CN2658943Y - Improved structure of heat-transfer plate - Google Patents
Improved structure of heat-transfer plate Download PDFInfo
- Publication number
- CN2658943Y CN2658943Y CN 03237728 CN03237728U CN2658943Y CN 2658943 Y CN2658943 Y CN 2658943Y CN 03237728 CN03237728 CN 03237728 CN 03237728 U CN03237728 U CN 03237728U CN 2658943 Y CN2658943 Y CN 2658943Y
- Authority
- CN
- China
- Prior art keywords
- heat
- embedding groove
- conducting plate
- ditch
- open side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
An improved heat conducting plate, matched with a mosaic slot at the bottom of a radiator. The mosaic slot is provided with two opposite opening sides and two opposite inner walls around, and the heat conducting plate is provided with a body and two containing channels. This body of the plate is provided with a connection plane, of which the central area is bound to the bottom of the radiator by heat conducting cream. The two containing channels are arranged on the connection plane, respectively adjacent to the two opposite opening sides on the mosaic slot and connecting with the central area of the connection plane and the opening sides. The containing channels hold the excess heat conductive cream overflowed under the pressure, avoiding its overflowing to the opening sides, thereby keeping the edges of the heat conducting plate and the radiator clean.
Description
Technical field
The utility model relates to a kind of heat-conducting plate improvement structure, relates in particular to a kind of heat-conducting plate improvement structure that is adhered under the radiator.
Background technology
Heat abstractor is mainly assisting heat generating component to reduce temperature in real time and promptly, to keep its normal running.And cooperating the dimensions and the required rate of heat dispation of heat generating component, the large-area heat radiator that heat abstractor is formed by most fin at least and the heat-conducting plate of a high thermal conductivity coefficient are combined.The heat that transmits heat generating component fast and produced by heat-conducting plate is to fin, to realize the effect of heat radiation.
See also shown in Figure 1, existing heat-conducting plate 4 cooperates the rectangle embedding groove 50 that is adhered to radiator 5 bottoms, has the relative inwall 54 of two relative open side 52 around this embedding groove 50 with two, this heat-conducting plate 4 comprises a rectangle plate body 40, this plate body 40 has smooth composition surface 44, and pressing heat-conducting cream 6 is adhered fixing mutually between these composition surface 44 zone lines and radiator 5 bottoms.
See also shown in Figure 2, above-mentioned existing heat-conducting plate 4, because heat-conducting cream 6 pressurizeds can be held to excessive, cause superfluous heat-conducting cream 6 to overflow and be attached to radiator 5 and heat-conducting plate 4 lateral margin surfaces from the open side 52 of embedding groove 50, must remove the heat-conducting cream 6 that overflows in other secondary operations, time-consuming taking a lot of work increases cost.
Therefore, as from the foregoing, above-mentioned existing heat-conducting plate on reality is used, obviously has inconvenience and exists with defective, and remain to be improved.
Summary of the invention
At above-mentioned the deficiencies in the prior art, main purpose of the present utility model, be to provide a kind of heat-conducting plate improvement structure, when making the adhesion of heat-conducting plate and radiator, heat-conducting cream can not overflow by pressurized, and then the heat-conducting cream that does not overflow secondary operations removing in addition, save the work and the time cost of manufacturing and assembling.
To achieve these goals, the utility model provides a kind of heat-conducting plate improvement structure, cooperate the embedding groove that is adhered to the radiator bottom, has open side around this embedding groove, this heat-conducting plate comprises plate body and holds ditch, this plate body has the composition surface, and the pressing heat-conducting cream is adhered fixing mutually between this composition surface zone line and the radiator bottom; This holds ditch and is located at this composition surface, holds open side interior and the separation composition surface zone line and the open side of contiguous this embedding groove of ditch, holds ditch and holds the superfluous heat-conducting cream that pressurized overflows and opens.Hold offering of ditch, overflow to the open side direction of embedding groove after blocking the heat-conducting cream pressurized, can keep the clean of lateral margin surface after making heat-conducting plate and radiator bonding, the heat-conducting cream that does not overflow secondary operations is in addition removed.
Brief description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and beneficial effect thereof apparent by detailed description to preferred embodiment of the present utility model.
In the accompanying drawing,
Fig. 1 is for having the three-dimensional exploded view before heat-conducting plate and radiator are adhered mutually now;
The three-dimensional combination figure that heat-conducting cream overflowed when Fig. 2 adhered with radiator mutually for existing heat-conducting plate;
Fig. 3 is the three-dimensional exploded view before the utility model heat-conducting plate and radiator are adhered mutually;
Three-dimensional combination figure when Fig. 4 adheres with radiator mutually for the utility model heat-conducting plate;
Fig. 5 holds the partial sectional view that ditch is accommodated the excessive superfluous heat-conducting cream of opening of pressurized when adhering mutually with radiator for the utility model heat-conducting plate.
Embodiment
For further setting forth the utility model is technological means and the effect that the predetermined purpose of realization is taked, see also following about detailed description of the present utility model and accompanying drawing, the purpose of this utility model, feature and characteristics, can obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the utility model is limited.
See also Fig. 3 and shown in Figure 4, the utility model is a kind of heat-conducting plate improvement structure, cooperate the embedding groove 20 that is adhered to radiator 2 bottoms, this embedding groove 20 is a rectangle, has the relative inwall 24 of two relative open side 22 around the embedding groove 20 with two, this heat-conducting plate 1 comprises that a plate body 10 and two holds ditch 12, wherein:
Plate body 10 is a rectangle, and it has composition surface 14, and pressing heat-conducting cream 3 (as tin cream) is adhered fixing mutually between these composition surface 14 zone lines and radiator 2 bottoms.This plate body 10 also has and encloses two opposing sidewalls faces 16 and the two opposite end faces 18 that form, and side wall surface 16 is matched with the inwall 24 of this embedding groove 20, and end face 18 is matched with the open side 22 of this embedding groove 20.Tossing about of the composition surface 14 of this plate body 10 is flat outer surface 19 (as shown in Figure 5), and this outer surface 19 is against a heat generating component (figure slightly).
Hold ditch 12 and be located at this composition surface 14, this two holds in two open side 22 that ditch 12 is respectively adjacent to this embedding groove 20 and separates composition surface 14 zone lines and open side 22.In the present embodiment, this two holds the open side 22 that ditch 12 is parallel to embedding groove 20, also is parallel to the end face 18 of this plate body 10, and is respectively adjacent in the biend 18.This two holds two side wall surfaces 16 that ditch 12 2 ends are positioned at this plate body 10, and be through to two inwalls 24 of this embedding groove 20, therefore two hold composition surface 14 zone lines that ditch 12 blocks heat-conducting cream 3 places fully, stop heat-conducting cream 3 pressurizeds to overflow when opening, open side 22 to embedding groove 20 is overflowed, and can be as shown in Figure 5, hold ditch 12 by two and hold the superfluous heat-conducting cream 3 that pressurized overflows and opens, just as the interception function of dredging the Great Gulch canal to limit heat-conducting cream 3 fully between heat-conducting plate 1 and radiator 2, whereby, as shown in Figure 4, heat-conducting plate 1 with radiator 2 adhesions fixing after, the heat-conducting cream 3 that does not overflow, and can keep open side 22 lateral margin surfaces clean of the end face 18 of heat-conducting plate 1 and radiator 2, need not secondary operations remove, save the time and the work of making and assembling.The shape of holding ditch 12 can be drain, arc ditch or triangular groove, all can hold the superfluous heat-conducting cream 3 that pressurized overflows and opens.
Therefore, heat-conducting plate improvement structure of the present utility model, have following characteristics: this two holds offering of ditch, overflow to the open side direction of embedding groove after blocking the heat-conducting cream pressurized, provide the space to accommodate superfluous heat-conducting cream, can keep the clean of lateral margin surface after making heat-conducting plate and radiator bonding, the heat-conducting cream that does not overflow secondary operations is in addition removed.
Yet, the above, only be the detailed description and the accompanying drawing of specific embodiment of the utility model, be not in order to restriction the utility model and feature of the present utility model, the ordinary skill personage of all these technical fields, everyly modify or change according to design of the present utility model being equal to of doing, all should be contained in the claim of the utility model.
Claims (6)
1, a kind of heat-conducting plate improvement structure cooperates the embedding groove that is adhered to the radiator bottom, has open side around this embedding groove, it is characterized in that this heat-conducting plate comprises:
Plate body, it has the composition surface, and the pressing heat-conducting cream is adhered fixing mutually between this composition surface zone line and the radiator bottom; And
Hold ditch, it is located at this composition surface, and this holds open side interior and the separation composition surface zone line and the open side of contiguous this embedding groove of ditch, holds ditch and holds the superfluous heat-conducting cream that pressurized overflows and opens.
2, heat-conducting plate improvement structure as claimed in claim 1 is characterized in that having two relative inwalls around this embedding groove, and this holds two inwalls that ditch two ends are through to this embedding groove.
3, heat-conducting plate improvement structure as claimed in claim 2 is characterized in that this plate body has the inwall that two opposing sidewalls faces are matched with this embedding groove, and this holds ditch two ends and is positioned at this two side wall surface.
4, heat-conducting plate improvement structure as claimed in claim 1 is characterized in that this plate body has the open side that end face is matched with this embedding groove, and this holds ditch and is parallel to this end face, and in the proximate end face.
5, heat-conducting plate improvement structure as claimed in claim 1 is characterized in that this holds the open side that ditch is parallel to embedding groove.
6, heat-conducting plate improvement structure as claimed in claim 1, it is characterized in that, this embedding groove is a rectangle, this plate body is a rectangle, has the relative inwall of two above-mentioned relatively open side around the embedding groove with two, this heat-conducting plate comprises the two above-mentioned ditches that hold, and this two holds ditch and be respectively adjacent in this two open side and separate composition surface zone line and open side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03237728 CN2658943Y (en) | 2003-09-30 | 2003-09-30 | Improved structure of heat-transfer plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03237728 CN2658943Y (en) | 2003-09-30 | 2003-09-30 | Improved structure of heat-transfer plate |
Publications (1)
Publication Number | Publication Date |
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CN2658943Y true CN2658943Y (en) | 2004-11-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 03237728 Expired - Fee Related CN2658943Y (en) | 2003-09-30 | 2003-09-30 | Improved structure of heat-transfer plate |
Country Status (1)
Country | Link |
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CN (1) | CN2658943Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105208831A (en) * | 2015-09-24 | 2015-12-30 | 小米科技有限责任公司 | Composite heat conduction structure and mobile device |
CN109219307A (en) * | 2017-06-30 | 2019-01-15 | 深圳富泰宏精密工业有限公司 | Radiator structure and electronic device with the radiator structure |
-
2003
- 2003-09-30 CN CN 03237728 patent/CN2658943Y/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105208831A (en) * | 2015-09-24 | 2015-12-30 | 小米科技有限责任公司 | Composite heat conduction structure and mobile device |
CN105208831B (en) * | 2015-09-24 | 2019-03-01 | 小米科技有限责任公司 | Composite heat-conducting structure and mobile device |
CN109219307A (en) * | 2017-06-30 | 2019-01-15 | 深圳富泰宏精密工业有限公司 | Radiator structure and electronic device with the radiator structure |
CN109219307B (en) * | 2017-06-30 | 2021-08-17 | 深圳富泰宏精密工业有限公司 | Heat radiation structure and electronic device with same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041124 Termination date: 20091030 |