CN2665787Y - Shielding structure of CPU, mainboard and electronic device - Google Patents
Shielding structure of CPU, mainboard and electronic device Download PDFInfo
- Publication number
- CN2665787Y CN2665787Y CN 200320122252 CN200320122252U CN2665787Y CN 2665787 Y CN2665787 Y CN 2665787Y CN 200320122252 CN200320122252 CN 200320122252 CN 200320122252 U CN200320122252 U CN 200320122252U CN 2665787 Y CN2665787 Y CN 2665787Y
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- CN
- China
- Prior art keywords
- processor module
- central processor
- motherboard
- heat abstractor
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a shielding structure of CPU and a mainrboard and an electronic device that are provided with the shielding structure and the shielding structure of CPU is applicable to the mainboard; the shielding structure of CPU comprises a CPU component arranged on the mainboard and a radiating device arranged on the CPU component; wherein, a shielding member is arranged between the radiating device and the CPU component; the electromagnetic wave that the CPU component emits can be effectively shielded by the arrangement of the shielding member, thus preventing the peripheral components of the CPU from being interfered by the electromagnetic wave of the CPU.
Description
Technical field
The utility model is about a kind of masking structure of central processing unit and uses the motherboard and the electronic installation of this masking structure, particularly relevant for a kind of electromagnetic central processing unit masking structure that can effectively cover Central Processor Module and sent and and use the motherboard and the electronic installation of this masking structure.
Background technology
The central processing unit of computing machine (CPU) in several past years, by 486 → Pentium → PentiumII → PentiumIII evolution in regular turn, the alternation of generations is very quick, its core speed (more than 75MHz → 500MHz) all constantly increases with heat radiation power (more than 10W → 28W), the heat dissipation problem of CPU thereby heal and become serious, therefore reducing the working temperature of CPU, is a very important and crucial problem.
The method that reduces central processor temperature is that a heat abstractor is set thereon, shown in Figure 1A, 1B; Wherein Central Processor Module 11 is to be arranged on the motherboard 10, and it comprises a central processing unit 111, a pedestal 114, and central processing unit 111 is fixed on the pedestal 114 by adhesive layer 112, and is provided with many leads 113 on pedestal 114.
Heat abstractor can be a heat radiator 12, or shown in Figure 1B, be the assembly 13 of a heat radiator and fan shown in Figure 1A.
After being arranged at heat abstractor 12,13 on the Central Processor Module 11, see it from the side, will be shown in Fig. 1 C, because central processing unit 111 is to be fixed on the pedestal 114 by adhesive layer 112, therefore central processing unit 111 is protruded on the motherboard 10, produced a clearance G and make between heat abstractor 12,13 and the motherboard 10.
Because the generation of this gap G makes the electromagnetic wave that Central Processor Module sent to cover fully, and the assembly of central processing unit periphery has been produced Electromagnetic Interference (EMI).
Summary of the invention
The utility model purpose is to provide a kind of masking structure of central processing unit, the motherboard of using this structure and electronic installation, the electromagnetic wave that the masking structure of wherein said central processing unit can effectively cover Central Processor Module and sent.
Implement the masking structure of central processing unit of the present utility model, be applicable on the motherboard, comprise the Central Processor Module that is arranged on the motherboard, be arranged at heat abstractor and shading member on the Central Processor Module, wherein said shading member is arranged between heat abstractor and the Central Processor Module.
Implement motherboard of the present utility model, comprise Central Processor Module and be arranged on heat abstractor on the Central Processor Module, wherein between heat abstractor and this Central Processor Module, be provided with a shading member.
Implement electronic installation of the present utility model, comprise motherboard, wherein this motherboard is provided with Central Processor Module and is arranged on heat abstractor on the Central Processor Module, wherein is provided with a shading member between heat abstractor and this Central Processor Module.
The utility model is by the setting of shading member, and the electromagnetic wave that can cover Central Processor Module effectively and sent makes the perimeter component of central processing unit be unlikely to suffer the Electromagnetic Interference of central processing unit.
Description of drawings
Figure 1A is the synoptic diagram of existing central processing unit and heat abstractor;
Figure 1B is the synoptic diagram of existing central processing unit and another kind of heat abstractor;
Fig. 1 C is the side view after being arranged at heat abstractor on the Central Processor Module;
Fig. 2 A is the three-dimensional exploded view of the masking structure of central processing unit of the present utility model;
Fig. 2 B is the synoptic diagram that shows the masking structure of central processing unit of the present utility model, and wherein shading member combines with Central Processor Module.
Embodiment
Shown in Fig. 2 A, 2B, the masking structure of central processing unit of the present utility model is applicable on the motherboard 20, comprise a Central Processor Module 21, heat abstractor 12 (this with the heat abstractor of Figure 1A as representative) and shading member 22.
Central Processor Module 21 is arranged on the motherboard 20, and it comprises a central processing unit 211, a pedestal 214, and central processing unit 211 is fixed on the pedestal 214 by adhesive layer 212, and is provided with many leads 213 on pedestal 214.
Shading member 22 portion in the central is provided with a perforate 221, and is respectively equipped with a pin 222 on each limit; Perforate 221 can make the central processing unit 211 of Central Processor Module 21 pass through and contact with heat abstractor 12, dispel the heat smoothly, 222 of pins respectively with motherboard 20 on ground path (not shown) Even connect, go in the ground path of motherboard 20 with the electromagnetic waveguide that Central Processor Module 21 is produced).
Therefore, by the setting of shading member, the electromagnetic wave that can cover Central Processor Module effectively and sent makes the perimeter component of central processing unit be unlikely to suffer the Electromagnetic Interference of central processing unit.
Again, the pin number of shading member is not limited to four, and it can be connected with the ground path of motherboard by welding.
Claims (9)
1. the masking structure of a central processing unit, be applicable on the motherboard, comprise and be located at the Central Processor Module on the motherboard and be arranged on heat abstractor on the Central Processor Module, it is characterized in that: between heat abstractor and this Central Processor Module, be provided with a shading member.
2. the masking structure of central processing unit as claimed in claim 1, it is characterized in that: this shading member has a perforate, and this Central Processor Module contacts with this heat abstractor by this perforate.
3. the masking structure of central processing unit as claimed in claim 1 or 2 is characterized in that: this shading member has the pin that ground path at least one and motherboard links.
4. motherboard comprises Central Processor Module and is arranged on heat abstractor on the Central Processor Module, it is characterized in that: be provided with a shading member between heat abstractor and this Central Processor Module.
5. motherboard as claimed in claim 4 is characterized in that: this shading member is provided with a perforate, and Central Processor Module contacts with this heat abstractor by this perforate.
6. as Shen claim 4 or 5 described motherboards, it is characterized in that: this shading member has the pin that ground path at least one and motherboard links.
7. an electronic installation comprises motherboard, and wherein this motherboard is provided with Central Processor Module and is arranged on heat abstractor on the Central Processor Module, it is characterized in that: be provided with a shading member between heat abstractor and this Central Processor Module.
8. electronic installation as claimed in claim 7 is characterized in that: this shading member is provided with a perforate, and Central Processor Module contacts with this heat abstractor by this perforate.
9. as Shen claim 7 or 8 described electronic installations, it is characterized in that: this shading member has the pin that ground path at least one and motherboard links.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320122252 CN2665787Y (en) | 2003-12-09 | 2003-12-09 | Shielding structure of CPU, mainboard and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320122252 CN2665787Y (en) | 2003-12-09 | 2003-12-09 | Shielding structure of CPU, mainboard and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2665787Y true CN2665787Y (en) | 2004-12-22 |
Family
ID=34348589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320122252 Expired - Fee Related CN2665787Y (en) | 2003-12-09 | 2003-12-09 | Shielding structure of CPU, mainboard and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2665787Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023183125A1 (en) * | 2022-03-25 | 2023-09-28 | Advanced Micro Devices, Inc. | Lid carveouts for processor lighting |
| WO2023183695A1 (en) * | 2022-03-25 | 2023-09-28 | Advanced Micro Devices, Inc. | Lid carveouts for processor connection and alignment |
-
2003
- 2003-12-09 CN CN 200320122252 patent/CN2665787Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023183125A1 (en) * | 2022-03-25 | 2023-09-28 | Advanced Micro Devices, Inc. | Lid carveouts for processor lighting |
| WO2023183695A1 (en) * | 2022-03-25 | 2023-09-28 | Advanced Micro Devices, Inc. | Lid carveouts for processor connection and alignment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |