CN2682664Y - Plane grid array connector - Google Patents
Plane grid array connector Download PDFInfo
- Publication number
- CN2682664Y CN2682664Y CN 200320119983 CN200320119983U CN2682664Y CN 2682664 Y CN2682664 Y CN 2682664Y CN 200320119983 CN200320119983 CN 200320119983 CN 200320119983 U CN200320119983 U CN 200320119983U CN 2682664 Y CN2682664 Y CN 2682664Y
- Authority
- CN
- China
- Prior art keywords
- connector
- pressing plate
- insulating body
- lattice array
- planar lattice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Connecting Device With Holders (AREA)
Abstract
The utility model relates to a plane grid array connector which is used for conducting a wafer module and a circuit board. The planar grid array connector comprises an isolation body, a plurality of conductive terminals contained in the isolation body, a reinforced slice arranged on the outer periphery of the isolation body, a pressure plate assembled on the reinforced slice, and a poker piece assembled on the reinforced slice and matching with the pressure plate; wherein the pressure plate is a hollow frame and is provided with two cambered fastening parts; the outer sides the fastening parts are respectively provided with stopping parts; when the pressure plate is in open position, the stopping parts can not influence the downward pressing of the pressure plate; when the pressure plate is on closed position, the stopping parts can abut to the isolation body so as to prevent the pressure plate pushing the wafer module to move overly from damaging the side wall of the isolation body; in this way, favourable contact of the conductive terminals and the isolation body can be ensured.
Description
[technical field]
The utility model is about a kind of connector of planar lattice array, refers to a kind of connector of planar lattice array that is used for wafer module is electrically connected to circuit board especially.
[background technology]
See also Fig. 1, a kind of wafer module 100 with land grid array package is electrically connected to the existing electric connector 8 of circuit board, comprise the insulating body 82 that is equipped with plurality of conductive terminals 81, be packaged in the reinforced sheet 83 and pressing plate 84 and winding the shifting part 86 on reinforced sheet 83 of difference winding on the clamping part 89 of reinforced sheet 83 in insulating body 82 outsides, the articulated section 87 of its center platen 84 cooperates with the clamping part 89 of reinforced sheet 83, electric connector 8 pushes wafer module 100 downwards by pressing plate 84 and makes its conducting strip and conducting terminal 81 tight elasticity butts, shifting part 86 is provided with a pressing lever 85, when shifting part 86 presses down when being pressed onto pressing plate 84 on the wafer module 100, pressing plate 84 can push wafer module make it with insulating body 82 in conducting terminal 81 be electrically conducted.
See also Fig. 2, when pressing plate 84 from the release position to process near make position, can slide laterally in the arc articulated section of pressing plate 84 87; When pressing lever 85 is in the close position when neighbouring, pressing lever 85 is pushed pressing plate 84, at this moment, the clamping part 89 of reinforced sheet 83 can be given articulated section 87 1 reaction forces of pressing plate 84, impel pressing plate 84 to move towards the opposite direction of clamping part 89 place sides, when pressing plate 84 is mobile excessive in this process, promote wafer module 100 to move and hit the sidewall of insulating body 82, make sidewall stressed excessive and damage or the downforce deficiency of pressing plate 84, conducting terminal 81 can not reach good the contact with wafer module 100, and particularly the conducting terminal 81 at 88 places, corner can not well contact with wafer module 100.Produce frictional force because wafer module 100 contacts with sidewall, the following pressure point of pressing plate 84 and the strength problem of unstable that presses down are caused in the position when making wafer module 100 not be in normal operating conditions, influence the operate as normal of wafer module 100.In view of the existence of above shortcoming, be necessary to propose a kind of connector of planar lattice array that has improved.
[utility model content]
The purpose of this utility model is to provide a kind of connector of planar lattice array that guarantees that wafer module and conducting terminal well connect.
Another purpose of the present utility model is to provide a kind of connector of planar lattice array that can solve the excessive problem of connector part zone and wafer module frictional force.
The another purpose of the utility model is to provide a kind of wafer module that can prevent excessively to move and the connector of planar lattice array of damage insulating body.
The utility model is used for connecting wafer module and comprises insulating body with the connector of planar lattice array of circuit board, is housed in plurality of conductive terminals in the insulating body, is packaged in reinforced sheet around the insulating body outside, is assemblied in the pressing plate on the reinforced sheet and is assemblied in the shifting part that cooperates with pressing plate on the reinforced sheet, but pressing plate is provided with the holding part of winding to the reinforced sheet, and the holding part lateral margin of pressing plate is provided with at least one stop section and is resisted against and prevents the pressing plate horizontal displacement on the insulating body.
Compared with prior art; the utlity model has following advantage: this connector of planar lattice array is owing to the arc stop section of set symmetry on the holding part of pressing plate and reinforced sheet pivot joint; can prevent that wafer module is excessively mobile; protection insulating body sidewall; reduce the friction of wafer module and insulating body near pressing lever one side; make wafer module that enough pressing down be arranged, guarantee that wafer module well contacts with the conducting terminal of connector.In addition, can also improve the following pressure point of pressing plate pressing force and press down strength value problem of unstable.
[description of drawings]
Fig. 1 is the three-dimensional broken away view of existing connector of planar lattice array and wafer module.
Fig. 2 is the three-dimensional combination figure of existing connector of planar lattice array and wafer module.
Fig. 3 is the three-dimensional broken away view of the utility model connector of planar lattice array and wafer module.
Fig. 4 is that the utility model is in the connector of planar lattice array of release position and the stereogram of wafer module.
Fig. 5 is the connector of planar lattice array that is in the close position of the utility model and the stereogram of wafer module.
Fig. 6 is the three-dimensional broken away view of another execution mode of connector of planar lattice array of the present utility model.
[embodiment]
See also Fig. 3 to Fig. 5, connector of planar lattice array of the present utility model is used for electrically connecting wafer module 60 and circuit board (not shown), and it comprises the insulating body 10 that is installed with several conducting terminals 12, be packaged in reinforced sheet 20 around insulating body 10 outsides, be located at the rotating shifting part 30 of reinforced sheet 20 1 sides and be located at the rotating pressing plate 40 of reinforced sheet 20 opposite sides.
Insulating body 10 is the tabular structure, be provided with conduction region 14 at its middle part, the plane that this conduction region 14 makes progress is an interface 15, conduction region 14 offers plurality of terminals and accommodates passage 16, each is accommodated and contains a corresponding conducting terminal 12 in the passage 16, the guiding access of conducting terminal 12 (not label) extend in outside the interface 15 with the conducting strip (not shown) of wafer module 60 bottom surfaces to push the mode butt, insulating body 10 is provided with some locating convex blocks 18 in its bottom surface.Connector of planar lattice array is electrically connected to circuit board by its conducting terminal 12 and realizes electrically connecting with circuit board, finally realizes being electrically conducted of wafer module 60 and circuit board with being electrically conducted of conducting strip of wafer module 60 by conducting terminal 12 again.The sidewall of insulating body 10 is provided with guide part 19.
Shifting part 30 is formed by long and thin metal round bar bending several times, it comprises Actuator Division 32 and the holding parts 34 that links to each other with Actuator Division 32 approximate vertical, Actuator Division 32 is provided with the handle 33 of outside bending in its end, and holding parts 34 convexes with the portion 35 that exerts pressure in its middle part.
Reinforced sheet 20 is the setting of lengthwise shape, and it comprises the side that links to each other in twos and extend upward the sidewall of setting from side, and sidewall adjacent with the second side 42 of pressing plate 40 during its assembling is a first side wall 22, with the first side wall 22 opposed sidewalls be second sidewall 24.Holding part 421 corresponding to pressing plate 40 on the first side wall 22 offers a pair of bayonet socket 221, this bayonet socket 221 fastens so that pressing plate 40 is articulated in reinforced sheet 20 with the holding part 421 of pressing plate 40, second sidewall 24 is provided with the retaining sheet 241 that a pair of bending is provided with, and be extended with retaining sheet 242 in the bending of an end of a retaining sheet 241, this retaining sheet 241 and retaining sheet 242 make shifting part 30 be articulated in second sidewall 24 of reinforced sheet 20 in conjunction with the end of the other two side of reinforced sheet 20, and are provided with semicircle arcuation boss 243 with locking shifting part 30 on a sidewall between the first side wall 22 and second sidewall 24 in it.Reinforced sheet 20 locating convex block 18 corresponding to insulating body 10 on the side at its first side wall 22 and second sidewall, 24 places is provided with recess 26.
This connector of planar lattice array assembling process is as follows: elder generation is articulated in pressing plate 40 and shifting part 30 respectively the first side wall 22 and second sidewall 24 of reinforced sheet 20, again pressing plate 40 is placed open position, then insulating body 10 is inserted in the reinforced sheet 20, locating convex block 18 by insulating body 10 bottoms be sticked in reinforced sheet 20 bottoms recess 26 so that insulating body 10 be immobilizated among the reinforced sheet 20, simultaneously the sidewall of reinforced sheet 20 be coated on insulating body 10 around.
During use, earlier shifting part 30 is shaken to boss 243 positions that make its handle 33 away from reinforced sheet 20, this moment, its portion 35 that exerts pressure did not stop the extension of pressing plate, opened pressing plate 40, and wafer module 60 is placed on the insulating body 10, make its conducting strip corresponding with conducting terminal 12 positions of insulating body 10, at this moment, the stop section 424 of pressing plate 40 does not contact with other element, promptly, when pressing plate 40 was in the release position, stop section 424 can not make pressing plate 40 be hindered.Then pressing plate 40 is moved to horizontal level, rotate shifting part 30, make its portion 35 that exerts pressure go to horizontal level, portion 35 extensions 411 of extruding pressing plates 40 downwards of exerting pressure, pressing plate 40 pushes wafer module 60 downwards by its compressed part 43, make the conducting terminal 12 tight elasticity butts of its conducting strip and connector of planar lattice array, Actuator Division 32 with shifting part 30 is pressed under the boss 243 again, the portion 35 that will exert pressure secures to horizontal level, be about to wafer module 60 and secure to the state that the conducting terminal 12 with connector of planar lattice array 1 firmly is flexibly connected, in this locking process, arc holding part 421 can rotate along the guide part 19 that insulating body 10 is provided with, pressing plate 40 can be to the portion that exerts pressure 35 1 side shiftings of shifting part 30, thereby promote wafer module 60 to the portion's of exerting pressure 35 1 side shiftings, because the existence of stop section 424, it abuts on the guide part 19 of insulating body 10, can stop excessively moving of pressing plate 40, preventing that wafer module 60 from excessively moving hits the sidewall of insulating body 10 and makes insulating body 10 impaired, and can prevent that wafer module 60 and insulating body 10 sidewall friction are excessive, and cause the conducting terminal 12 of 17 positions, corner of insulating body 10 can not well connect with wafer module 60.
See also Fig. 6, another execution mode of the utility model, it is with the aforementioned embodiments difference: the bending direction that colludes shape stop section 424 ' is different, and 424 ' bends towards insulating body 10 from side, when pressing plate 40 was in the close position, stop section 424 ' also can abut on the insulating body 10.
Claims (10)
1. connector of planar lattice array, it comprises insulating body, be housed in plurality of conductive terminals in the insulating body, be located at the insulating body outside reinforced sheet, be assemblied in the pressing plate on the reinforced sheet and be assemblied in the shifting part that cooperates with pressing plate on the reinforced sheet, but pressing plate is provided with the holding part of winding to the reinforced sheet, it is characterized in that: the holding part lateral margin of pressing plate is provided with at least one stop section and is resisted against and prevents the pressing plate horizontal displacement on the insulating body.
2. connector of planar lattice array as claimed in claim 1 is characterized in that: pressing plate is provided with two holding parts, respectively is provided with a stop section on each holding part.
3. connector of planar lattice array as claimed in claim 2 is characterized in that: insulating body is provided with the guide part corresponding with holding part, and the side near the insulating body guide part is located in the stop section.
4. connector of planar lattice array as claimed in claim 2 is characterized in that: two stop sections are symmetricly set on the holding part.
5. connector of planar lattice array as claimed in claim 4 is characterized in that: two stop sections are located at the holding part outside simultaneously.
6. connector of planar lattice array as claimed in claim 4 is characterized in that: two stop sections are positioned at the holding part inboard simultaneously.
7. as claim 5 or 6 described connector of planar lattice array, it is characterized in that: the stop section is colludes shape and bends towards insulating body.
8. connector of planar lattice array as claimed in claim 1 is characterized in that: stop section and holding part are for being wholely set.
9. connector of planar lattice array as claimed in claim 1 is characterized in that: reinforced sheet is provided with the bayonet socket that cooperates with the pressing plate holding part.
10. connector of planar lattice array as claimed in claim 1 is characterized in that: shifting part comprises holding parts and Actuator Division, and the middle part of holding parts convexes with the portion that exerts pressure of clamping platen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200320119983 CN2682664Y (en) | 2003-11-22 | 2003-11-22 | Plane grid array connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200320119983 CN2682664Y (en) | 2003-11-22 | 2003-11-22 | Plane grid array connector |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2682664Y true CN2682664Y (en) | 2005-03-02 |
Family
ID=34599635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200320119983 Expired - Lifetime CN2682664Y (en) | 2003-11-22 | 2003-11-22 | Plane grid array connector |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2682664Y (en) |
-
2003
- 2003-11-22 CN CN 200320119983 patent/CN2682664Y/en not_active Expired - Lifetime
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20131122 Granted publication date: 20050302 |