CN2691210Y - Positioning device with vacuum suction effect - Google Patents

Positioning device with vacuum suction effect Download PDF

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Publication number
CN2691210Y
CN2691210Y CN 200420003843 CN200420003843U CN2691210Y CN 2691210 Y CN2691210 Y CN 2691210Y CN 200420003843 CN200420003843 CN 200420003843 CN 200420003843 U CN200420003843 U CN 200420003843U CN 2691210 Y CN2691210 Y CN 2691210Y
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bakelite
substrate
vacuum suction
positioning
vacuum
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CN 200420003843
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方思巽
刘建成
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Sogotec Enterprise Co Ltd
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Sogotec Enterprise Co Ltd
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Abstract

本实用新型是关于一种具真空吸引效果的定位装置,其主要包括有一真空抽气平台、至少一块放于真空抽气平台上的基板,与分置在基板上或基板之间的至少一个的电木元件,每一个电木元件上分别形成有至少一个定位孔,在本实用新型的中利用电木元件上所设的定位孔,来和一电路板以固锁件相结合定位,由于电木元件设孔后仍可以保持平整,因此能让电路板与基板之间保持贴合平整,可达到在定位效果以外,同时保有良好真空吸引的特性,以增加电路板制作操作时的稳定性。

Figure 200420003843

The utility model relates to a positioning device with a vacuum suction effect, which mainly comprises a vacuum pumping platform, at least one substrate placed on the vacuum pumping platform, and at least one bakelite component disposed on or between the substrates, each bakelite component is respectively formed with at least one positioning hole. In the utility model, the positioning holes provided on the bakelite component are used to combine with a circuit board with a locking piece for positioning. Since the bakelite component can still remain flat after the holes are provided, the circuit board and the substrate can be kept flat and fitted, so that in addition to the positioning effect, a good vacuum suction characteristic can be maintained to increase the stability during the circuit board manufacturing operation.

Figure 200420003843

Description

具真空吸引效果的定位装置Positioning device with vacuum suction effect

【技术领域】【Technical field】

本实用新型是关于一种具真空吸引效果的定位装置,特别是一种用于电路板制造程序中,可同时兼具良好真空吸引效果的定位装置。The utility model relates to a positioning device with a vacuum suction effect, in particular to a positioning device which is used in the circuit board manufacturing process and can simultaneously have a good vacuum suction effect.

【背景技术】【Background technique】

一般习用的电路板加工程序,是先将一工作台面钻孔打钉(pin)固定,然后再将电路板置于工作台面上定位,因为工作台面上所用的钻孔基板为电木板,具有透气性而不能气密,因此没有真空吸附的功能,而一般有真空吸附功能的装置,又不能兼具钻孔打钉的定位功能,若工作台面上所用的吸附基板为铝板,而铝板在经过钻孔后会产生不平整的表面,并不适合钻孔形成定位装置,因此,现阶段的电路板加工程序中并没有可以兼具真空吸引效果与定位效果的装置。The usual circuit board processing procedure is to first drill a work surface and nail (pin) to fix it, and then place the circuit board on the work surface for positioning, because the drilling substrate used on the work surface is a bakelite board, which has air It is not airtight, so there is no vacuum adsorption function, and generally the device with vacuum adsorption function cannot also have the positioning function of drilling and nailing. If the adsorption substrate used on the worktable is an aluminum plate, and the aluminum plate is drilled There will be an uneven surface after the hole, which is not suitable for drilling to form a positioning device. Therefore, there is no device that can have both vacuum suction and positioning effects in the current circuit board processing program.

【实用新型内容】【Content of utility model】

有鉴于习用电路板制造程序中缺少一种兼具真空吸引效果与定位效果的装置,本实用新型的目的在于提供一种具真空吸引效果的定位装置,其具有真空吸引效果与定位效果两种功效,可以满足电路板制造程序中的需求。In view of the lack of a device with both vacuum suction effect and positioning effect in the conventional circuit board manufacturing procedures, the purpose of this utility model is to provide a positioning device with vacuum suction effect, which has both vacuum suction effect and positioning effect , which can meet the needs in the circuit board manufacturing process.

为了达到上述的目的,本实用新型提供一种具真空吸引效果的定位装置,其特征在于:其包括:In order to achieve the above purpose, the utility model provides a positioning device with vacuum suction effect, which is characterized in that it includes:

一真空抽气平台;a vacuum pumping platform;

至少一块设于该真空抽气平台上的基板,每一块基板上形成有数个透气孔,该透气孔穿设过整个基板;与At least one substrate arranged on the vacuum pumping platform, each substrate is formed with several vent holes, and the vent holes pass through the entire substrate; and

至少一个设于基板上的电木元件,每一个电木元件上形成有至少一个定位孔。At least one bakelite component is arranged on the base plate, and at least one positioning hole is formed on each bakelite component.

所述的具真空吸引效果的定位装置,其特征在于:于基板的顶面设有数个容置孔;The positioning device with vacuum suction effect is characterized in that: several accommodating holes are provided on the top surface of the substrate;

每一个电木元件由一电木块所构成,每一个电木块与相对应的基板上的容置孔以紧配合固定,每一电木块顶面上形成有一个定位孔。Each bakelite element is composed of a bakelite block, and each bakelite block is tightly fitted with a corresponding accommodating hole on the base plate, and a positioning hole is formed on the top surface of each bakelite block.

所述的具真空吸引效果的定位装置,其特征在于:该基板是以螺锁元件固设于真空抽气平台的顶面上。The positioning device with vacuum suction effect is characterized in that: the base plate is fixed on the top surface of the vacuum pumping platform by screw lock elements.

本实用新型还提供一种具真空吸引效果的定位装置,其特征在于:其包括:The utility model also provides a positioning device with vacuum suction effect, which is characterized in that it includes:

一真空抽气平台;a vacuum pumping platform;

至少两块设于真空抽气平台上的基板,每一块基板上形成有数个透气孔,该透气孔穿设过整个基板;与at least two substrates arranged on the vacuum pumping platform, each substrate is formed with several vent holes, and the vent holes pass through the entire substrate; and

至少一个设于相邻基板之间的电木元件,每一个电木元件上形成有至少一个的定位孔。At least one bakelite element is arranged between adjacent substrates, and at least one positioning hole is formed on each bakelite element.

选择性地,每一个电木元件由一电木条所构成并夹设于基板之间,每一个电木条上分别形成有数个定位孔。Optionally, each bakelite component is composed of a bakelite strip and sandwiched between the substrates, and each bakelite strip is respectively formed with several positioning holes.

较佳地,该基板是以螺锁元件固设于真空抽气平台的顶面上。Preferably, the substrate is fixed on the top surface of the vacuum pumping platform by a threaded locking element.

较佳地,该电木条是以螺锁元件固设于真空抽气平台的顶面上。Preferably, the bakelite strip is fixed on the top surface of the vacuum pumping platform with a screw lock element.

本实用新型的电木元件设定位孔后仍可以保持平整的特性,可让装置达到定位的效果以外,让电路板与基板的间在定位结合后仍然能保持贴合平整,以同时保有良好真空吸引性,以增加电路板制作操作时的稳定性。The bakelite component of the utility model can still maintain the flatness after setting the positioning hole, which can not only achieve the positioning effect of the device, but also keep the connection between the circuit board and the base plate flat after positioning and combining, so as to maintain a good Vacuum suction to increase the stability of circuit board manufacturing operations.

【附图说明】【Description of drawings】

图1为本实用新型配合一电路板设置的立体外观分解图。Fig. 1 is an exploded view of the three-dimensional appearance of the utility model arranged with a circuit board.

图2为本实用新型配合电路板设置的部分立体外观分解图。Fig. 2 is an exploded view of a part of the three-dimensional appearance of the utility model arranged with a circuit board.

图3为本实用新型配合电路板设置的部分剖面示意图。Fig. 3 is a schematic cross-sectional view of a part of the utility model arranged with a circuit board.

图4为本实用新型中另一实施例配合一电路板设置的立体外观分解图。FIG. 4 is an exploded perspective view of another embodiment of the present invention that is arranged with a circuit board.

图5为本实用新型中另一实施例配合电路板设置的部分剖面示意图。FIG. 5 is a partial cross-sectional schematic diagram of another embodiment of the present invention arranged with a circuit board.

【具体实施方式】【Detailed ways】

本实用新型是关于一种具真空吸引效果的定位装置,其主要结构包括有一真空抽气平台、至少一块设于真空抽气平台上的金属制基板,与设置在基板上或基板的间的至少一个电木元件,每一个电木元件上分别形成有至少一个定位孔,利用电木元件上所设的定位孔,以固锁件来和一电路板相结合定位。The utility model relates to a positioning device with a vacuum suction effect, the main structure of which includes a vacuum pumping platform, at least one metal substrate arranged on the vacuum pumping platform, and at least one metal substrate arranged on the substrate or between the substrates. A bakelite component, at least one positioning hole is formed on each bakelite component, and the positioning hole provided on the bakelite component is used to combine with a circuit board for positioning with a locking piece.

本实用新型的第一具体实施例请参考如图1至3所示,其主要结构为一真空抽气平台(10)、至少一块设于真空抽气平台上的基板(20),与设置在基板上的至少一个电木块(30),每一个电木块(30)上分别形成有至少一个定位孔(32)。Please refer to the first specific embodiment of the present utility model as shown in Figures 1 to 3, its main structure is a vacuum pumping platform (10), at least one substrate (20) that is located on the vacuum pumping platform, and is arranged on At least one bakelite block (30) on the base plate, each bakelite block (30) is respectively formed with at least one positioning hole (32).

该真空抽气平台(10)一般是为一可产生真空环境的抽气机,抽气机的前端设有多个操作控制装置,而内部形成有多个气室(图中未示),其顶面形成有数个贯穿孔(12),以和气室相连通,每一气室是与一真空吸气槽孔(图中未示)连接,并透过一管路(图中未示)与一真空抽气装置(图中未示)连结,以提供形成真空状态的动力来源。The vacuum pumping platform (10) is generally an air pump that can generate a vacuum environment. The front end of the air pump is provided with a plurality of operation control devices, and a plurality of air chambers (not shown) are formed inside. Several through holes (12) are formed on the top surface to communicate with the air chambers. Each air chamber is connected to a vacuum suction slot (not shown in the figure), and is connected to a vacuum through a pipeline (not shown in the figure). A vacuum suction device (not shown in the figure) is connected to provide a power source for forming a vacuum state.

基板(20)是可以分为多块,分别可以螺锁元件(22)固设于真空抽气平台(10)的顶面上,覆盖住顶面的贯穿孔(12),基板(20)上形成有数个透气孔(24)穿设过整个基板(20),  并有数个容置孔(26)形成于基板(20)的顶面,但并未穿设过基板(20),每一容置孔(26)用以容置一电木块(30),其中容置孔(26)与电木块(30)的间为紧配合固定。The base plate (20) can be divided into multiple pieces, and the screw lock element (22) can be respectively fixed on the top surface of the vacuum pumping platform (10), covering the through hole (12) on the top surface, and the base plate (20) Several air holes (24) are formed to pass through the entire substrate (20), and several accommodating holes (26) are formed on the top surface of the substrate (20), but do not pass through the substrate (20), each accommodating The hole (26) is used to accommodate a bakelite block (30), wherein the space between the accommodating hole (26) and the bakelite block (30) is tightly fitted and fixed.

每一电木块(30)即为一电木元件,其顶面上形成有一定位孔(32),并有一插销(34)对应插入于定位孔(32)中,而一部分的插销(34)突出于定位孔(32)以外,用以和一电路板(50)上的对应穿孔(52)相卡榫定位。Each bakelite block (30) is a bakelite component, and a positioning hole (32) is formed on its top surface, and a latch (34) is correspondingly inserted in the positioning hole (32), and a part of the latch (34) It protrudes beyond the positioning hole (32) and is used for tenon positioning with a corresponding through hole (52) on a circuit board (50).

本实用新型的第二具体实施例请参考如图4、5所示,其主要结构中的真空抽气平台(10)与第一具体实施例相同,因此不再赘述,本实施例的不同处在于电木元件不再配置于基板上,因此基板上不再需要形成容置孔(26)。其结构改变为:一长方形的电木条(40)是放于两排基板(20)的中间,该电木条(40)的两端上分别形成有两个锁孔(42),用以让螺锁元件(44)穿设将电木条(40)固设于真空抽气平台(10)的顶面上,另外,在电木条(40)上分别形成有数个定位孔(46),该定位孔(46)并未穿设过电木条(40),每一个定位孔(46)对应一电路板(50)上的一对应穿孔(52),并以一螺锁元件(48)穿锁定位。Please refer to the second specific embodiment of the present utility model as shown in Figure 4 and 5, the vacuum pumping platform (10) in its main structure is the same as the first specific embodiment, so no more details, the difference of the present embodiment Because the Bakelite component is no longer configured on the base plate, it is no longer necessary to form the accommodation hole (26) on the base plate. Its structure is changed to: a rectangular bakelite strip (40) is placed in the middle of two rows of substrates (20), and two lock holes (42) are respectively formed on the two ends of the bakelite strip (40) for Let the screw lock element (44) pass through and fix the bakelite strip (40) on the top surface of the vacuum pumping platform (10). In addition, several positioning holes (46) are respectively formed on the bakelite strip (40) , the positioning holes (46) do not pass through the bakelite strip (40), each positioning hole (46) corresponds to a corresponding perforation (52) on a circuit board (50), and a screw lock element (48 ) through the locked position.

本实用新型的重点在于:在一基板上设有电木元件,由于电木元件具有容易整理的特性,设孔后仍可以保持平整,该平整的外表面能让电路板与基板的间保持贴合。而电木元件在加以加工钻孔成型后插入插销,可让电路板与电木元件上插销相榫合,藉此以避免在金属制的基板上钻孔时不易完成且表面不平整等等的问题,同时,又能让金属制基板保有原本易受真空吸引的性质,因此,本实用新型的具真空吸引效果的定位装置,可达到兼具有定位效果与真空吸引效果的特性,以增加电路板制作操作时的稳定性。The key point of this utility model is: a bakelite element is provided on a base plate, because the bakelite element has the characteristic of being easy to arrange, it can still be kept flat after the hole is set, and the flat outer surface can keep the circuit board and the base plate close to each other. combine. After the bakelite components are processed and drilled, the pins are inserted, so that the circuit board and the pins on the bakelite components can be mortized together, so as to avoid the difficulty of drilling holes on the metal substrate and the uneven surface. The problem is that at the same time, the metal substrate can retain the original property of being easily attracted by vacuum. Therefore, the positioning device with vacuum suction effect of the utility model can achieve the characteristics of both positioning effect and vacuum suction effect, so as to increase the circuit Stability during board fabrication operations.

Claims (7)

1. the positioner of a tool vacuum attraction effect, it is characterized in that: it comprises:
One vacuum suction platform;
At least one substrate of being located on this vacuum suction platform is formed with several air-vents on each piece substrate, and this air-vent wore whole base plate; With
At least one is located at the bakelite element on the substrate, is formed with at least one location hole on each bakelite element.
2. the positioner of tool vacuum attraction effect as claimed in claim 1 is characterized in that: the end face in substrate is provided with several containing holes;
Each bakelite element is made of a bakelite piece, and the containing hole on each bakelite piece and the corresponding substrate is formed with a location hole to be tightly fixed on each bakelite piece end face.
3. the positioner of tool vacuum attraction effect as claimed in claim 1 or 2 is characterized in that: this substrate is to be fixedly arranged on the end face of vacuum suction platform with the screw lock element.
4. the positioner of a tool vacuum attraction effect, it is characterized in that: it comprises:
One vacuum suction platform;
At least two substrates of being located on the vacuum suction platform are formed with several air-vents on each piece substrate, and this air-vent wore whole base plate; With
At least one is located at the bakelite element between the adjacent substrate, is formed with the location hole of at least one on each bakelite element.
5. the positioner of tool vacuum attraction effect as claimed in claim 4 is characterized in that: each bakelite element is made of a bakelite bar and is located between the substrate, is formed with several location holes respectively on each bakelite bar.
6. as the positioner of claim 4 or 5 described tool vacuum attraction effects, it is characterized in that: this substrate is to be fixedly arranged on the end face of vacuum suction platform with the screw lock element.
7. the positioner of tool vacuum attraction effect as claimed in claim 6 is characterized in that: this bakelite bar is to be fixedly arranged on the end face of vacuum suction platform with the screw lock element.
CN 200420003843 2004-02-19 2004-02-19 Positioning device with vacuum suction effect Expired - Fee Related CN2691210Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420003843 CN2691210Y (en) 2004-02-19 2004-02-19 Positioning device with vacuum suction effect

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Application Number Priority Date Filing Date Title
CN 200420003843 CN2691210Y (en) 2004-02-19 2004-02-19 Positioning device with vacuum suction effect

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100368881C (en) * 2005-10-21 2008-02-13 友达光电股份有限公司 Base plate positioning platform
CN101083247B (en) * 2006-02-24 2010-12-15 三星Techwin株式会社 Board strip and method of manufacturing semiconductor package using the same
CN104608265A (en) * 2014-12-31 2015-05-13 广州兴森快捷电路科技有限公司 High multilayer semiconductor test board perforating method
CN104822229A (en) * 2015-04-22 2015-08-05 上海凯思尔电子有限公司 Operation process for fixing PCB with thumbtacks

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100368881C (en) * 2005-10-21 2008-02-13 友达光电股份有限公司 Base plate positioning platform
CN101083247B (en) * 2006-02-24 2010-12-15 三星Techwin株式会社 Board strip and method of manufacturing semiconductor package using the same
CN104608265A (en) * 2014-12-31 2015-05-13 广州兴森快捷电路科技有限公司 High multilayer semiconductor test board perforating method
CN104608265B (en) * 2014-12-31 2016-09-14 广州兴森快捷电路科技有限公司 The boring method of high multi-lager semiconductor test board
CN104822229A (en) * 2015-04-22 2015-08-05 上海凯思尔电子有限公司 Operation process for fixing PCB with thumbtacks

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Granted publication date: 20050406