CN2660523Y - Low dimensional material thermal expansion coefficient measurer - Google Patents
Low dimensional material thermal expansion coefficient measurer Download PDFInfo
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- CN2660523Y CN2660523Y CN 200320126700 CN200320126700U CN2660523Y CN 2660523 Y CN2660523 Y CN 2660523Y CN 200320126700 CN200320126700 CN 200320126700 CN 200320126700 U CN200320126700 U CN 200320126700U CN 2660523 Y CN2660523 Y CN 2660523Y
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- temperature
- woven hose
- vacuum interlayer
- quartz rod
- clock gauge
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Abstract
A low-dimensional material thermal expansion coefficient measuring device can measure thermal expansion coefficients of one-dimensional wire stock and two-dimensional belt materials. The cold nitrogen from a liquid nitrogen vessel makes the temperature of a specimen (17) arranged in a heat shield (16) lowered through a fluid conveying tube. The temperature is regulated through a heating rod (1) arranged on the bottom of a liquid nitrogen vessel (2) and a thermal resistance wire (10) winding on the inner surface of a fluid conveying inner tube (4). And a continuous temperature control from liquid nitrogen temperature to room temperature can be realized. One end of the tested specimen (17) is connected with a fixed quartz bar (18) and is fixed in a vacuum mezzanine (12) through a fixed support (20). The other end is connected with a moving quartz bar (21). Through the heat shield (16) and a hole on the inner lower edge of the vacuum mezzanine (12), the other end is in close contact with a micrometer gauge (23). The change of the length of the tested specimen (17) varying with temperature is reflected through the changes of read numbers of the micrometer gauge (23).
Description
Technical field
The invention belongs to field of measuring technique, relate to one dimension wire rod and two-dimentional band thermal expansivity measurement mechanism at low temperatures.
Background technology
Along with variation of temperature, the volume of material can expand or shrink, the dependent variable of material production during thermal expansivity representation unit temperature variation.In fields such as space flight and superconductions, thermal expansivity is a very crucial parameter of carrying out material selection and structural design.The environment temperature that spacecraft moves in space will be well below room temperature, but spacecraft assembles at ground environment, when space moves, because the difference of the part thermal expansivity that different materials is formed, its drawdown deformation degree difference, might cause seal fails or web member " locking ", serious may cause some parts global failure, leads to disastrous consequence.To support and insulate with epoxy resin or insulation film between superconducting magnet coil and the coil, owing to will bear repeatedly thermal shock in its use, if it is too big that the thermal expansivity of superconducting magnet coil and insulation film differs, will cause the insulation film fracture to lose insulation function owing to producing very big thermal stress.
Therefore, the thermal expansivity of accurately measuring different materials is that the medium-and-large-sized engineering projects in field such as space flight and superconduction carry out that material is selected and the prerequisite of structural design.For having certain thickness three-dimensional structure material, the method for multiple measurement thermal expansivity is arranged at present.Wherein strain gauge method is a kind of method comparatively simple and commonly used.But since low-dimensional materials (one dimension wire rod and two-dimentional band) can not pressure-bearing and self intensity low, have only the method for MEASUREMENTS OF THIN thickness direction thermal expansivity at present, can't effectively measure thermal expansivity in the pellicular front.For the needs that use, a lot of production designing unit often adopts three-dimensional block test specimen to replace film to carry out the mensuration of thermal expansivity simply, and ignores the influence of material thickness.But studies show that in a large number because the influence of surface effect, all corresponding with it three-dimensional material of many physical propertys of low-dimensional materials has very big difference.Therefore, accurately measure the meaning of the existing scientific research of thermal expansivity of low-dimensional materials, engineering application background is arranged again.
Summary of the invention
Technical matters to be solved by this invention provides a kind of device that can directly measure low-dimensional materials (one dimension wire rod and two-dimentional band) thermal expansivity.
Technical scheme of the present invention:
Consider low-dimensional materials, can not bear pressure but can bear pulling force, utilize this character to design gas heat-transfer, two jacket heating systems (wherein a cover heater strip is installed in the woven hose), vacuum interlayer and heat protection screen double-layer heat insulation, two vertical installations of quartz rod (wherein carriage release lever relies on deadweight to compress the clock gauge head).
The beneficial effects of the utility model: the accurate measurement of low-dimensional materials thermal expansivity not only has engineering application background, and scientific meaning is arranged, and can be used for studying the influence to material parameter of surface effect and size effect.Here designed the efficient apparatus of a cover measurement low-dimensional materials thermal expansivity, this device can accurately be measured the thermal expansivity of low-dimensional materials in liquid nitrogen temperature (196 ℃)～room temperature range.Simultaneously, as long as this device is done simple the transformation, for example around heat protection screen, twine resistive heater, just probe temperature can be expanded to high temperature, if adopt the digital raster chi to replace clock gauge in addition, just the temperature signal of displacement signal and temperature controller can be passed to computing machine simultaneously, by writing simple program, can realize temperature automatically controlled, automatic data logging and processing, directly obtain the relation curve of smooth continuously temperature～thermal expansivity.
Description of drawings
Fig. 1 low-dimensional materials thermal expansivity measurement mechanism structural representation
Among the figure: pipe 4 in the heating rod 1, Dewar container for liquefied nitrogen 2, lead 3, woven hose, constant current source 5, connection terminal 6, fast joint 7, woven hose thermal insulating layer 8, woven hose outer tube 9, hot water radiation wire 10, temperature controller 11, vacuum interlayer 12, connector 13, thermometer 14, aspirating hole 15, heat protection screen 16, test specimen 17, fixedly quartz rod 18, venthole 19, hold-down support 20, mobile quartz rod 21, support plinth 22, clock gauge 23.
Embodiment
With the accompanying drawing is that the utility model is described in further detail for embodiment:
Low-dimensional materials thermal expansivity measurement mechanism comprises: pipe 4 in the heating rod 1, Dewar container for liquefied nitrogen 2, lead 3, woven hose, constant current source 5, connection terminal 6, fast joint 7, woven hose thermal insulating layer 8, woven hose outer tube 9, hot water radiation wire 10, temperature controller 11, vacuum interlayer 12, connector 13, thermometer 14, aspirating hole 15, heat protection screen 16, fixedly quartz rod 18, venthole 19, hold-down support 20, mobile quartz rod 21, support plinth 22, clock gauge 23.Connection on it between each parts:
Heating rod 1 is placed in the bottom of Dewar container for liquefied nitrogen 2, and heating rod 1 is connected with constant current source 5 by lead 3, connection terminal 6.Constant current source 5 is selected Y-20 for use.
Hot water radiation wire 10 is twined on the surface of an end of pipe 4 in woven hose, is provided with thermal insulating layer 8 between the pipe 4 in liquid pipe outer tube 9 and the woven hose; An end of pipe 4 inserts in the Dewar container for liquefied nitrogen 2 in the woven hose, and its lower end is positioned at the top of the fluid level of liquid nitrogen, and woven hose outer tube 9 one ends are connected with Dewar container for liquefied nitrogen 2 by fast joint 7.
The other end of woven hose outer tube (9) freely inserts vacuum interlayer (12), and other end of pipe 4 stretches in the heat protection screen 16 in the woven hose in it.Heat protection screen 16 is connected with vacuum interlayer 12 by connector 13.The top of vacuum interlayer 12 is provided with aspirating hole 15, and the right side of heat protection screen 16 sets out pore 19 and leads to greatly to gas through vacuum interlayer 12.Low temperature resistant and the coefficient of heat conductivity materials with smaller of the material selection of heat protection screen 16 is made.
Fixedly quartz rod 18 is fixed in the vacuum interlayer 12 by hold-down support 20, and the upper end of mobile quartz rod 21 and test block 17 are bonding, and following hole in heat protection screen 16 and the vacuum interlayer 12 is passed in the lower end, freely hangs and closely contacts with clock gauge 23;
The aperture of vacuum interlayer 12 lower ends and the diameter of mobile quartz rod 21 are near (than the only big 0.2mm of quartz rod diameter), and the aperture side seal welding of vacuum interlayer 12 guarantees layer vacuum.
Fixedly the support plinth 22 of clock gauge 23 has the vertical adjusting amount of 3～5mm, and clock gauge 23 is initially in compressive state.
Before the experiment clock gauge 23 is raised, produce certain initial crush.Spray cold nitrogen by pipe 4 in the woven hose in heat protection screen 16 then from Dewar container for liquefied nitrogen 2, along with the reduction of temperature, test specimen shrinks, and promotes mobile quartz rod 20, clock gauge 23 cursor backwards.If actual temperature than predetermined temperature height, can increase the cold nitrogen amount of outflow by the heating rod 1 in the heating Dewar container for liquefied nitrogen 2, reduce temperature; If actual temperature is lower than predetermined temperature, the hot water radiation wire 10 in the woven hose that heating is connected with temperature controller 11, rising temperature.Because the sustained height temperature field is even substantially, two quartz rod drawdown deformations remove and connect the test specimen part, and other parts can be repealed by implication.Therefore, the amount of contraction difference of two quartz rods in the alternating temperature process is:
ΔS＝L×0.51×10
-6×ΔT
Wherein L is a test specimen length, 0.51 * 10
-6Be the thermal expansivity of quartz material, Δ T is a temperature variation.
Therefore, in the alternating temperature process, if the reading variable quantity of clock gauge is S, then the mean thermal expansion coefficients of material in this warm area is:
Like this, by continuous temperature control, can obtain the thermal expansivity of test specimen from liquid nitrogen temperature (196 ℃)～room temperature.
Claims (1)
1. low-dimensional materials thermal expansivity measurement mechanism is characterized in that: constitute being connected between the parts of this measurement mechanism:
Heating rod (1) is placed in the bottom of Dewar container for liquefied nitrogen (2), and heating rod (1) is connected with constant current source (5) by lead (3), connection terminal (6);
Hot water radiation wire (10) is twined on the surface of pipe (4) one ends in woven hose, is provided with thermal insulating layer (8) between the pipe (4) in woven hose outer tube 9 and the woven hose; An end of pipe (4) inserts in the Dewar container for liquefied nitrogen (2) in the woven hose, and an end of woven hose outer tube (9) is connected with Dewar container for liquefied nitrogen (2) by fast joint (7);
Temperature controller (11) one ends are connected with hot water radiation wire (10), and the other end is with the thermometer (14) of quartz rod (18) end links to each other with sticking on fixedly by connection terminal (6);
The other end of woven hose outer tube (9) freely inserts vacuum interlayer (12), and other end of pipe (4) stretches in the heat protection screen (16) in the woven hose in it; Heat protection screen (16) is connected with vacuum interlayer (12) by connector (13); The top of vacuum interlayer (12) is provided with aspirating hole (15); The right side of heat protection screen (16) sets out pore (19) and leads to atmosphere through vacuum interlayer (12);
Fixedly quartz rod (18) is fixed in the vacuum interlayer (12) by hold-down support (20), the upper end of mobile quartz rod (21) and test block (17) are bonding, hole following in heat protection screen (16) and the vacuum interlayer (12) is passed in the lower end, freely hangs and closely contacts with clock gauge (23);
Fixedly the support plinth (22) of clock gauge (23) has the vertical adjusting amount of 3～5mm, and clock gauge (23) is initially in compressive state;
Test block (17) utilizes mechanical compaction or two kinds of methods of epoxy bonds firmly to be connected with mobile quartz rod (21) end with fixing quartz rod (18) respectively, clock gauge (23) is fixed on the support plinth (22) by a physical construction, and mobile quartz rod (20) relies on own wt closely to contact with clock gauge (23) meter pointer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320126700 CN2660523Y (en) | 2003-12-12 | 2003-12-12 | Low dimensional material thermal expansion coefficient measurer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320126700 CN2660523Y (en) | 2003-12-12 | 2003-12-12 | Low dimensional material thermal expansion coefficient measurer |
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| Publication Number | Publication Date |
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| CN2660523Y true CN2660523Y (en) | 2004-12-01 |
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| CN 200320126700 Expired - Fee Related CN2660523Y (en) | 2003-12-12 | 2003-12-12 | Low dimensional material thermal expansion coefficient measurer |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957334A (en) * | 2010-09-26 | 2011-01-26 | 东南大学 | Low-temperature physical property measuring device of solid material |
| CN102410261A (en) * | 2010-09-26 | 2012-04-11 | 中国科学院兰州地质研究所 | Liquid nitrogen pump |
| CN103149236A (en) * | 2013-01-31 | 2013-06-12 | 中国科学院上海技术物理研究所 | Low-temperature material linear expansion coefficient measuring method and low-temperature material linear expansion coefficient measuring device |
| CN103543172A (en) * | 2012-07-09 | 2014-01-29 | 上海劲嘉建材科技有限公司 | Device and method for measuring and calculating linear thermal expansion coefficient |
| CN106353360A (en) * | 2016-10-10 | 2017-01-25 | 中国科学院合肥物质科学研究院 | Testing device for thermal expansion coefficient of irregular-shaped material at low temperature |
| CN111007092A (en) * | 2020-01-02 | 2020-04-14 | 中国科学院化学研究所 | Low-temperature XRD testing device, testing equipment and testing system |
| CN113410332A (en) * | 2021-05-27 | 2021-09-17 | 中国电子科技集团公司第十一研究所 | Chip bonding heating device and method thereof |
-
2003
- 2003-12-12 CN CN 200320126700 patent/CN2660523Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957334A (en) * | 2010-09-26 | 2011-01-26 | 东南大学 | Low-temperature physical property measuring device of solid material |
| CN102410261A (en) * | 2010-09-26 | 2012-04-11 | 中国科学院兰州地质研究所 | Liquid nitrogen pump |
| CN101957334B (en) * | 2010-09-26 | 2012-06-27 | 东南大学 | Low-temperature physical property measuring device of solid material |
| CN103543172A (en) * | 2012-07-09 | 2014-01-29 | 上海劲嘉建材科技有限公司 | Device and method for measuring and calculating linear thermal expansion coefficient |
| CN103543172B (en) * | 2012-07-09 | 2016-02-24 | 上海劲嘉建材科技有限公司 | A kind of measuring and calculating device of coefficient of linear thermal expansion and measuring method |
| CN103149236A (en) * | 2013-01-31 | 2013-06-12 | 中国科学院上海技术物理研究所 | Low-temperature material linear expansion coefficient measuring method and low-temperature material linear expansion coefficient measuring device |
| CN103149236B (en) * | 2013-01-31 | 2015-01-07 | 中国科学院上海技术物理研究所 | Low-temperature material linear expansion coefficient measuring method and low-temperature material linear expansion coefficient measuring device |
| CN106353360A (en) * | 2016-10-10 | 2017-01-25 | 中国科学院合肥物质科学研究院 | Testing device for thermal expansion coefficient of irregular-shaped material at low temperature |
| CN111007092A (en) * | 2020-01-02 | 2020-04-14 | 中国科学院化学研究所 | Low-temperature XRD testing device, testing equipment and testing system |
| CN113410332A (en) * | 2021-05-27 | 2021-09-17 | 中国电子科技集团公司第十一研究所 | Chip bonding heating device and method thereof |
| CN113410332B (en) * | 2021-05-27 | 2022-08-19 | 中国电子科技集团公司第十一研究所 | Chip bonding heating device and method thereof |
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