CN2736898Y - A surface-mount electrical overload protector - Google Patents
A surface-mount electrical overload protector Download PDFInfo
- Publication number
- CN2736898Y CN2736898Y CN 200420064940 CN200420064940U CN2736898Y CN 2736898 Y CN2736898 Y CN 2736898Y CN 200420064940 CN200420064940 CN 200420064940 CN 200420064940 U CN200420064940 U CN 200420064940U CN 2736898 Y CN2736898 Y CN 2736898Y
- Authority
- CN
- China
- Prior art keywords
- electrode
- hole
- holes
- insulation
- top electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Emergency Protection Circuit Devices (AREA)
Abstract
The utility model relates to a surface-mount electrical overload protector, relating to a damage protector used for protecting the electric line and an element without receiving electric overload, such as electrostatic discharge, electric fast transient and lightning sense. An insulation material sheet is added between the electrode of two parallel conducting body sheets, and a metal-insulation-metal sandwich structure is molded; the sandwich board is provided with one or more through holes, the polymers electric voltage mutagenesis materials are loaded with the through holes, the external through holes are encapsulated through the insulating encapsulating material, the top and the bottom end heads are provided with welded joints which are welded with the element, and the welded joint is connected through a conductive path. Owing to the both sides welding point design of the utility model, and the encapsulating process is simplified; the fault incidence rate during the assembly process of a circuit board is reduced; the sandwich stacking through holes structure increases the effective efficiency area of the element, and the electrode spacing is homogeneous, precise and stable; the reliability and the uniformity of the element function are improved, and the capacitance value of the element is reduced; the fidelity ability of the utility model in a high-frequency circuit is improved.
Description
Technical field the utility model relates to a kind of protection electric wiring and element is avoided electrical overloads, as the injury protection device of Electrostatic Discharge, electric fast transition and lightning induction etc.
Background technology is along with our world enters into the information age, and the general trend of electronic product is miniaturization, high frequencyization.Circuit designers has adopted compound very lagre scale integrated circuit (VLSIC) (VLSI) and new IC technology.Yet, use these technology to make the easier trick of electronic equipment be subjected to the damage of electrical overloads (as Electrostatic Discharge, electric fast transition and lightning induction etc.).To electronic component, particularly high density integrated package electronic component has great threat.Because the electrical overloads phenomenon can cause localized heat to produce, high current density, high electric field strength may cause electronic component to lose efficacy, burns as semiconductor element,, perhaps cause electronic jamming,, as the data that lose transmission and store.Wherein, Electro-Static Discharge (ESD) is that electronic product is in assembling, a kind of modal electrical overloads phenomenon in the use.ESD is a kind of quick, low-yield, the form of energy that peak value piezoelectricity is high, and to electronic component, particularly high density integrated package electronic component has great threat.Portable type electronic product is subjected to the damage of the ESD of human body contact generation especially easily.Electrostatic hazard has caused quite serious consequence and loss, and potential loss, and as in aerospace industry, static discharge causes rocket and satellites transmits failure, disturbs the operation of aerospace craft, and electronic equipment is malfunctioning etc. on the battlefield, and is then beyond measure.
Traditional electrical overloads protection product, as variable resistor and Zener diode, transient voltage inhibitor TVS etc. is to be made by metal oxide materials or semiconductor silicon material.Since these dielectric material performances, the limitation of processing characteristics, made component size is big, and the manufacturing process complexity especially has very high capacitance, can cause the distortion of digital signal in high-frequency circuit.Therefore, be not suitable for the protection of high frequency microelectronic circuit.
The novel electrical overloads protection component that utilizes polymer voltage mutant materials and make have very low electric capacity processing and forming easily thereby, can be used in the protection of high frequency microelectronic circuit widely, have high degree market potential.But polymer surface-mount type electrical overloads protection component in the market has following defective:
(1) all can only carry out single face and install, this brings challenges for the winding belt package of element, and has increased circuit board assembling production cost and percent defective;
What (2) electrode design adopted is the plane clearance formula, by the restriction of what component size, adopts this design to make the effective efficiency area of element, and the area that can transmit electronics between two electrodes is very little.
(3) carve the technology in gap on the plane of Cai Yonging, regular meeting causes die opening inhomogeneous, thereby the reliability of element function and consistency are reduced.Owing to above-mentioned defective is arranged, has reduced the range of application of this class new product.
The summary of the invention the purpose of this utility model is at above-mentioned present situation, aims to provide a kind of can two-sided installation being welded on the circuit board, and the effective efficiency area is big, the surface-mount type electrical overloads protector of electrode spacing good uniformity.
The implementation of the utility model purpose is: a kind of surface-mount type electrical overloads protector; with two parallel conductor pieces as electrode 1,2; between them, add certain thickness sheet of insulation 3; form the sandwich structure of metal-insulator-metal; vertically open one or more through holes at filled board; the polymer voltage mutant materials 4 of packing in the through hole; top electrodes 1 and 5 encapsulation of bottom electrode 2 external application insulation-encapsulated materials; there is the plumb joint 6 with the element welding top and termination, bottom, and plumb joint connects by conductive path 7.
The beneficial effects of the utility model are by the design of welding by both sides contact, to have simplified the component orientations operation, i.e. packaging process; Reduced the fault in the wiring board installation process,, leaked weldering, the incidence that element is inverted, element is lost etc. as, sealing-off; Sandwich stacked through-hole structure increases element effective efficiency area, makes the even, accurate, stable of electrode spacing, thereby can improve the reliability of element function, homogeneity; The capacitance of sandwich stacked through-hole structure design minimizing element is of value to the fidelity ability of polymer surface-mount type electrical overloads protection component in high-frequency circuit that improve.
Description of drawings
Fig. 1 the utility model structural representation
Fig. 2 the utility model protective circuit schematic diagram
The utility model structural representation of Fig. 3 single line double-faced packaging
The utility model structural representation of the multi-thread double-faced packaging of Fig. 4
Fig. 5 has the utility model structural representation of multi sandwich stacked through hole
The A-A cut-away view of Fig. 6 Fig. 6.
The B-B cut-away view of Fig. 7 Fig. 6
Fig. 8 has the utility model structural representation of array weldering node encapsulation
The via-hole array distribution schematic diagram of Fig. 9 Fig. 9
Figure 10 is the A-A cut-away view of Fig. 9
Embodiment is with reference to Fig. 1, the utility model with two parallel conductor pieces as electrode 1,2, between them, add certain thickness sheet of insulation 3, form the sandwich structure of metal-insulator-metal, vertically open one or more through holes at filled board, the polymer voltage mutant materials 4 of packing in the through hole, polymer voltage mutant materials has non-linear conductive characteristic, in low-voltage state, the resistivity of polymer voltage mutant materials is very high, is insulator; When voltage reaches a certain high-voltage value, during critical voltage, the resistivity of polymer voltage mutant materials sharply reduces, and becomes electric conductor.
There is the plumb joint 6 with the element welding top and termination, bottom, thereby make any one side of element can be used for being installed on the circuit board.Plumb joint connects by conductive path 7; when circuit meets with the electrical overloads impact; it is very low that the resistance of polymer mutant materials becomes; therefore; by the electric current that electrical overloads produced;, by polymer voltage mutant materials another electrode of flowing through the excess energy that is produced is discharged from an electrode, thereby realize protection other elements in the circuit.
With reference to Fig. 2, the utility model 8 joins with the end of incoming cables and the ground wire 10 of protected element or circuit 9 in circuit.When circuit was subjected to electrical overloads, the resistivity of polymer voltage mutant materials 4 became very low, made the overload current 11 that is produced flow into ground wire through the utility model.Thereby protected element or circuit 9 have been protected.
With reference to Fig. 3, the sandwich of layers structure is made by the raw material-double face copper commonly used in the printed circuit, and top electrodes 1, bottom electrode 2 are metal forming, and sheet of insulation 3 is the uniform paper of thickness, polyester, phenolic resins/glass, epoxy resin/glass, pi etc.The insulation-encapsulated material can be various encapsulating materials commonly used in the electronic component, as, epoxy resin, silicon rubber, pottery, glass etc.Top electrodes 1 is connected with plumb joint 12,13 respectively with 2 of bottom electrodes.
With reference to Fig. 4,5,6,7; the Copper Foil of top electrodes 1, bottom electrode 2 is through scribing pattern as shown in Figure 5; be formed with many group top electrodes 14 and many group bottom electrodes 15; every group of electrode made a call to a through hole 16 and connected; in each through hole, load polymer voltage mutant materials 4, between two electrodes, form many bar protective circuits.The electrode 14 of each group is connected with plumb joint 12,13 respectively with 15, can protect many circuits.
With reference to Fig. 8,9,10; sandwich of layers is made a call to one group of through hole 16 with array distribution shown in Figure 9; load polymer voltage mutant materials 4 in each through hole, top electrodes 1, bottom electrode 2 are divided into multi-group electrode 17,18 by through hole 16, form many bar protective circuits between two electrodes.As shown in figure 10, top electrodes 17 via through holes link to each other with ground line weld joint 19, and bottom electrode 18 links to each other with each bar protection circuit plumb joint 20.
Claims (4)
1, a kind of surface-mount type electrical overloads protector; it is characterized in that with two parallel conductor pieces as electrode (1), (2); between them, add certain thickness sheet of insulation (3); form the sandwich structure of metal-insulation-metal; vertically open one or more through holes at filled board; the polymer voltage mutant materials (4) of packing in the through hole; top electrodes (1) and bottom electrode (2) external application insulation-encapsulated material (5) encapsulation; there is the plumb joint (6) with the element welding top and termination, bottom, and plumb joint connects by conductive path (7).
2, a kind of surface-mount type electrical overloads protector according to claim 1 is characterized in that top electrodes (1), bottom electrode (2) are metal forming, and sheet of insulation (3) is the uniform paper of thickness; polyester; phenolic resins/glass, epoxy resin/glass, pi.
3, a kind of surface-mount type electrical overloads protector according to claim 1; the Copper Foil that it is characterized in that top electrodes (1), bottom electrode (2) becomes to have many group top electrodes (14) and many group bottom electrodes (15) through scribing; every group of electrode made a call to a through hole (16) and connected; load polymer voltage mutant materials (4) in each through hole, the electrode (14) of each group is connected with plumb joint (12), (13) respectively with (15).
4, a kind of surface-mount type electrical overloads protector according to claim 1; it is characterized in that sandwich of layers makes a call to one group of through hole (16); load polymer voltage mutant materials (4) in each through hole; top electrodes (1), bottom electrode (2) are divided into multi-group electrode (17), (18) by through hole (16); top electrodes (17) via through holes links to each other with ground line weld joint (19), and bottom electrode (18) links to each other with each bar protection circuit plumb joint (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420064940 CN2736898Y (en) | 2004-06-15 | 2004-06-15 | A surface-mount electrical overload protector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420064940 CN2736898Y (en) | 2004-06-15 | 2004-06-15 | A surface-mount electrical overload protector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2736898Y true CN2736898Y (en) | 2005-10-26 |
Family
ID=35307626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420064940 Expired - Fee Related CN2736898Y (en) | 2004-06-15 | 2004-06-15 | A surface-mount electrical overload protector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2736898Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101557069A (en) * | 2008-04-04 | 2009-10-14 | 力特保险丝公司 | Incorporation of electrostatic protection into miniature connectors |
| CN101079342B (en) * | 2007-05-28 | 2010-09-08 | 上海神沃电子有限公司 | Surface mounted macromolecule ESD protection part and its making method |
-
2004
- 2004-06-15 CN CN 200420064940 patent/CN2736898Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101079342B (en) * | 2007-05-28 | 2010-09-08 | 上海神沃电子有限公司 | Surface mounted macromolecule ESD protection part and its making method |
| CN101557069A (en) * | 2008-04-04 | 2009-10-14 | 力特保险丝公司 | Incorporation of electrostatic protection into miniature connectors |
| CN101557069B (en) * | 2008-04-04 | 2013-11-20 | 力特保险丝公司 | Incorporation of electrostatic protection into miniature connectors |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7202770B2 (en) | Voltage variable material for direct application and devices employing same | |
| CN101354937B (en) | Integrated thermistor and metallic element device and method | |
| US7218492B2 (en) | Devices and systems for electrostatic discharge suppression | |
| US6570765B2 (en) | Over-voltage protection for electronic circuits | |
| US7180719B2 (en) | Integrated overvoltage and overcurrent device | |
| CN101116155A (en) | Electrostatic discharge protection for embedded components | |
| CN102860141A (en) | Electric discharge protection for surface mounted and embedded components | |
| CN1897785A (en) | System and method for electrostatic discharge protection in an electronic circuit | |
| JP2017152711A (en) | Perpendicular switching configuration for esd protection | |
| EP1570496B1 (en) | Conductive polymer device and method of manufacturing same | |
| CN101896981A (en) | High voltage surge arrester and method of operating the same | |
| WO2012061838A1 (en) | System and method for protecting a computing device using vsd material, and method for designing same | |
| US9082622B2 (en) | Circuit elements comprising ferroic materials | |
| CN1755865B (en) | Over-voltage and over-current protector for symmetrical structure | |
| WO2017024981A1 (en) | Port-protected circuit-integration package | |
| CN2736898Y (en) | A surface-mount electrical overload protector | |
| KR20170141039A (en) | Board and manufacturing method thereof | |
| CN202068672U (en) | Printed circuit board capable of preventing instant electric overload | |
| CN2575817Y (en) | Arc contactor module | |
| CN201796883U (en) | Integrated circuit packaging block with resistance to instantaneous electric overload | |
| EP2577716A1 (en) | Circuit elements comprising ferroic materials | |
| CN206922427U (en) | Network's thunder device | |
| CN2789897Y (en) | Overcurrent protection component | |
| CN2786847Y (en) | Meter paste type over current and over voltage integrated protector | |
| WO2021195871A1 (en) | Embedded substrate, circuit board assembly, and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051026 Termination date: 20130615 |