CN2642920Y - Novel interface staggered adhesive bamboo floor - Google Patents
Novel interface staggered adhesive bamboo floor Download PDFInfo
- Publication number
- CN2642920Y CN2642920Y CN 03227357 CN03227357U CN2642920Y CN 2642920 Y CN2642920 Y CN 2642920Y CN 03227357 CN03227357 CN 03227357 CN 03227357 U CN03227357 U CN 03227357U CN 2642920 Y CN2642920 Y CN 2642920Y
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- China
- Prior art keywords
- bamboo
- floor
- lath
- model
- bamboo floor
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- Expired - Fee Related
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Abstract
The utility model relates to a novel joint dislocating bamboo plywood floorboard, of which the crossed joints of F-shaped and inverted F-shaped form are pieced together. The bamboo lathes on two sides of a middle layer board are wide bamboo lathes. When an upper layer, the middle layer and a lower layer are glued together, the middle layer bamboo seam is made to be crossed with the upper bamboo seam and the lower bamboo seam. The utility model has the advantages of practicality, reasonability, convenient installation and orderly and beautiful-looking molding board incision, which make the model of an ideal novel architect decoration material.
Description
Technical field
The utility model relates to building and ornament materials, especially relates to a kind of bamboo floor, specifically relates to a kind of new interface dislocation gluing bamboo floor.
Background technology
Generally, the bamboo floor is adopted three layers of bamboo chip to piece together gummed mutually mostly and is formed, as patent 97251327.2 " plate bamboo floor in the horizontal assembly " is to be composited by three layers of bamboo chip, wherein upper and lower two-layer be to arrange along bamboo fibre, the bamboo chip orientation of middle one deck is with two-layer vertical up and down, and the interface pattern of its limit portion is one protruding one recessed (as Fig. 1) or two protruding two recessed (as Fig. 2).One protruding one recessed contact surface is less, and the floor amalgamation of adjacent bamboo is firm inadequately; Though two protruding two recessed contact surfaces increase, and are single protruding thinner, are easy to during amalgamation fracture, and also are difficult for guaranteeing the amalgamation quality.The la m on existing bamboo floor, except horizontal assembly, also have and crisscrossly piece together mutually, and add two vertical rectangular bamboo chips on the both sides of la m, make the interface on moulding bamboo floor look neat appearance, but this moment is if the upper, middle and lower-ranking plate is when a vertical lap seam glues together mutually, if glue is aging then easy to crack.
Summary of the invention
The purpose of this utility model is to provide a kind of new interface, and the upper, middle and lower-ranking plate is not glued together mutually at a vertical lap seam place, makes the customer see that the middle plate interface limit on both sides is smooth attractive in appearance again, amalgamation convenience between adjacent bamboo floor, service-strong bamboo floor.
The technical solution of the utility model is, interface adopts " F " type and " fall F " type, and cooperations (Fig. 3) that interlace can increase contact area like this, is convenient to installation again; The side plate of la m design wider width misplaces with upper and lower plate during gummed, makes δ
1-δ
2〉=3~15mm, la m both sides lath and upper and lower two layers equidirectional outside, mostly be transverse plate greatly, an end of la m length direction " fall F " type interface section is arranged vertical little bamboo bar A, A is 10~20cm, can make full use of the former bamboo and the bamboo tail of minor diameter like this.
Description of drawings
Fig. 1 is one protruding one recessed interface schematic diagram in the prior art.
Fig. 2 is two protruding two recessed interface schematic diagrames in the prior art.
Fig. 3 is " F type " of the present utility model and " F " type interface schematic diagram.
Fig. 4 is structural representation of the present utility model.
Fig. 5 is the utility model vertical section schematic diagram.
Fig. 6 is for the upper strata bamboo lath is put schematic diagram.
Fig. 7 is for the middle level bamboo lath is put schematic diagram.
Fig. 8 is for lower floor's bamboo lath is put schematic diagram.
The utility model provides a kind of new interface dislocation gluing bamboo floor, and is novel in design unique, and structure is well-balanced rationally can to guarantee that product is indeformable, looks that flat appearance is attractive in appearance, thereby has satisfied consumer demand.
The specific embodiment
Below in conjunction with accompanying drawing, the utility model embodiment is described.
The utility model is vertically arranged by 7 of upper and lower layer bamboo laths, the edge strip on bamboo lath both sides, middle level also is vertical arrangement, other has 14 short bamboo bars transversely arranged, " F " end has 5 little bamboo laths vertically to arrange, above bamboo bar is glued together, form a bamboo floor, plate and upper and lower laminate δ in should guaranteeing during gummed
1-δ
2〉=3~15mm, " F " type and " F " type interface are processed in the surrounding, process irregular 6~9 vertical shallow slots in the bottom of lower plywood, groove width 3~6mm, groove depth 0.2~0.3mm interface is to increase frictional force.
Claims (3)
1, a kind of new interface dislocation gluing bamboo floor, piece together mutually by three layers of bamboo lath and to form, the two-layer bamboo lath orientation of upper and lower layer is to arrange along bamboo fibre, the middle level bamboo lath is for arranging in length and breadth, it is characterized in that, the interface pattern on bamboo floor is " F " type and " F " amalgamation that interlaces, the side plate bar on the both sides of la m and upper and lower two-ply dislocation gummed, and " F " type one end of la m is along vertical assembly of bamboo fibre weak point bamboo lath.
According to the new interface dislocation gluing bamboo floor of claim 1, it is characterized in that 2, the side plate bar of middle level edges of boards and upper and lower two-ply dislocation gummed are of a size of δ
1-δ
2〉=3~15mm.
3, according to the new interface dislocation gluing bamboo floor of claim 1, it is characterized in that la m is 10~20mm along the short bamboo lath A of bamboo fibre.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03227357 CN2642920Y (en) | 2003-04-10 | 2003-04-10 | Novel interface staggered adhesive bamboo floor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03227357 CN2642920Y (en) | 2003-04-10 | 2003-04-10 | Novel interface staggered adhesive bamboo floor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2642920Y true CN2642920Y (en) | 2004-09-22 |
Family
ID=34290914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 03227357 Expired - Fee Related CN2642920Y (en) | 2003-04-10 | 2003-04-10 | Novel interface staggered adhesive bamboo floor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2642920Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101870132A (en) * | 2010-06-21 | 2010-10-27 | 安吉县城峰竹制品有限公司 | Method for manufacturing bamboo beam |
CN102363311A (en) * | 2011-11-24 | 2012-02-29 | 筠连县权林豪门制造有限公司 | Preparation technology of three-layer composite finger-jointed plate |
-
2003
- 2003-04-10 CN CN 03227357 patent/CN2642920Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101870132A (en) * | 2010-06-21 | 2010-10-27 | 安吉县城峰竹制品有限公司 | Method for manufacturing bamboo beam |
CN102363311A (en) * | 2011-11-24 | 2012-02-29 | 筠连县权林豪门制造有限公司 | Preparation technology of three-layer composite finger-jointed plate |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |