurization are lumped together that collects, it can gather heating, cooling, the pressurization operation of carrying out in the bonding die process easily, to improve the bonding die quality, to reduce the number of rejects and seconds, for grinder, polishing machine provide reasonable, proper auxiliary products.
The purpose of this utility model is achieved through the following technical solutions:
Temperature automatically controlled, the die Bonder of cooling off, pressurize, it is by heating platform and chill station and add gland, Casing frame is formed, the heating, the cooling, the pressurization three part operations integrated, heating platform is installed among the heat-barrier material, heat-barrier material is filled in the recessed square endosexine of Casing frame.Blower fan is installed in Casing frame the inside and keeps right in the chill station on limit, and the upper end is equipped with several ventilation holes, and each installs pressurization platform on heating platform and chill station.The pressurization platform of installing on heating platform is furnished with the some counterweights that vary in weight, and the pressurization platform of installing on chill station is equipped with air pressure or hydraulic means.
Advantage of the present utility model and effect are:
One. the utility model is simple in structure, easy to use.
Two. heating, air cooling, pressurization are considered as usual mature technology, are combined into one dexterously, thereby make the operation of separation be designed to one procedure by the paster technique requirement.
Description of drawings
Accompanying drawing is an overall structure schematic diagram of the present utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is further described:
Heating platform among the figure (3) is made up of heating element, thermoelectric corner and controller; Heating platform is placed in the heat-barrier material (2), and heat-barrier material is filled in the pit of Casing frame (1).Blower fan (11) is housed on the chill station (10), and Casing frame (1) surface directly over the corresponding blower fan (11) has some ventilation holes of getting through (9); On Casing frame (1), an end of close chill station (10) is equipped with support (8), is fixed with air pressure or hydraulic means (6--2) on the support.
During work, material containing piece (4) is lain in heating platform (3), go up the tiling bonding wax layer of one deck (5) at material containing piece (4), be by adhesives (7) on the wax layer, material containing piece, bonding wax layer, be clipped between pressurization platform (6) and the heating platform (3) by adhesives, after finishing the heating and pressurizing operation, material containing piece, bonding wax layer, changed over to automatically by adhesives and to finish cooling pressurization operation on the chill station (10).In the heating process, on pressurization platform (6) pressurization of finishing by balancing weight counterweight (6-1); And in refrigerating work procedure, be the pressurization of leaning on air pressure or hydraulic means (6-2) to finish on pressurization platform (6).
Claims (2)
1. temperature automatically controlled, the die Bonder of cooling off, pressurize, by heating platform and chill station and add gland, Casing frame is formed, it is characterized in that: heating platform (3) is installed among the heat-barrier material (2), and heat-barrier material (2) is filled in the recessed square endosexine of Casing frame (1); Blower fan (11) is installed in Casing frame (1) the inside and keeps right in the chill station (10) on limit, and the upper end is equipped with several ventilation holes (9); Go up each installation pressurization platform (6) at heating platform (3) and chill station (10).
2. temperature automatically controlled, the die Bonder of cooling off, pressurize as claimed in claim 1, it is characterized in that: go up the pressurization platform of installing (6) at heating platform (3) and be furnished with the some counterweights that vary in weight (6-1), go up the pressurization platform of installing (6) in chill station (10) air pressure or hydraulic means (6-2) are housed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420113106 CN2747707Y (en) | 2004-11-09 | 2004-11-09 | Automatic temperature-controlling, cooling and pressuring chip-sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420113106 CN2747707Y (en) | 2004-11-09 | 2004-11-09 | Automatic temperature-controlling, cooling and pressuring chip-sticking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2747707Y true CN2747707Y (en) | 2005-12-21 |
Family
ID=35708247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420113106 Expired - Fee Related CN2747707Y (en) | 2004-11-09 | 2004-11-09 | Automatic temperature-controlling, cooling and pressuring chip-sticking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2747707Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152218A (en) * | 2010-12-30 | 2011-08-17 | 青岛嘉星晶电科技股份有限公司 | Wafer polishing device |
| CN102938388A (en) * | 2012-11-19 | 2013-02-20 | 大连佳峰电子有限公司 | Transparent cover plates of heat engine track |
| CN112427762A (en) * | 2020-11-04 | 2021-03-02 | 宁波江丰电子材料股份有限公司 | Target welding and cooling integrated device and operation method thereof |
-
2004
- 2004-11-09 CN CN 200420113106 patent/CN2747707Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152218A (en) * | 2010-12-30 | 2011-08-17 | 青岛嘉星晶电科技股份有限公司 | Wafer polishing device |
| CN102938388A (en) * | 2012-11-19 | 2013-02-20 | 大连佳峰电子有限公司 | Transparent cover plates of heat engine track |
| CN102938388B (en) * | 2012-11-19 | 2014-12-31 | 大连佳峰电子有限公司 | Transparent cover plates of heat engine track |
| CN112427762A (en) * | 2020-11-04 | 2021-03-02 | 宁波江丰电子材料股份有限公司 | Target welding and cooling integrated device and operation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |