CN2597905Y

CN2597905Y - Heat pipe mechanism for semiconductor refrigerator

Info

Publication number: CN2597905Y
Application number: CNU022929894U
Authority: CN
Inventors: 金湘�; 金湘彧; 明岗
Original assignee: Suzhou Samsung Electronics Co Ltd
Current assignee: Suzhou Samsung Electronics Co Ltd
Priority date: 2002-12-23
Filing date: 2002-12-23
Publication date: 2004-01-07
Anticipated expiration: 2012-12-23

Abstract

The utility model relates to a thermotube mechanism of a semiconductor refrigerating device, comprising a heat transmission room [5], a thermotube communicated with the heat transmission room [5]. The utility model is characterized in that the thermotube comprises a conflux pipe [3], a plurality of branch pipes [4] connected with one side of the conflux pipe [3], and a plurality of U pipes [2] connected with the other side of the conflux pipe [3]; the branch pipe [4] is connected with the heat transmission room [5]; each U pipe [2] is sleeved with a sleeve piece [1]. As the branch pipes, the conflux pipe and the U pipes are communicated with the heat transmission room, the pneumatolytic medium and the liquefacient medium in pipelines flow in contrary directions at same time. The medium flows in most of the parallel pipelines with little resistance, being beneficial for medium heat transmission and improving the thermal efficiency of the thermotube.

Description

The heat-pipe mechanism of semiconductor cooling device

Technical field

The utility model relates to the heat pipe on a kind of semiconductor cooling device.

Background technology

In the prior art, the heat radiation of semiconductor cooler or heat absorption heat pipe comprise heat transfer chamber, the heat pipe that is connected with heat transfer chamber, described heat pipe is to be connected in the heat transfer chamber after single heat pipe bends to a plurality of continuous S shapes, single heat pipe has an import and an outlet, medium import from heat pipe in heat transfer chamber enters heat pipe, flow into formation circulation in the heat transfer chamber from the outlet of heat pipe, the shortcoming of this heat pipe is that the flow resistance of gas or liquid medium is big, therefore caused Heat Transfer of Heat Pipe on Heat Pipe unbalanced, the Heat Transfer of Heat Pipe on Heat Pipe ability.

Summary of the invention

The purpose of this utility model is to provide the heat pipe of the little semiconductor cooling device of the flow resistance of a kind of medium in heat pipe.

The technical solution of the utility model is: a kind of heat pipe of semiconductor cooling device, comprise heat transfer chamber, the heat pipe that is connected with heat transfer chamber, described heat pipe comprises collecting pipe, the many arms that are connected with a side of described collecting pipe, the many U-shaped pipes that are connected with the opposite side of described collecting pipe, described arm is connected with heat transfer chamber, and described each U-shaped pipe is provided with nest plate.

The utility model compared with prior art has following advantage:

Because many arms, collecting pipe, U-shaped pipes are connected with heat transfer chamber, therefore the medium of medium that gasifies in each pipeline and liquefaction flows in pipeline simultaneously in opposite direction, medium flows in most of pipeline in parallel, the flow resistance of medium is little, help medium and conduct heat, the thermal efficiency of heat pipe is improved.

Description of drawings

Accompanying drawing 1 is a structural front view of the present utility model;

Accompanying drawing 2 is this practical right view; Wherein:

[1], nest plate; [2], U-shaped pipe; [3], collecting pipe; [4], arm; [5], heat transfer chamber;

The specific embodiment

Referring to accompanying drawing 1, a kind of heat pipe of semiconductor cooling device, comprise heat transfer chamber [5], the heat pipe that is connected with heat transfer chamber [5], described heat pipe comprise that horizontally disposed collecting pipe [3], many arms [4] that are connected with a side of described collecting pipe [3], many opposite sides with described collecting pipe [3] are connected and axial line perpendicular to the U-shaped pipe [2] of horizontal plane, described arm [4] is connected with heat transfer chamber [5], and described each U-shaped pipe [2] is provided with the nest plate [1] that the conduction heat is used.

In the accompanying drawing 1, the axial line of the axial line of described collecting pipe [3] and U-shaped pipe [2] is perpendicular.The axial line of the axial line of described collecting pipe [3] and arm [4] is perpendicular.The axial line of the axial line of described steel wire [1] and U-shaped pipe [2] is perpendicular.

Referring to accompanying drawing 2, described U-shaped pipe [2] is made up of multilayer, and every layer of U-shaped pipe [2] is connected with a collecting pipe [3] respectively.

Claims

1, a kind of heat-pipe mechanism of semiconductor cooling device, comprise heat transfer chamber [5], the heat pipe that is connected with heat transfer chamber [5], it is characterized in that: described heat pipe comprises collecting pipe [3], the many arms [4] that are connected with a side of described collecting pipe [3], the many U-shaped pipes [2] that are connected with the opposite side of described collecting pipe [3], described arm [4] is connected with heat transfer chamber [5], and described each U-shaped pipe [2] is provided with nest plate [1].

2, the heat-pipe mechanism of semiconductor cooling device according to claim 1 is characterized in that: the axial line of the axial line of described collecting pipe [3] and U-shaped pipe [2] is perpendicular.

3, the heat-pipe mechanism of semiconductor cooling device according to claim 1 is characterized in that: the axial line of the axial line of described collecting pipe [3] and arm [4] is perpendicular.

4, the heat-pipe mechanism of semiconductor cooling device according to claim 1 is characterized in that: described U-shaped pipe [2] is made up of multilayer, and every layer of U-shaped pipe [2] is connected with a collecting pipe [3] respectively.