CN2552163Y - Structure of electroplated wire with positioning sign handy to be cut - Google Patents
Structure of electroplated wire with positioning sign handy to be cut Download PDFInfo
- Publication number
- CN2552163Y CN2552163Y CN 02233796 CN02233796U CN2552163Y CN 2552163 Y CN2552163 Y CN 2552163Y CN 02233796 CN02233796 CN 02233796 CN 02233796 U CN02233796 U CN 02233796U CN 2552163 Y CN2552163 Y CN 2552163Y
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- Prior art keywords
- plating line
- cut
- cutting
- utility
- model
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Abstract
The utility model provides a structure of electroplated wire with positioning sign handy to be cut. Each two groups of adjacent grid array chips are provided with a cutting passage in between. The margin junction of the cutting passage is provided with a soldering tin shielded film window. The window zone of each chip is internally provided with a positioning sign which is quite close to the cutting passage, wherein, the positioning sign is provided with an electroplated wire which is pulled out of the window zone from the positioning sign and connected with the electroplated wire of the cutting passage, so that all electroplated wires can be coated by the soldering tin shielded film instead of pulled up by the cutter and cut down. The utility model provides an electroplated wire with novel structure in order to solve the traditional problem of single burr, improve the productivity largely and reduce the production cost.
Description
Technical field
The utility model relates to a kind of spherical grid array encapsulation (chip-arrayba1l grid array; CA BGA), the structure of particularly cutting single plating line about a kind of Chip Packaging.
Background technology
In the integrated circuit encapsulation procedure, spherical grid array encapsulation cut the pattern that the folk prescription formula is to use cutting (saw), so in substrate back can the Design Orientation mark (fiducialmark) with the calibration identification point when cutting list and can be, therefore quite strictness of this specifically labelled position and accuracy of shape requirement in order to the particular point of identification product.
Traditional design as shown in Figure 1, chip array 30 is provided with the soldered ball 22 of arrayed, in the design of telltale mark 16, in order to cooperate the consideration on basal plate making process tolerance and the substrate layout, general telltale mark 16 will be quite near Cutting Road 11 and 13, and its scolding tin screening film is windowed and is distinguished the plating line 12 and 14 that 18 (solder mask opening) extend to Cutting Road, so that telltale mark 16 reaches the desired accuracy of cutting processing procedure.And in windowing district 18, this scolding tin screening film designs the shortest plating line 20 that is connected to the plating line 14 of this Cutting Road by telltale mark 16, its cutaway view as shown in Figure 2, the front of substrate 10 and the back side all scribble scolding tin and hide film (Solder Mask) 24,26, wherein owing to the plating line 20 in scolding tin screening film is windowed district 18 exposes, therefore this plating line structure, at cutting tool can under the situation of nature abrasion so-called burr problem (Burr) will take place.As shown in Figure 3, in cutting single processing procedure, because cutting tool is no longer sharp because of abrasion, so plating line 20 is by the cutter pull-up thereby produce the burr phenomenon, and this problem will cause the puzzlement of successive process, as final test (Final Test), mounted on surface processing procedure (Surface Mount Technology, SMT) etc.
Be to solve the burr problems, the dealer is essential usually to shut down changing cutting tool, and the cutter that will wear away ground in addition, plating line could be cut off really.Thus, not only must shorten the normal useful life of cutter, and must improve the safety stock of cutter, and increase the milling cutter expense, and the heavy industry cost etc. of cutting single burr product, so not only can significantly reduce production capacity, also can increase production cost.
Summary of the invention
The purpose of this utility model provides a kind of structure of plating line of new substrate identification point, utilizes scolding tin to hide the covering of film and makes plating line no longer by the cutter pull-up, cuts single burr problem with thorough solution.
Another purpose of the present utility model provides a kind of structure that can effectively improve the substrate identification point plating line of production capacity, need not shut down milling cutter in addition, does not also have the problem of cutting single burr faulty materials.
A purpose more of the present utility model provides a kind of structure of the substrate identification point plating line that can effectively reduce production costs, and can prolong cutter life, the heavy industry cost etc. that reduces the milling cutter expense and cut single burr product.
The utility model is achieved in that a kind of encapsulation cuts the structure of single identification point plating line, and comprising: a substrate is provided with the chip array of arranged, and is provided with a Cutting Road between per two adjacent ball grid array chips; The plural number district of windowing, that is located at per two adjacent ball grid array chips meets the place, angle, and extends to the plating line of this Cutting Road; The plural number telltale mark is located in this district of windowing on each this ball grid array chip, and quite near this Cutting Road; And plural plating line, pull out outside this district of windowing from described telltale mark, and extend to behind the cover layer below again drawing to the plating line of this Cutting Road.
Because the utility model is that the specifically labelled plating line of connection is pulled out windowed regions, be connected to the plating line of Cutting Road again, therefore can utilize scolding tin to hide the covering of film, no matter whether sharp cutting tool is, make plating line no longer be cut cutter and take up and can cut off really, cut single burr problem with solution.
The utility model is elaborated with specific embodiment below in conjunction with accompanying drawing, so that the effect that is easier to understand the purpose of this utility model, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 is the plating line connected mode of traditional design;
Fig. 2 is the plating line connected mode cutaway view of traditional design;
Fig. 3 is the burr structural representation after tradition is cut list;
Fig. 4 is the substrate back schematic diagram of ball grid array chip dress envelope of the present utility model;
Fig. 5 is a plating line connected mode schematic diagram of the present utility model;
Fig. 6 is a plating line partial sectional view of the present utility model.
Drawing reference numeral explanation: 10 substrates; 11 Cutting Roads; The plating line of 12 Cutting Roads; 13 Cutting Roads; The plating line of 14 Cutting Roads; 16 telltale marks; 18 scolding tin hide the film district of windowing; 20 plating lines; 22 soldered balls; 24 scolding tin hide film; 26 scolding tin hide film; 28 slits; 30 chip arrays; 32 ball grid array chips; 34 plating lines.
Embodiment
The utility model is to cut single caused burr problem at the encapsulation of CA BGA product, a kind of plating line drawing structure of substrate orientation mark is proposed, be after pulling out the path of plating line outside the district of windowing, be connected to the plating line of Cutting Road again, to utilize scolding tin to hide the covering of film, make plating line no longer be cut cutter and take up and can cut off really.
Overall structure of the present utility model is formed with the chip array of arranging with matrix-style 30 as shown in Figure 4 on a substrate 10, each unit is to be separated by slit 28, and the structure in the one chip array 30 sees also Fig. 5.
As shown in Figure 5, this chip array 30 comprises four (or more than four) ball grid array chips 32, plants the plural soldered ball 22 of arranged on it.When cutting single preparation work, be provided with Cutting Road 11 and 13 at two 32 adjacent of ball grid array chips, and in this four ball grid array chips 32 adjacent meet place, angles, be provided with a scolding tin and hide the film district 18 of windowing, and this scolding tin hides film district 18 of windowing and extends to the plating line 12 and 14 of this Cutting Road.In addition, each ball grid array chip 32 all is provided with telltale mark 16, and this telltale mark 16 is positioned at this scolding tin and hides film district 18 of windowing, and quite near above-mentioned Cutting Road 11 and 13, this telltale mark 16 also is provided with the plating line 14 that a plating line 34 is connected to this Cutting Road.
The drawing mode of above-mentioned plating line 34, be to pull out this scolding tin from this telltale mark 16 to hide after film windows outside the district 18, be arranged at the cover layer below, be connected to the plating line 14 of this Cutting Road again, plating function design when locating to finish cutting, simultaneously with reference to shown in Figure 6, the plating line 34 in Cutting Road 13 zones at substrate 10 back sides, be coated with the cover layer of one deck scolding tin screening film 24 on it, this scolding tin hides film 24 and is generally epoxy resin (epoxy resin).Owing to be to form this telltale mark 16 and this plating line 34 earlier on processing procedure; deposit one deck scolding tin again and hide film 24; then window in the top in these telltale mark 16 zones; therefore the scolding tin in these Cutting Road 13 zones hides the plating line 34 that film 24 can cover its below, and reaches the effect of this plating line 34 of protection.
Utilize and above-mentioned plating line is pulled out the district of windowing, be connected to the plating line of Cutting Road again, and hide film by scolding tin it is covered, so design is when cutting single processing procedure, no matter whether sharp cutting tool is, plating line all can utilize scolding tin to hide the covering of film and make it no longer by the cutter pull-up, and can cut off plating line really, with thorough solution burr problem.Therefore, the utility model not only can effectively solve traditional problem, and can prolong cutter life; need not shut down with milling cutter; and can reduce the safety stock and the tool lapping expense of cutter, and and there is not the heavy industry problem of burr product, therefore can significantly improve production capacity and reduce production costs.
The above embodiment only is for technological thought of the present utility model and characteristics are described, its purpose is to make those skilled in the art can understand content of the present utility model and implements according to this, rather than is used for limiting scope of the present utility model.Therefore, all equalizations of doing according to the spirit that the utility model disclosed change or modify, and must be encompassed within the scope of the present utility model.
Claims (2)
1. structure that single identification point plating line is cut in encapsulation comprises:
One substrate is provided with the chip array of arranged, and is provided with a Cutting Road between per two adjacent ball grid array chip;
The plural number district of windowing, that is located at per two adjacent ball grid array chips meets the place, angle, and extends to the plating line of this Cutting Road;
The plural number telltale mark is located in this district of windowing on each this ball grid array chip, and quite near this Cutting Road; And
The plural number plating line is pulled out outside this district of windowing from described telltale mark, and extends to behind a cover layer below drawing to the plating line of this Cutting Road again.
2. the structure of single identification point plating line is cut in encapsulation as claimed in claim 1, it is characterized in that described cover layer is that scolding tin hides film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02233796 CN2552163Y (en) | 2002-05-23 | 2002-05-23 | Structure of electroplated wire with positioning sign handy to be cut |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02233796 CN2552163Y (en) | 2002-05-23 | 2002-05-23 | Structure of electroplated wire with positioning sign handy to be cut |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2552163Y true CN2552163Y (en) | 2003-05-21 |
Family
ID=33708849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02233796 Expired - Lifetime CN2552163Y (en) | 2002-05-23 | 2002-05-23 | Structure of electroplated wire with positioning sign handy to be cut |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2552163Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100446187C (en) * | 2004-03-05 | 2008-12-24 | 三洋电机株式会社 | Semiconductor device and manufacturing method of the same |
| CN101222877B (en) * | 2005-07-01 | 2010-05-19 | E2V半导体公司 | Image sensor with corner cuts |
| US7796337B2 (en) | 2007-03-13 | 2010-09-14 | Visera Technologies Company Limited | Optical microstructure plate and fabrication mold thereof |
| CN102054708B (en) * | 2009-10-28 | 2012-12-12 | 联致科技股份有限公司 | Method for forming window ball grid array encapsulated pre-substrate |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
-
2002
- 2002-05-23 CN CN 02233796 patent/CN2552163Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100446187C (en) * | 2004-03-05 | 2008-12-24 | 三洋电机株式会社 | Semiconductor device and manufacturing method of the same |
| CN101222877B (en) * | 2005-07-01 | 2010-05-19 | E2V半导体公司 | Image sensor with corner cuts |
| US7796337B2 (en) | 2007-03-13 | 2010-09-14 | Visera Technologies Company Limited | Optical microstructure plate and fabrication mold thereof |
| CN101266306B (en) * | 2007-03-13 | 2011-09-21 | 采钰科技股份有限公司 | Optical microstructure plate and fabrication mold thereof |
| CN102054708B (en) * | 2009-10-28 | 2012-12-12 | 联致科技股份有限公司 | Method for forming window ball grid array encapsulated pre-substrate |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WEIYU SEMICONDUCTOR (HONG KONG) LTD. Free format text: FORMER OWNER: LIWEI SCIENCE AND TECHNOLOGY CO., LTD. Effective date: 20041210 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20041210 Address after: Hongkong Special Administrative Region of China Patentee after: WEIYU SEMICONDUCTOR (HONGKONG) Co.,Ltd. Address before: Taiwan, China Patentee before: VATE TECHNOLOGY CO.,LTD. |
|
| ASS | Succession or assignment of patent right |
Owner name: ASE (WEIHAI) INC. Free format text: FORMER OWNER: ADVANCED SEMICONDUCTOR ENGINEERING (HONG KONG) CO., LTD. Effective date: 20111201 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: ADVANCED SEMICONDUCTOR ENGINEERING (HONG KONG) CO. Free format text: FORMER NAME: WEIYU SEMICONDUCTOR (HONG KONG) CO., LTD. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: HONG KONG, CHINA TO: 264205 WEIHAI, SHANDONG PROVINCE |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Hongkong Special Administrative Region of China Patentee after: Advanced packaging and testing (Hongkong) Co.,Ltd. Address before: Hongkong Special Administrative Region of China Patentee before: WEIYU SEMICONDUCTOR (HONGKONG) Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20111201 Address after: 264205 No. 16-1, Hainan Road, export processing zone, Weihai economic and Technological Development Zone, Shandong, China Patentee after: RIYUEGUANG SEMICONDUCTOR(WEIHAI) Co.,Ltd. Address before: Hongkong Special Administrative Region of China Patentee before: Advanced packaging and testing (Hongkong) Co.,Ltd. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120523 Granted publication date: 20030521 |