CN2621341Y - Apparatus for testing defect of chip - Google Patents

Abstract

The utility model relates to a chip defect detector, in particular to a device to detect abnormal chips quickly and in time before grinding chips. The chip defect detector comprises a testing platform to carry a chip for testing; a ultrasonic detecting device arranged above the testing platform used to transmit plane ultrasonic to scan the chips and receive ultrasonic reflected by the chips; and a microprocessor used to process the ultrasonic reflected by the chips and transmit the ultrasonic to a monitor. The utility model is used to detect, whether the interior of the chip is defective.

Description

The chip defect detector

Technical field

The utility model relates to a kind of chip defect detector, refers in particular to a kind of being applied in the chip manufacturing proces, detects the device of defective chip.

Background technology

In the making of electronic equipment, in order to dwindle electronic circuit, the most normal use semiconductor wafer.Chip (wafer) surface needs the formality through multiple tracks processing, to obtain the splendid wafer of a flatness, could satisfy the demand of integrated circuit manufacture process.Its last procedure is wafer surface polishing (Wafer Polishing), and its process produces fragmentation sometimes.Need clear up material broken on the boards this moment many times of cost, and not only the material of waste grinding is also delayed speed of production.

Cause the reason of fragmentation, normally because of preceding working procedure left defective caused.Known, normally after preceding one formality, clean at once, clean and remake visual examination whether jagged (Chip), slight crack (Scratch) or lack the existence of dying thing and carry out the wafer surface polishing more later.Yet the shortcoming of traditional visual examination is to detect the defective of chip internal.

Prior art in the test after silicon wafer fabrication is finished, has the light microscope of use to add chemical solution observation indenture, or the X-ray instrument, to check its structural defective.Yet, when its apparatus expensive and Laboratory Fee,, and do not meet the efficient of production and the requirement on the cost if the chip defect that is used in before the polishing detects.

The utility model promptly provides a kind of method or device promptly to filter out unusual chip in advance in time, apace before polishing, to reduce the generation of fragmentation in the manufacturing process.

Summary of the invention

Main purpose of the present utility model provides a kind of chip defect detector, and it mainly provides a kind of checkout gear, can apace, filter out unusual chip in advance in time, to reduce the generation of fragmentation in the manufacturing process.

In order to achieve the above object, the utility model chip defect detector comprises a test platform, is in order to carry a chip for test; One ultrasonic detection device is to be arranged at this test platform top, in order to launch a planar ultrasonic wave to scan this chip and to receive the ultrasonic wave that this chip is reflected; And a microprocessor, in order to handle the ultrasonic wave that this chip reflects and to be sent to a monitor; Whether the inside of surveying this chip whereby exists defective.

Described test platform is a mechanical arm, in order to support and to adsorb this chip.

Described test platform is a plane formula test platform, and it includes the bearing device of this chip of support, and the platform of this bearing device of carrying.

Described this platform is provided with pair of guide rails, to guide this ultrasonic detection device.

Described ultrasonic detection device has a transducer, and the inside of this transducer is provided with an emission part and an acceptance division.

Described ultrasonic detection device also is provided with sensing apparatus turnover with this chip of sensing in this transducer or supporting component, and transmits at the beginning signal or and finish signal and give this microprocessor.

The plane ultrasonic wave frequency that described ultrasonic detection device is launched is between 100,000,000 to 5,000,000,000 hertz.

The width of described ultrasonic detection device is the radius more than or equal to this chip.

Advantage of the present utility model is: the ultrasonic transducer in the utility model has piezoelectric effect (Piezoelectric effect), the pulse that potential pulse can be converted to stress is injected among the material, the defective of utilizing characteristic that material can conduct, absorbs and reflect elastic wave to come experimental material, can be in time, apace, filter out unusual chip in advance, to reduce the generation of fragmentation in the manufacturing process, so can enhance productivity and the product yield.

The utility model also will be described in further detail embodiment in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is a device schematic diagram of the present utility model;

Fig. 2 is the device schematic diagram that the utlity model has mechanical arm embodiment;

Fig. 3 is the device schematic diagram that the utlity model has platform-type test platform embodiment;

Fig. 4 is the utility model principle schematic and measures oscillogram.

Wherein, description of reference numerals is as follows:

Test platform 1

Mechanical arm 11 platform-type test platforms 12

Bearing device 121 platforms 122

Guide rail 123

Chip 2

Upper surface 21 bottom surfaces 22

Ultrasonic detection device 3

Transducer 31 coupling assemblings 32

Supporting component 33 sensing apparatus 34

Microprocessor 4

Monitor 5

Defective C1 alligatoring C2

Emargintion C3 amount oscillogram D

Ultrasonic wave W, W '

Embodiment

See also Fig. 1, be the device schematic diagram of the utility model chip defect detector.This device comprise a test platform 1 with the ultrasonic detection device 3 that carries a chip 2, a crossbar type to detect this chip 2.This ultrasonic detection device 3 have a ultrasonic transducer 31, a pair of coupling assembling 32 with the two ends that connect this transducer 31 respectively, and a pair of supporting component 33 to connect respectively and to support this to coupling assembling 32.This transducer 31 has hyperacoustic emission and receiving unit, pass the upper surface 21 of chip 2 in order to plane of departure ultrasonic wave W, and reception is by the bottom surface 22 of chip 2, the perhaps ultrasonic wave W ' that is reflected by fault location C1, C2, C3, wherein emission and receiving unit are to be located at the same side and to be accommodated in the transducer 31.

See also Fig. 2, be a kind of embodiment of the utility model chip defect detector.Wherein this test platform 1 can be a mechanical arm (robot) 11, and this mechanical arm has a CD-ROM drive motor 111, and one group of impeller 112 transfers to this ultrasonic detection device 3 belows test then in order to absorption or this chip 2 of gripping.One microprocessor 4 is set to receive the signal that this ultrasonic detection device 3 is transmitted, after treatment, passes to a monitor 5 and observe for operating personnel.

See also Fig. 3, for the another kind of example of the utility model chip defect detector is executed.Wherein this test platform 1 can be a plane formula test platform 12, its include a bearing device 121 with this chip 2 of support, a platform 122 to carry this bearing device 121, and pair of guide rails 123, to guide this ultrasonic detection device 3 these chips 2 of scanning.

When reflection supersonic wave w ' is undesired, set this microprocessor 4 and produce a warning sound, with the prompting operating personnel, and stop scanning and shift out this chip 2.Wherein this ultrasonic detection device 3 further can be provided with the turnover with this chip 2 of sensing in this transducer 31 or supporting component 33 of a sensing apparatus 34 (see figure 1)s, and transmit at the beginning signal S or and finish signal E (seeing also Fig. 4) and give this microprocessor 4, to judge beginning or to stop to scan this chip 2.

Measurement principle of the present utility model is as follows: ultrasonic inspection is a defective of utilizing characteristic that material can conduct, absorbs and reflect elastic wave to come experimental material, this ultrasonic transducer 31 is to have piezoelectric effect (Piezoelectric effect), the pulse that potential pulse can be converted to stress is injected among the material, its vibration frequency belongs to hyperacoustic scope greater than 100,000 hertz (Hz) usually, for thin material, ultrasonic velocity is $V=\sqrt{(\mathrm{Eg}/\mathrm{\ρ})},$ Wherein E is a young's modulus, and g is an acceleration of gravity, and ρ is a density.Can learn the speed of ultrasonic wave in chip whereby.

The utility model is to utilize pulse reflection method (pulse reflection), after a pulse generation and penetrable material, will produce reflected impulse on another surface, and pass transducer 31 back, utilize the time difference to multiply by the velocity of sound of material, can obtain the double thickness of material.If running into non-continuous face when penetrating, sound wave then partly will be reflected, at short time location will manifest a pulse on the monitor 5 this moment, in like manner can try to achieve the position of defective, continue to move this transducer 31 and do the scanning detection, can further determine the scope of defective.

See also Fig. 4, be principle schematic of the present utility model and measurement oscillogram thereof.Suppose that this chip 2 has the situation of three kinds of defectives, be respectively internal flaw C1, the alligatoring C2 of situation two, the emargintion C3 of situation three of situation one.When this transducer 31 receives by three kinds of ultrasonic wave W ' that situation reflected respectively, as long as compare with the bottom surface 22 normal ultrasonic waves that reflect by this chip 2, try to achieve its time difference, multiply by this hyperacoustic speed again, can learn two times of depth locations of defective, and be shown on this amount oscillogram D.

Therefore the utility model can provide a kind of method or device to filter out unusual chip in advance in time, apace, to reduce the generation of fragmentation in the manufacturing process.So can enhance productivity and the product yield.

The above content that discloses only is the utility model preferred embodiment, can not limit interest field of the present utility model with this, and therefore all equalizations of being done according to the utility model content change or modify, and still belong to the scope that the utility model is contained.

Claims (8)

1, a kind of chip defect detector is characterized in that it comprises:

One test platform, carrying one is for the chip of test on it;

The ultrasonic detection device of one crossbar type is arranged at this test platform top, and launches a planar ultrasonic wave to scan this chip and to receive the ultrasonic wave that this chip is reflected; And

The ultrasonic waves that one microprocessor, process chip reflect also transmits signals to a monitor.

2, chip defect detector as claimed in claim 1 is characterized in that described test platform is a mechanical arm.

3, chip defect detector as claimed in claim 1 is characterized in that described test platform is a plane formula test platform, and it includes the bearing device of this chip of support, and the platform of this bearing device of carrying.

4, chip defect detector as claimed in claim 3 is characterized in that described this platform is provided with pair of guide rails, this ultrasonic detection device of carrying on it.

5, chip defect detector as claimed in claim 1 is characterized in that described ultrasonic detection device has a transducer, and the inside of this transducer is provided with an emission part and an acceptance division.

6, chip defect detector as claimed in claim 1 it is characterized in that described ultrasonic detection device also can sensor chip turnover part be provided with a sensing apparatus, and transmission sensing signal is given this microprocessor.

7, chip defect detector as claimed in claim 1 is characterized in that plane ultrasonic wave frequency that described ultrasonic detection device launches is between 100,000,000 to 5,000,000,000 hertz.

8, chip defect detector as claimed in claim 1, the width that it is characterized in that described ultrasonic detection device is the radius more than or equal to this chip.

Images