CN2585527Y - Module power source printed circuit board - Google Patents

Module power source printed circuit board Download PDF

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Publication number
CN2585527Y
CN2585527Y CN 02289684 CN02289684U CN2585527Y CN 2585527 Y CN2585527 Y CN 2585527Y CN 02289684 CN02289684 CN 02289684 CN 02289684 U CN02289684 U CN 02289684U CN 2585527 Y CN2585527 Y CN 2585527Y
Authority
CN
China
Prior art keywords
pin
circuit board
printed circuit
power source
plate body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 02289684
Other languages
Chinese (zh)
Inventor
刘桂生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Suplet Co., Ltd.
Original Assignee
Beijing Suplet Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Suplet Co ltd filed Critical Beijing Suplet Co ltd
Priority to CN 02289684 priority Critical patent/CN2585527Y/en
Application granted granted Critical
Publication of CN2585527Y publication Critical patent/CN2585527Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a printed circuit board which is mainly used for module power supplies and electronic elements. On the basis of the prior art, a pin hole on a board body of a circuit board is changed into a T-shaped hole from a straight hole to make a pin cap of the pin for a needle to come out concealed into a thick hole on the lower part of the T-shaped hole. In this way, the pin cap can not be bulged from the back surface of the board body. The printed circuit board can be used for making a gap not reserved among the board body of the circuit board, a double-surface adhesive tape, and a shell of a module power supply. The utility model improves heat-conductive effect, can prevent the pin cap from topping the double-surface adhesive tape to be broken, and can also save the occupied space height of the pin cap. The printed circuit board can be used for various electronic elements of the module power supplies, etc., and can also be used for other occasions.

Description

The modular power source printed circuit board (PCB)
Technical field
The utility model relates to a kind of printed circuit board (PCB), especially for the printed circuit board (PCB) of modular power source.
Background technology
The printed circuit board (PCB) of modular power source comprises that circuit board plate body and pin go out pin, circuit element can be installed in the plate body front, between the shell of the back side (referring to establish the face of printed circuit) with modular power source cloth insertion sheet is set, that this adhesive plaster can rise is bonding, heat conduction and insulating effect.To go out the set-up mode of pin be to establish pin bores on the appropriate location of circuit board plate body to pin under the prior art, pin bores is a straight hole, pin goes out pin and passes pin bores, shank leans out from the plate body front, form the outer pin that connects usefulness, the pin cap is pressed on the aperture of plate body back side pin bores, and connects with printed circuit by welding manner.Because the pin cap of sort circuit plate is from plate body back side projection, cause following point: (1) makes between circuit board plate body, cloth insertion sheet and the modular power source shell three and leaves the space, influences circuit board and conducts heat to shell, has reduced radiating effect; (2) Tu Qi pin cap causes printed circuit with the short circuit between the shell easily with the cloth insertion sheet bursting; (3) the pin cap occupies spatial altitude, causes the difficulty of whole assembling under the certain situation of modular power source inner space height.Under this technical scheme, if the pin cap of projection is handled, it is polished by modes such as polishings, be easy to cause damage to printed circuit, therefore needing the other technologies scheme solves this long-standing problem.
The utility model content
For overcoming the defective of pin cap in circuit board plate body back side projection, the utility model improves existing printed circuit board (PCB), pin after the improvement goes out pin pin cap and is positioned in the plane at the circuit board plate body back side, can not avoid the problems referred to above that cause because of pin cap projection from projection on the back side.
The scheme that the utility model carries out technological improvement is: change the pin bores on the circuit board plate body into T type hole by straight hole, the pore that the shank that pin goes out pin passes top, T type hole leans out from the plate body front, and the pin cap is positioned at the gross porosity of bottom, T type hole.
Because the utility model changes the pin bores on the printed circuit board (PCB) plate body into T type hole, the pin cap that makes pin go out pin conceals in the gross porosity in T type hole, no longer from plate body back side projection, so just prevented problem because of the initiation of pin cap projection, can improve heat-conducting effect so that do not interspace between circuit board plate body, cloth insertion sheet and the shell; Can prevent that again the pin crown from breaking cloth insertion sheet, can also make not occupation space height of pin cap, for the integral body assembling provides spatial margin.
Description of drawings
Fig. 1 is the cross-sectional view of the related improvement part of the utility model.
Embodiment
Referring to Fig. 1, the printed circuit board (PCB) that the utility model provides comprises that the plate body 1 and the pin that are provided with pin bores go out pin, wherein pin bores is T type hole, and the pore 2 that the shank 3 that pin goes out pin passes top, T type hole leans out from plate body 1 front, and pin cap 5 is positioned at the gross porosity 4 of bottom, T type hole.
Described gross porosity 4 diameters generally should be slightly larger than pin cap 5 diameters, and the degree of depth generally should be slightly larger than the height of pin cap 5, can guarantee that like this pin cap 5 conceals in the gross porosity 4 fully, also can not influence other structures.
Described pin goes out pin and generally can connect by the printed circuit of welding manner with plate body 1 back side, and this welding manner promptly can be realized being electrically connected, and can play the fixation that pin is gone out pin again.
Described pin goes out pin and pin bores is generally several, and its quantity is determined by the requirement of module power supply circuit.
Can printed circuit be set overleaf as prior art on the described plate body 1, the positive electric component that connects.
The printed circuit board (PCB) that the utility model provides can be used for modular power source etc. printed circuit board (PCB) is arranged at element in the housing, also can be used for other aspects and substitute existing product.

Claims (3)

1. a modular power source printed circuit board (PCB) comprises that the plate body and the pin that are provided with pin bores go out pin, it is characterized in that described pin bores is T type hole, and the pore that the shank that pin goes out pin passes top, T type hole leans out from the plate body front, and the pin cap is positioned at the gross porosity of bottom, T type hole.
2. modular power source printed circuit board (PCB) as claimed in claim 1, the gross porosity slightly larger in diameter that it is characterized in that described T type pin bores is in pin cap diameter, and the gross porosity degree of depth is slightly larger than pin cap height.
3. modular power source printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that described pin goes out pin and connects by the printed circuit of welding manner with the plate body back side.
CN 02289684 2002-12-03 2002-12-03 Module power source printed circuit board Expired - Lifetime CN2585527Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02289684 CN2585527Y (en) 2002-12-03 2002-12-03 Module power source printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02289684 CN2585527Y (en) 2002-12-03 2002-12-03 Module power source printed circuit board

Publications (1)

Publication Number Publication Date
CN2585527Y true CN2585527Y (en) 2003-11-05

Family

ID=33749159

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02289684 Expired - Lifetime CN2585527Y (en) 2002-12-03 2002-12-03 Module power source printed circuit board

Country Status (1)

Country Link
CN (1) CN2585527Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943336A (en) * 2014-03-27 2014-07-23 宝电电子(张家港)有限公司 Electronic transformer
CN105014017A (en) * 2015-07-14 2015-11-04 中国科学院金属研究所 Complex structure ceramic core combination technology

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943336A (en) * 2014-03-27 2014-07-23 宝电电子(张家港)有限公司 Electronic transformer
CN105014017A (en) * 2015-07-14 2015-11-04 中国科学院金属研究所 Complex structure ceramic core combination technology
CN105014017B (en) * 2015-07-14 2018-07-10 中国科学院金属研究所 A kind of labyrinth ceramic core group technology

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: BEIJING SUPLET CO., LTD.

Free format text: FORMER NAME: BEIJING XINLEINENG CO., LTD.

CP03 Change of name, title or address

Address after: 100096 Beijing city Xisanqi xinleineng road building

Patentee after: Beijing Suplet Co., Ltd.

Address before: Beijing City, Xisanqi road 100096

Patentee before: Beijing Xinleineng Co., Ltd.

C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20121203

Granted publication date: 20031105