CN2681537Y

CN2681537Y - Breakthrough type shrapnel applied to substrate

Info

Publication number: CN2681537Y
Application number: CN 200420001267
Authority: CN
Inventors: 陈惟诚
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-02-06
Filing date: 2004-02-06
Publication date: 2005-02-23
Anticipated expiration: 2014-02-06

Abstract

The utility model relates to a breakthrough type shrapnel applied to substrate which is penetrated on the electrically-conductive substrate with two open spread through holes arrayed separately, and a conduction element contacts the shrapnel. The shrapnel comprises: two flexures, an angle is formed between the two flexures with the same body connected, and the connected end face is pressed by the conduction element; two limit valve parts which are respectively bent oppositely from the ends of two flexures are correspondingly penetrated and buckled in the spread through holes of the substrate. The breakthrough type shrapnel of the utility model can be assembled on the substrate of the generally electronic information system in a breakthrough mode. The breakthrough type shrapnel has the advantages of exact localization, dispersed stress and long life.

Description

Be applied to the breakthrough type shell fragment of substrate

[technical field]

The utility model relates to a kind of shell fragment that is applied to substrate in the general electronics information equipment, particularly relates to a kind ofly being assembled in the breakthrough type shell fragment that is applied to substrate on the substrate in the mode of placing.

[background technology]

As shown in Figure 1, all be provided with most shell fragments 11 in the general electronics information equipment in order to buffering and electric connection.Shell fragment 11 was to be bent into metal in the past, and with surface mounting technology (SMT, Surface Mount Technology) is welded on the substrate 10, compress contact for other conducting elements (figure does not show), and as ground connection (Grounding) or electromagnetic protection (EMI, electro-magnetic interference).

This shell fragment 11 comprises one in order to welding the canned paragraph 12 that fixedly is overlying on the substrate 10, and one by this canned paragraph 12 wherein a terminal oppositely bending extend and compress flexible stretch section 13 in order to provide.

Because this type of shell fragment 11 is to utilize surface mounting technology welding location, often has following shortcoming:

One, is difficult for the location: in shell fragment 11 welding processes, produce uneven surface tension during often because of the scolding tin fusion, cause the shell fragment 11 stressed skews of light weight, and then influence the accuracy of element contraposition in the equipment.

Two, stress is concentrated: this shell fragment 11 is to compress strength and the position of cushioning elastic force is provided as bearing with the stretch section 13 that its bending is extended, Stress Transfer concentrates on the bending place near canned paragraph 12 when this stretch section 13 is stressed, and as easy as rolling off a log stress is concentrated and elastic fatigue and jackknifing is damaged.

Three, climb the tin phenomenon and influence elasticity: all shell fragments 11 that utilizes surface mounting technology to engage the location, often because of in the welding process because of the capillarity of fusion scolding tin, scolding tin is overflow be dissipated to stretch section 13 after coagulations, cause what is called " to climb the tin phenomenon ", cause stretch section 13 elasticity to weaken and easy fracture more.

[utility model content]

The purpose of this utility model is to provide a kind of breakthrough type shell fragment that is applied to substrate, but can accurately locate dispersive stress and more durable.

A purpose more of the present utility model provide a kind of have can accurately locate and the board device of more durable shell fragment.

A kind of breakthrough type shell fragment that is applied to substrate of the present utility model, but be set in an electrically-conductive backing plate that is provided with two spaced through holes, conducting element contact compresses this shell fragment, and it is characterized in that: this shell fragment comprises:

Two elastic arms, at angle and be that consubstantiality connects, its continuous end face is pressed by described conducting element between two elastic arms; And

Two limiting sections bend in the through hole that wears and buckle into described substrate with correspondence in opposite directions from this two elastic arms end respectively.

The described breakthrough type shell fragment that is applied to substrate is characterized in that: the angle between this two elastic arm is an obtuse angle.

The described breakthrough type shell fragment that is applied to substrate is characterized in that: this two limiting section is to penetrate the corresponding through hole of institute and the described substrate that links closely respectively.When described conducting element presses on this two elastic arms connecting place, elastic arm is opened distortion outward and is affixed to substrate, and limiting section moves apart corresponding through hole thereupon slightly.

A kind of board device with breakthrough type shell fragment of the present utility model is compressed by conducting element contact, and it is characterized in that: this board device comprises:

But an electrically-conductive backing plate is provided with two spaced through holes in this substrate; And

One shell fragment comprises two elastic arms, at angle and be that consubstantiality connects, and press for described conducting element with the end face that links to each other between this two elastic arm, and two bends the limiting section that wears and buckle into the through hole of this substrate with correspondence in opposite directions from this two elastic arms end respectively.

Described board device with breakthrough type shell fragment is characterized in that: the angle between this of this shell fragment two elastic arms is an obtuse angle.

Described board device with breakthrough type shell fragment is characterized in that: this of this shell fragment two limiting sections penetrate the corresponding through hole of institute and this substrate that links closely respectively.

Effect of the present utility model is to provide a kind of breakthrough type shell fragment that is applied to substrate, utilizes the mode of placing to be embedded at the default through hole position of substrate, and its structure on two sides symmetry can dispersive stress, can accurately locate and more durable.

[description of drawings]

Below by most preferred embodiment and accompanying drawing the breakthrough type shell fragment that the utility model is applied to substrate is elaborated, in the accompanying drawing:

Fig. 1 is that shell fragment was welded in stereogram on the substrate in the past.

Fig. 2 is the stereogram that first preferred embodiment that the utility model is applied to the breakthrough type shell fragment of substrate is arranged at a substrate.

Fig. 3 is the end view that this embodiment is arranged at described substrate and not compressed by a conducting element.

Fig. 4 is the view that is similar to Fig. 3, and the state that present embodiment is compressed by described conducting element is described.

Fig. 5 is the view that is similar to Fig. 3, illustrates that present embodiment is arranged on another substrate.

Fig. 6 is the stereogram of the utility model shell fragment second preferred embodiment.

[embodiment]

As Fig. 2, shown in Figure 3, be to be set on the electrically-conductive backing plate 2 but the utility model is applied to the preferred embodiment of the breakthrough type shell fragment 3 of substrate 2, and use for a conducting element 4 contact and compress.Described conducting element 4 can be metal chassis or conducting terminal etc.

Described substrate 2 comprises a plate body 21 of being made by electric conducting material, and two are spaced and run through plate body 21 places the location for this shell fragment 3 through hole 20.

This shell fragment 3 is to be bent into by metal, and comprise two long plate shape elastic arms 31 and two limiting sections 32, the angle that two elastic arms are 31 is an obtuse angle, these two elastic arms, 31 consubstantialities link to each other and extend towards described substrate 2 directions, and two limiting sections 32 are to bend in opposite directions and corresponding being arranged in the through hole 20 of described substrate 2 from these two elastic arms, 31 ends respectively.But the distance design of 32 of this two limiting sections just driving fit is butted on through hole 20 neighboring edge places, so as to accurate location and firmly buckle on this substrate 2

As shown in Figure 4, this shell fragment 3 is to compress for described conducting element 4 contacts with its elastic arm 31 continuous end faces.Stressed when this shell fragment 3, strength is born towards the two-side elastic wall 31 transmission dispersions of symmetry, and therefore outer of elastic wall 31 is out of shape and is affixed to plate body 21, and its terminal limiting section 32 is extrapolated a little thereupon and moved apart corresponding through hole 20.

Elastically deformable that this shell fragment 3 is metal materials itself and the movable design that cooperates through hole 20, except the basic effect that electrically connects, more effective shell fragment 3 that reaches cushions the purpose that compresses strength.

Certainly, the substrate 2 that the utility model shell fragment 3 is suitable for also can be the printed circuit board (PCB) of general plastic material as shown in Figure 5, its plate body 21 is made by non-conducting material, and comprises that more two correspondences are laid in the metallic pad 22 of through hole 20 peripheral regions in order to electrically connect with shell fragment.

In addition, shell fragment also can be as shown in Figure 6, by 31 ' the parallel binding of many elastic arms, and by wherein partly the bending of elastic arm 31 ' end extend limiting section 32 ', make shell fragment 3 ' that higher mechanical strength can be provided, bear big pressure.

Take a broad view of above-mentioned, the utility model is applied to the breakthrough type shell fragment 3 of substrate 2, utilize the buckle mode accurately to be positioned on the substrate 2, and can omit the elastic buffer mechanism of micrometric displacement by elastic wall 31 design fits of symmetry, make stress disperse average and effectively relax to compress strength and more durable, therefore can reach the purpose of this utility model really.

Claims

1, a kind of breakthrough type shell fragment that is applied to substrate, but be set in an electrically-conductive backing plate that is provided with two spaced through holes, conducting element contact compresses this shell fragment, and it is characterized in that: this shell fragment comprises:

2, the breakthrough type shell fragment that is applied to substrate as claimed in claim 1, it is characterized in that: the angle between this two elastic arm is an obtuse angle.

3, the breakthrough type shell fragment that is applied to substrate as claimed in claim 1 is characterized in that: this two limiting section is to penetrate the corresponding through hole of institute and the described substrate that links closely respectively.

4, a kind of board device with breakthrough type shell fragment is compressed by conducting element contact, and it is characterized in that: this board device comprises:

5, the board device with breakthrough type shell fragment as claimed in claim 4 is characterized in that: the angle between this of this shell fragment two elastic arms is an obtuse angle.

6, the board device with breakthrough type shell fragment as claimed in claim 5 is characterized in that: this of this shell fragment two limiting sections penetrate the corresponding through hole of institute and this substrate that links closely respectively.