CN2579573Y - Super thin poly crystal diamond layer diamond cutting tool - Google Patents
Super thin poly crystal diamond layer diamond cutting tool Download PDFInfo
- Publication number
- CN2579573Y CN2579573Y CN 02289311 CN02289311U CN2579573Y CN 2579573 Y CN2579573 Y CN 2579573Y CN 02289311 CN02289311 CN 02289311 CN 02289311 U CN02289311 U CN 02289311U CN 2579573 Y CN2579573 Y CN 2579573Y
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- Prior art keywords
- cutter
- diamond
- polycrystalline diamond
- layer
- pcd
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Abstract
The utility model discloses a diamond cutter with polycrystalline diamond layers. The basic structure of the utility model is super-hard material polycrystalline diamond compacts, each of which is composed of one layer of polycrystalline diamonds and one layer of hard alloy, wherein, the thickness of the polycrystalline diamond layer of each polycrystalline diamond compact is less than 0.25 mm. The polycrystalline diamond compacts are welded on a metallic cutter body to form the diamond cutter with polycrystalline diamond layers. The utility model has the advantages that the machining difficulty of the cutter can be reduced; the machining cost of the cutter can be lowered; the high production efficiency can be increased.
Description
Technical field: the utility model relates to a kind of machine tool structure, particularly relates to a kind of ultra-thin polycrystalline diamond layer diamond cutter.
Background technology: composite polycrystal-diamond is at present domestic and international widely used a kind of instrument diamond composite superhard material, and structure is that cemented carbide substrate and one deck polycrystalline diamond (Polycrystalline diamond is called for short PCD) combine.Its main application is cutting tool, crushing cutter and wear parts, and the thickness of PCD layer is generally at 0.5mm, and having only South Africa De Beers (now being renamed as Element 6) company to produce the PCD layer is the PCD product of 0.3mm.
Consider the squeezing action of the chamfered edge or the back knife face of rake face, the PCD cutter that has requires the PCD layer to have certain thickness, as 0.5mm, 0.75mm even 1.0mm.But for a lot of cutters, the thickness of PCD layer is unimportant, the more important thing is sharpness, wearability and the impact resistance at cutting edge position, and unnecessary PCD thickness there is no other benefit except the difficulty and cost that increase sharpening.
In addition,, cause sharpening very difficult because the PCD layer of at present general PCD composite sheet is thicker, the making of general PCD cutter and reprocess and all need to adopt special-purpose sharpening machine, this has also brought certain degree of difficulty for the large-scale promotion of PCD cutter.
Summary of the invention: the utility model purpose is to improve the shortcoming of prior art, and a kind of ultra-thin polycrystalline diamond layer diamond cutter is provided.
For achieving the above object, the utility model is taked following design:
The ultra-hard material poly-crystal diamond compact that basic structure of the present utility model is made of one deck polycrystalline diamond and one deck carbide alloy; The polycrystalline diamond layer thickness of composite polycrystal-diamond is not more than 0.25mm.Be welded on by above-mentioned composite polycrystal-diamond and form a kind of ultra-thin polycrystalline diamond layer diamond cutter on the metal cutter hub.
Advantage of the present utility model:
1, can reduce the difficulty of processing of cutter greatly
The main component of PCD layer is present material---the diamond of in the world hard wear resistant, therefore compares with hard alloy cutter, sintex and converted steel cutter, and the PCD cutter has much higher sharpening difficulty.Grinding the PCD cutter generally needs special-purpose, expensive diamond cutter grinding machine and the higher special diamond emery wheel of sharpness, and prices are rather stiff thereby make the PCD cutter, and this has just limited the application of PCD cutter to a great extent.
The thickness of PCD layer greatly affects the difficulty of processing of cutter, notices in the practice, even the very small increase of PCD layer thickness sometimes all can increase the processing cost of cutter significantly, even can therefore make the tool sharpening failure.And when the PCD layer became thin, then the sharpening of PCD cutter will become than being easier to.When the reduced thickness of PCD layer arrives to a certain degree, adopting middlebrow small instruments and tools grinding machine to grind the PCD cutter also will become possibility.
2, can reduce the processing cost of cutter to a great extent, and enhance productivity
The attenuation of PCD layer not only makes the skive consumption of grinding PCD cutter significantly reduce, and the used time of grinding knife tool is also shortened greatly.If adopt the mode of electrolytic mill to come process tool, then the raising of its working (machining) efficiency more will make production efficiency be doubled and redoubled,
3, can strengthen the impact resistance of cutter to a certain extent, improve the service life of cutter
The PCD layer is thin more, and the rake face of the cutter of then making is also more near hard alloy layer, and is also just all the more obvious by support and buffering effect that hard alloy layer produced, thereby can strengthen the impact resistance of cutter, the service life of improving cutter to a certain extent.
Description of drawings:
Fig. 1 is the utility model structural representation
Fig. 2 is the utility model superhard cutter figure
The specific embodiment:
Embodiment 1: as shown in Figure 1, and the ultra-hard material poly-crystal diamond compact of basic structure of the present utility model for being constituted by one deck polycrystalline diamond 1 and one deck carbide alloy 2; The polycrystalline diamond layer thickness of composite polycrystal-diamond is 0.25mm.The superhard cutter that Fig. 2 is welded for composite polycrystal-diamond 3 and metal cutter hub 4.
Embodiment 2: press embodiment 1 described superhard cutter, the polycrystalline diamond layer thickness of its composite polycrystal-diamond is 0.20mm.
Embodiment 3: press embodiment 1 described superhard cutter, the polycrystalline diamond layer thickness of its composite polycrystal-diamond is 0.10mm.
Embodiment 4: press embodiment 1 described superhard cutter, the polycrystalline diamond layer thickness of its composite polycrystal-diamond is 0.05mm.
Claims (3)
1, a kind of ultra-thin polycrystalline diamond layer diamond cutter, it is characterized in that: the polycrystalline diamond layer thickness of composite polycrystal-diamond is 0.05-0.25mm.
2, a kind of ultra-thin polycrystalline diamond layer diamond cutter according to claim 1, it is characterized in that: the polycrystalline diamond layer thickness of described composite polycrystal-diamond is 0.20mm.
3, a kind of ultra-thin polycrystalline diamond layer diamond cutter according to claim 1, it is characterized in that: the polycrystalline diamond layer thickness of described composite polycrystal-diamond is 0.10mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02289311 CN2579573Y (en) | 2002-11-27 | 2002-11-27 | Super thin poly crystal diamond layer diamond cutting tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02289311 CN2579573Y (en) | 2002-11-27 | 2002-11-27 | Super thin poly crystal diamond layer diamond cutting tool |
Publications (1)
Publication Number | Publication Date |
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CN2579573Y true CN2579573Y (en) | 2003-10-15 |
Family
ID=33748891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02289311 Expired - Fee Related CN2579573Y (en) | 2002-11-27 | 2002-11-27 | Super thin poly crystal diamond layer diamond cutting tool |
Country Status (1)
Country | Link |
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CN (1) | CN2579573Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102069203A (en) * | 2011-01-27 | 2011-05-25 | 郑州市钻石精密制造有限公司 | Boring cutter with through groove for machining conduit hole |
CN104668598A (en) * | 2015-02-09 | 2015-06-03 | 华北水利水电大学 | Polycrystalline superhard cutting tool and preparation method thereof |
CN105382941A (en) * | 2014-08-21 | 2016-03-09 | 周振嘉 | Tool unit applied to ultrasonic machining |
CN106132607A (en) * | 2014-03-28 | 2016-11-16 | 三菱综合材料株式会社 | Rotary cutting tool with polycrystalline diamond sintered body |
-
2002
- 2002-11-27 CN CN 02289311 patent/CN2579573Y/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102069203A (en) * | 2011-01-27 | 2011-05-25 | 郑州市钻石精密制造有限公司 | Boring cutter with through groove for machining conduit hole |
CN106132607A (en) * | 2014-03-28 | 2016-11-16 | 三菱综合材料株式会社 | Rotary cutting tool with polycrystalline diamond sintered body |
US10399153B2 (en) | 2014-03-28 | 2019-09-03 | Mitsubishi Materials Corporation | Rotary cutting tool including polycrystalline diamond material |
CN105382941A (en) * | 2014-08-21 | 2016-03-09 | 周振嘉 | Tool unit applied to ultrasonic machining |
CN104668598A (en) * | 2015-02-09 | 2015-06-03 | 华北水利水电大学 | Polycrystalline superhard cutting tool and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |