CN2711529Y - Radiation structure for LED lamp - Google Patents
Radiation structure for LED lamp Download PDFInfo
- Publication number
- CN2711529Y CN2711529Y CNU2004200243927U CN200420024392U CN2711529Y CN 2711529 Y CN2711529 Y CN 2711529Y CN U2004200243927 U CNU2004200243927 U CN U2004200243927U CN 200420024392 U CN200420024392 U CN 200420024392U CN 2711529 Y CN2711529 Y CN 2711529Y
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- CN
- China
- Prior art keywords
- metal shade
- led light
- radiator structure
- heat
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The aim of the utility model is to provide a heat dissipation structure for luminous diode lamps, which has the advantages of light weight, low cost and good heat dispersion effect. The utility model is realized in the way that the heat dissipation structure for luminous diode lamps comprises an electric connector and a driver, and is also provided with a metal lamp shade in which a luminous diode chip is arranged. Because the metal lamp shade can perform the function of heat dissipation and exert the function of a lampshade, the lamp shade and the heat dissipation structure of the luminous diode lamps are combined into a whole without adding a heat dissipation device so as to lighten the weight and reduce the cost.
Description
Technical field
The utility model relates to a kind of radiator structure of lamp, particularly about the radiator structure of LED light lamp.
Background technology
Chinese patent ZL02206241.6 discloses a kind of large-power light-emitting diodes lamp, it comprises a light-emitting device that at least one LED core is installed, a printing opacity cell-shell, driver and shell thereof, an arrangements of electric connection, LED core is installed on the high thermal conductive substrate, and substrate contacts with a heat abstractor close thermal; The radiator structure of this large-power light-emitting diodes lamp is that a heat abstractor is set between printing opacity cell-shell and arrangements of electric connection, and weight is heavier, and cost is higher, and the effect of heat radiation is also relatively poor.
Summary of the invention
The purpose of this utility model is to provide weight lighter, and cost is lower, and the radiating effect radiator structure of LED light lamp preferably.
The utility model is achieved in that a kind of radiator structure of LED light lamp, comprises electric connector, driver, also is provided with metal shade, and light-emitting diode chip for backlight unit is installed in the metal shade.
Above-mentioned light-emitting diode chip for backlight unit is installed on the inner surface of metal shade.
Above-mentioned light-emitting diode chip for backlight unit is installed on the heat-conducting substrate, and heat-conducting substrate closely contacts with metal shade.
Because metal shade can play thermolysis, can also bring into play the function of lampshade, like this, the lampshade of LED light lamp and radiator structure is integrated, and needn't increase heat abstractor again, has alleviated weight, has reduced cost; In addition, owing to adopt metal shade to replace the glass cell-shell, can play thermolysis, increase area of dissipation, have better radiating effect in the uncovered part of metal shade and metal shade.
Description of drawings
Fig. 1 is the prior art constructions schematic diagram.
Fig. 2 is embodiment cutaway view of the utility model.
Fig. 3 is the cutaway view of second embodiment of the utility model.
Fig. 4 is the vertical view of second embodiment of the utility model.
Fig. 5 is the cutaway view of the 3rd embodiment of the utility model.
Fig. 6 is the stereogram of the 3rd embodiment of the utility model.
The specific embodiment
A kind of radiator structure of LED light lamp comprises electric connector 1, driver 2, also is provided with metal shade 5, and light-emitting diode chip for backlight unit 4 is installed in the metal shade 5.
A kind of embodiment as shown in Figure 2, above-mentioned light-emitting diode chip for backlight unit 4 is installed on the inner surface of metal shade 5.
A kind of embodiment shown in Fig. 3,4,5,6, above-mentioned light-emitting diode chip for backlight unit 4 is installed on the heat-conducting substrate 3, and heat-conducting substrate 3 closely contacts with metal shade 5.
Above-mentioned metal shade 5 can be column type shown in as shown in Figure 2 pyramid type, the trumpet type, Fig. 5,6 shown in Fig. 3,4, also can be the different shapes such as external form of various conventional lights, its material is a Heat Conduction Material, can be the alloy of aluminium, copper, iron, zinc etc. or this metalloid.
As shown in Figure 2, light-emitting diode chip for backlight unit 4 is fixed on the bottom of metal shade 5, is provided with driver 2, electric connector 1 on the top of metal shade 5; Driver 2 and electric connector 1 can separate insulation with insulating materials and metal shade, also driver 2 can be placed the outside of metal shade 5, have the hole at the top of metal shade 5, and lead can link to each other by the power supply or the electric connector of this Kong Bingyu outside.
Shown in Fig. 3,4, above metal shade 5, be provided with the column type cavity and match with metal shade 5, can be provided with driver 2, electric connector 1 in it.
Shown in Fig. 5,6, in the upper fixed of metal shade 5 locking device 51 is arranged, this locking device 51 can be fixed on LED light lamp on the ceiling.
Shown in Fig. 3,4, below light-emitting diode chip for backlight unit 4, in the metal shade 5, can be provided with reverberation bowl 31, be used for the light of light-emitting diode chip for backlight unit is concentrated.Open-mouth at metal shade 5 is equipped with a transparent glass cover 32, can make flat board or concave, convex mirror according to different needs, inner surface at the transparent glass cover can be handled the surface according to different needs, to reach different color, vision, optical effects; The transparent glass cover also can be plastics or other light transmissive materials.
Shown in Fig. 3,4, radiator 33 that can one-body molded different shape outside metal shade 5 is as strip, column, sheet or other shapes of being convenient to dispel the heat.
Shown in Fig. 2,5,6, in the bottom of metal shade 5, can open one or more hole 52, light from then on hole penetrates, with thus increasing heat radiation effect.
External power source links to each other with light-emitting diode chip for backlight unit 4 by electric connector 1, driver 2, makes light-emitting diode chip for backlight unit 4 luminous; Can series, parallel or string and company between the light-emitting diode chip for backlight unit 4, light-emitting diode chip for backlight unit 4 can be directly installed on metal shade 5 inner surfaces, light-emitting diode chip for backlight unit 4 also can be fixed on the heat-conducting substrate 3, heat-conducting substrate 3 can be metal substrate, material as aluminium, copper etc. or other high thermal conductivities, heat-conducting substrate 3 also can be an epoxy resin base plate, and heat-conducting substrate 3 can be that curved surface also can be the plane.
Like this, light-emitting diode chip for backlight unit 4 can directly be fixed on metal shade 5 inner surfaces, and long-pending heat can promptly conduct on the light emitting diode 4, metal shade 5 is lampshades, also can be used as radiator and heat-conducting substrate, has alleviated weight, reduce cost, also had better heat radiating effect; In addition, according to different processing technologys, light-emitting diode chip for backlight unit 4 is fixed on the heat-conducting substrate 3, and heat-conducting substrate 3 closely contacts with metal shade 5, also the heat of assembling on the heat-conducting substrate 3 can promptly can be conducted; The heat of the light that light-emitting diode chip for backlight unit 4 sends also can be absorbed rapidly by the uncovered part of metal shade 5, and air outside is given in conduction rapidly.
Claims (11)
1, a kind of radiator structure of LED light lamp comprises electric connector, driver, and light-emitting diode chip for backlight unit is characterized in that: light-emitting diode chip for backlight unit is installed in the metal shade.
2, the radiator structure of a kind of LED light lamp as claimed in claim 1 is characterized in that: light-emitting diode chip for backlight unit is installed on the inner surface of metal shade.
3, the radiator structure of a kind of LED light lamp as claimed in claim 2 is characterized in that: light-emitting diode chip for backlight unit is installed on the heat-conducting substrate, and heat-conducting substrate closely contacts with metal shade.
4, as the radiator structure of claim 1,2 or 3 described a kind of LED light lamps; It is characterized in that: metal shade is pyramid type, trumpet type or column type.
5, as the radiator structure of claim 1,2 or 3 described a kind of LED light lamps; It is characterized in that: in the metal shade, can be provided with reverberation bowl.
6, as the radiator structure of claim 1,2 or 3 described a kind of LED light lamps; It is characterized in that: the open-mouth at metal shade is equipped with a transparent glass cover.
7, as the radiator structure of claim 1,2 or 3 described a kind of LED light lamps; It is characterized in that: heat-conducting substrate is plane or curved substrate.
8, as the radiator structure of claim 1,2 or 3 described a kind of LED light lamps; It is characterized in that: can one-body molded radiator outside metal shade, radiator is that strip, column, sheet or other are convenient to the shape of dispelling the heat.
9, the radiator structure of a kind of LED light lamp as claimed in claim 1; It is characterized in that:, can open one or more hole in the bottom of metal shade.
10, the radiator structure of a kind of LED light lamp as claimed in claim 1; It is characterized in that: metal shade directly suspends in midair to be fixed on the ceiling or by mechanical gripping mechanism by power line and directly is fixed on the wall.
11, the radiator structure of a kind of LED light lamp as claimed in claim 1; It is characterized in that: driver places in the metal shade or places the metal shade outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200243927U CN2711529Y (en) | 2004-01-15 | 2004-01-15 | Radiation structure for LED lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200243927U CN2711529Y (en) | 2004-01-15 | 2004-01-15 | Radiation structure for LED lamp |
Publications (1)
Publication Number | Publication Date |
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CN2711529Y true CN2711529Y (en) | 2005-07-20 |
Family
ID=36192634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2004200243927U Expired - Fee Related CN2711529Y (en) | 2004-01-15 | 2004-01-15 | Radiation structure for LED lamp |
Country Status (1)
Country | Link |
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CN (1) | CN2711529Y (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101220943B (en) * | 2007-05-14 | 2010-05-26 | 杨世红 | Integral LED lamp |
CN101975340A (en) * | 2010-08-06 | 2011-02-16 | 敬俊 | Packaging structure of luminous semiconductor chip and packaging method thereof |
CN102865468A (en) * | 2011-07-06 | 2013-01-09 | 光远科技股份有限公司 | Light emitting bulb |
CN103208574A (en) * | 2012-01-13 | 2013-07-17 | 重庆四联光电科技有限公司 | Light emitting diode (LED) packaging structure |
CN105179979A (en) * | 2015-10-19 | 2015-12-23 | 厦门多彩光电子科技有限公司 | LED lamp |
-
2004
- 2004-01-15 CN CNU2004200243927U patent/CN2711529Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101220943B (en) * | 2007-05-14 | 2010-05-26 | 杨世红 | Integral LED lamp |
CN101975340A (en) * | 2010-08-06 | 2011-02-16 | 敬俊 | Packaging structure of luminous semiconductor chip and packaging method thereof |
CN102865468A (en) * | 2011-07-06 | 2013-01-09 | 光远科技股份有限公司 | Light emitting bulb |
CN103208574A (en) * | 2012-01-13 | 2013-07-17 | 重庆四联光电科技有限公司 | Light emitting diode (LED) packaging structure |
CN103208574B (en) * | 2012-01-13 | 2016-04-13 | 重庆四联光电科技有限公司 | LED encapsulation structure |
CN105179979A (en) * | 2015-10-19 | 2015-12-23 | 厦门多彩光电子科技有限公司 | LED lamp |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050720 Termination date: 20110115 |