CN2559183Y

CN2559183Y - Cooling device of soldering machine

Info

Publication number: CN2559183Y
Application number: CN 02239909
Authority: CN
Inventors: 姚世伟
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-06-12
Filing date: 2002-06-12
Publication date: 2003-07-02
Anticipated expiration: 2012-06-12

Abstract

The utility model discloses a cooling device of a soldering machine, wherein, a conveying track which is used to transfer a circuit board, an assisted welding groove which is positioned under the conveying track, a heating groove, and a soldering groove are arranged in the soldering machine. The utility model is characterized in that the cooling device is arranged at the adjacent position of the rear side of the soldering groove, the cooling device comprises an air cooling machine, which can output cold air with low temperature; an upper air outlet device provided with an air inlet opening and an air outlet notching opening, a lower air outlet device provided with an air inlet opening and an air outlet notching opening, two guide tubes, and a tube body which is used between the upper air outlet device and the lower air outlet device and the air cooling machine. When the air cooling machine outputs the cold air with low temperature, namely, the cold air with low temperature is sent to the upper and lower air outlet device by the guide tubes, after the circuit board is wrapped by the tin fluid above the soldering groove, the circuit board enters into the cold air field of the cold air which is sprayed by the upper and lower air outlet devices to reduce the temperature of the tin points on the circuit board, the frozen tin points is a plump circular arc bulging state. The utility model has the advantages of conducting effect among each layer of the circuit board advancing, and better steady effect.

Description

The cooling device of tin soldering machine

Technical field

The utility model relates to a kind of cooling device that is arranged in the tin soldering machine, circuit board can be lowered the temperature rapidly behind clad tin liquid, make tin point surface and inner all can rapid solidification, and avoid tin liquor in process of setting, to produce its surface compressed, make it full and reach the favorable conductive effect.

Background technology

See also shown in Figure 1, parts such as habit formula tin soldering machine 9 mainly has delivery track 91, helps weld groove 92, heating tank 93, solder bath 94, wherein, the chain of delivery track 91 can be carried circuit board 95 secretly and import in the tin soldering machine 9, and via help 92 pairs of circuit boards of weld groove 95 spray scaling powders, through heating tank 93 hyperthermia dryings, and solder bath 94 spray tin, and make circuit board 95 bottom surface clad tin liquids, and to derive at last outside tin soldering machine 9, its course of action is as shown in Figure 2.

See also Fig. 3, be the state diagram behind the circuit board clad tin liquid, it is thick that general circuit plate 95 all is that multi-layered sheet (about 4-8 layer) is compressed into 1.6-5mm, be covered with electronic building brick on the surface, electronic building brick 96 is interspersed on the circuit board with metal pin 97, because circuit board is the multiple field plate body, conduct electricity mutually in order to make each laminate physical efficiency, the design of guide hole 98 must be arranged, and the diameter of guide hole is very little, generally is about about 1mm.Form tin point 99 by the tin liquor solid welding in pin 97 or guide hole 98, this tin point has function fixing and conduction, and guide hole 98 also makes the circuit between each laminate body of circuit board be connected conducting by means of the envelope of filling out of tin point.

Above-mentioned Fig. 3 is disclosed as the form behind the circuit board clad tin liquid, because the tin liquor in the solder bath 94 is high-temperature liquid state, therefore the tin point 99 that forms behind the circuit board clad tin liquid can slightly be the protruding expansion state of arc because of surface tension, because of being lower than tin, external air temperature puts 99 temperature, so can make the surface toward interior contraction after tin point 99 chances are cold, and in the process of cooling, solidify gradually.

See also shown in Figure 4, when tin point 99 solidify finish after, tin point makes volume-diminished because of its surface compressed is containing, so full state when no longer being thermal expansion, the tin point 99 in the guide hole 98 particularly, its upper and lower surface is inner concavity, and this kind tin point can reduce structural strength and conductive capability.

Secondly, before tin point 99 does not solidify fully, if circuit board is vibrated because of carrying, cut processing such as pin, or because of replacing, during the collision unusual fluctuation, all easily causing to weld to relax or the tin point deformation.

Moreover, in the scolding tin process, the electronic building brick 96 of non-refractory (for example: microprocessor, integrated circuit ... Deng) meeting Yin Wendu decline is too slow and cause damage, so the non-refractory electronic building brick 96 behind the scolding tin can be lowered the temperature rapidly, is the problem points that the dealer looks forward to solution.

So, how to design a kind of cooling device,, make tin point condense fixing with real-time mode in the very first time so that circuit board is able to rapid cooling in being stained with after covering scolding tin, and the temperature of circuit board and electronic building brick can be reduced rapidly, be only main institute of the present utility model and ask.

Summary of the invention

The cooling device of the utility model tin soldering machine, be that solder furnace adjacent jet flow in tin soldering machine goes out cold air, this cold air is exported by cooling device, and this cooling device comprises: an air-cooler or air conditioner: wind outlet device on the exportable low temperature cold air: have air intake vent and air-out otch, wind outlet device once: have air intake vent and air-out otch and two conduits: in order to the body between upper and lower wind outlet device and the air-cooler.Wherein, air-cooler can produce the low temperature cold air, and cold air is transferred to upper and lower wind outlet device by two conduits up and down, and two wind outlet devices are the upper and lower sides that are positioned at solder bath side and delivery track up and down, and its air-out otch is the oblique angle setting, make the cold wind after blowing out blow to circuit board, and do not blow in the solder bath with the oblique angle.

This practicality newly has following effect and effect:

When circuit board be stained with on the solder bath cover the high temperature tin liquor after, promptly be transferred track ribbon from, at this moment be positioned at upper and lower two wind outlet devices of solder furnace side, its air-out otch can be at top, two sides, the end ejection cold air of circuit board, so that circuit board lowers the temperature in real time, and can solidify tin point in moment rapidly, make it keep the full outstanding state of circular arc, in addition, more make heat labile electronic building brick energy because of the damage that keeps from heat of lowering the temperature rapidly.

Following according to detailed description of the embodiment shown in the drawing as back:

Description of drawings

Fig. 1: for practising the schematic appearance of formula tin soldering machine.

Fig. 2: for practising the scolding tin process schematic diagram of formula tin soldering machine.

Fig. 3: be the schematic diagram before uncolled behind the circuit board clad tin liquid.

Fig. 4: be the schematic diagram of natural cooling behind the circuit board clad tin liquid.

Fig. 5: be the enforcing location schematic diagram of the utility model cooling device.

Fig. 6: be the formation schematic diagram of the utility model cooling device.

Fig. 7: be the last wind outlet device stereo appearance figure of the utility model cooling device.

Fig. 8: be the following wind outlet device stereo appearance figure of the utility model cooling device.

Fig. 9: for circuit board cools off schematic diagram in real time through cooling device.

Embodiment

Figure 5 shows that the enforcing location schematic diagram of the utility model cooling device, in the aforementioned techniques background, illustrated tin soldering machine 9 mainly by delivery track 91, help structures such as weld groove 92, heating tank 93, solder bath 94 to form.And the cooling device 10 that the utility model is set up mainly is provided in a side of solder bath 94 rear end adjacents, and lay respectively at the upper and lower side of delivery track 91, its cold air that blows out can flow to the circuit board 95 in moving on the track, after making circuit board 95 in a single day break away from solder bath 94, cooling is shunk rapidly with regard to being subjected to the cold air influence in real time.

Figure 6 shows that the structural map of the utility model cooling device, disclose cooling device 10 among the figure and include wind outlet device 2 on the air-cooler 1,, once wind outlet device 3 and two conduits 4 that connect upper and lower wind outlet device and air-cooler.Wherein, the stereo modelling of last wind outlet device 2 can be consulted Fig. 7, and the stereo modelling of wind outlet device 3 can be consulted Fig. 8 down.

In aforementioned, air-cooler 1 is for producing the refrigerant condenser of low temperature, and it can transfer to the

air intake vent

21,31 of upper and lower two

wind outlet devices

2,3 again from air outlet 11 outputs by conduit 4.Wherein, last wind outlet device 2 is a hollow box body, and its top has air intake vent 21, the bottom is the air-out otch 22 in narrow footpath, and air-out otch 22 is with a rake angle setting.Following wind outlet device 3 is a hollow box body, and it has the air-out otch 32 in an air intake vent 31 and a narrow footpath, and this air-out otch 32 is provided with an angle of inclination.Secondly, the turning point is provided with arc-shaped guide plate 33 in the casing of following wind outlet device 3, is beneficial to cold air and can be guided to air-out otch 32 smoothly.After air-cooler 1 produces the low temperature cold air, can import in upper and lower two

wind outlet devices

2,3, and go out from air-out

otch

22,32 jet flows.

When circuit board 95 be stained with on the solder furnace 94 cover the high temperature tin liquor after, promptly be with from solder bath 94 by delivery track 91, promptly gone out by air-out

otch

22,32 cold air by two

wind outlet devices

2,3 up and down of solder bath 94 sides this moment with the rake angle jet flow, have as shown in Figure 9, jet flow is backward spent with 60 in this oblique angle, influences the molten tin operation of solder bath 94 so cold air can not lead solder bath 94.

Because the cold air that air-out

otch

22,32 jet flows go out is sprayed directly on to top, the bottom surface of circuit board 95, so circuit board is stained with the tin point 99 that covers and just can be cooled off moment real-time (Real time), and inner and outer surface layers is solidified synchronously, make the tin point 99 in pin 97 and the guide hole 98 after solidifying, present full circular arc protrusion state, help promoting the conductive effect between circuit board 95 each level in the future, make firm effect better.

In sum, the cooling device of the utility model tin soldering machine has industrial utilization.

Claims

1. the cooling device of a tin soldering machine, wherein, have a delivery track in order to the transmission circuit plate in the tin soldering machine, be positioned at and help weld groove, heating tank and solder bath under the delivery track, it is characterized in that: cooling device is located at the contiguous place of rear side of solder bath, and it includes:

The air-cooler of one exportable low temperature cold air;

Wind outlet device on one has air intake vent and air-out otch;

Once wind outlet device has air intake vent and air-out otch: reach

Two conduits are in order to the body between upper and lower two wind outlet devices and the air-cooler.

2. the cooling device of tin soldering machine according to claim 1, it is characterized in that: the air-out otch of upper and lower wind outlet device has the inclination angle that can make cold air can not lead solder bath and influence its molten tin operation.

3. the cooling device of tin soldering machine according to claim 1, it is characterized in that: the air-out otch of upper and lower wind outlet device produces the otch in the narrow footpath of splendid jet flow effect for making cold air to quicken ejection.

4. the cooling device of tin soldering machine according to claim 1, it is characterized in that: the interior wall construction turning point of upper and lower wind outlet device is provided with the arc guide card that can make cold air flow to the air-out otch smoothly.