CN2524273Y - CPU radiator - Google Patents
CPU radiator Download PDFInfo
- Publication number
- CN2524273Y CN2524273Y CN 01231572 CN01231572U CN2524273Y CN 2524273 Y CN2524273 Y CN 2524273Y CN 01231572 CN01231572 CN 01231572 CN 01231572 U CN01231572 U CN 01231572U CN 2524273 Y CN2524273 Y CN 2524273Y
- Authority
- CN
- China
- Prior art keywords
- processing unit
- central processing
- heat
- housing
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a CPU radiator, which comprises a conduction block glued on the CPU, and the conduction block is provided with a heat emission fin, and the neighboring side of the heat emission fin is provided with a heat emission fan, which makes the heat energy produced by CPU absorbed on the heat emission fin by the conduction block, and then the heat energy is taken away by the air flow produced by the heat emission fan. The utility model is characterized in that: the CPU radiator is provided with a guide device in the process of air flow running, and the guide device is towards to the other electronic parts near the CPU, which makes the parts of the air flow produced by the heat emission fan directly impact the other electronic parts, and the impacting effect can provided heat emission effect of the electronic parts.
Description
Technical field
The utility model relates to a kind of heat abstractor of central processing unit, relate in particular to a kind of making the heat of air-flow on taking away radiating fin that radiator fan produces, also can make the air-flow of part directly impact other electronic component place, so that make other electronic component also can reach the effect of heat radiation, other heat abstractor need not be installed in addition again.
Background technology
Now, generally be used in the heat abstractor on the central processing unit, as shown in Figure 1, this heat abstractor is to be used on the central processing unit of portable electronic product, it includes a housing 8, a side is equipped with radiator fan 81 in housing 8, the adjacent side of radiator fan 81 then is provided with a radiating fin 82, the heat-conducting block 83 of fitting in radiating fin 82 belows, heat-conducting block 83 belows then fit together with central processing unit 85 by a heat conduction film 84, and the heat that central processing unit 85 runnings are produced is absorbed heat to radiating fin 82 by heat-conducting block 83, and the air-flow that is produced by radiator fan 81 is taken away heat again.But, generally around central processing unit 85, also have other electronic component 86 also can produce heat energy, as shown in Figure 1, because this heat abstractor is positioned at central processing unit 85 tops, and the direction that air-flow is advanced is axial (shown in arrow among Fig. 1), make air-flow can't touch other highly lower electronic component 86 at all, and make other electronic component 86 can't reach the purpose of heat radiation at all.
Because known technology, the utility model designer is long-pending being engaged in the sector experience for many years, and in line with excelsior spirit, active research is improved, and the generation of the utility model " construction for heat radiating device of central processing unit " is arranged then.
Summary of the invention
Fundamental purpose of the present utility model is to provide a kind of heat abstractor of central processing unit, it is to make the heat of air-flow on taking away radiating fin that radiator fan produces, also can make the air-flow of part directly impact other electronic component place, so that make other electronic component also can reach the effect of heat radiation by guidance device.
The utility model relates to a kind of heat abstractor of central processing unit, it comprises a housing, this housing is installed in the central processing unit top, and the side in housing is equipped with radiator fan, in addition, a heat conduction film has been sticked on central processing unit, in the heat conduction film top and the heat-conducting block of fitting, the radiating fin of on heat-conducting block, fitting again, and radiating fin is positioned at housing, and be positioned at the adjacent side of radiator fan, its spy is:
This heat abstractor is provided with at least one guidance device in the formed air-flow course of radiator fan, this guidance device and towards other electronic component of the adjacent side of central processing unit directly impacts on other electronic component an air-flow part by this guidance device.
According to the heat abstractor of central processing unit described in the utility model, wherein this housing is made of a base and loam cake;
Wherein, this base is provided with an opening in the adjacent side of radiator fan, and just corresponding to central processing unit, this radiating fin placed the opening part of base when the appropriate housing in the position of this opening placed on the central processing unit;
Wherein this housing is forming breach away from a side of radiator fan, thereby makes heat be pulled away and leave housing from this indentation, there;
Wherein this radiating fin is a paliform;
Wherein this guidance device is provided with a guide plate, and this guide plate has an arc portion, and is provided with an air-flow port in this heat abstractor below, and this air-flow port is relative with guide plate, so that air-flow directly impacts on the electronic component by the air-flow port along this arc portion.
The advantage that the utility model had has following architectural feature with regard to being it: of the present utility model one is characterised in that the heat abstractor of this central processing unit comprises that one is fitted in the heat-conducting block on the central processing unit, on heat-conducting block, install a radiating fin again, the adjacent side of this radiating fin also is equipped with radiator fan, and the heat that the central processing unit running is produced, absorb heat to radiating fin by heat-conducting block, by the air-flow that radiator fan produced heat is taken away again, heat abstractor on this central processing unit is provided with a guidance device in air-flow is advanced the way, this guidance device and towards other electronic component of the adjacent side of central processing unit, the air-flow part that radiator fan is produced is directly impacted on other electronic component.
Description of drawings
Relevant the utility model is to reach technological means and the effect thereof that above-mentioned purpose, feature adopt, and exemplifies preferred embodiment now and conjunction with figs. is described as follows:
Fig. 1 is the combination diagrammatic cross-section of known technology;
Fig. 2 is an overall appearance synoptic diagram of the present utility model;
Fig. 3 is a perspective exploded view of the present utility model;
Fig. 4 is a combination diagrammatic cross-section of the present utility model.
Embodiment
The utility model is a kind of " construction for heat radiating device of central processing unit ", see also Fig. 2, shown in Figure 3, this heat abstractor 10 is to be used on the central processing unit 20 of portable electronic product in the present embodiment, it includes a housing 1, this housing 1 is made of a base 11 and loam cake 12, side in base 11 is equipped with radiator fan 2, loam cake 12 then is provided with a ventilating opening 121 corresponding to the position of radiator fan 2, this base 11 then is provided with an opening 111 in the adjacent side of radiator fan 2, when the appropriate housing 1 in the position of this opening 111 places on the central processing unit 20, opening 111 positions are just corresponding to central processing unit 20, this housing 1 is forming breach 13 away from a side of radiator fan 2 again, and makes heat be pulled away and leave housing 1 from this breach 13;
In the utility model, a heat conduction film 3 has been sticked on central processing unit 20, in heat conduction film 3 tops and the heat-conducting block 4 of fitting, this heat-conducting block 4 is a copper material, the heat that is produced when the characteristic of copper makes central processing unit 20 runnings is conducted to heat-conducting block 4, the radiating fin 5 of fitting again on the heat-conducting block 4.This radiating fin 5 is a paliform, and radiating fin 5 is positioned at opening 111 places of base 11.
In the utility model, this heat abstractor 10 is provided with at least one guidance device in radiator fan 2 formed air-flow courses, by this guidance device an air-flow part is led on other electronic component 30, in most preferred embodiment of the present utility model, this guidance device is provided with a guide plate 6, and be installed in loam cake 12 places, this guide plate 6 has an arc portion 61, and be provided with an air-flow port 62 in base 11, this air-flow port 62 is relative with guide plate 6, so that air-flow can directly impact on the electronic component 30 by air-flow port 62 along this arc portion 61.
Please continue referring to shown in Figure 4, the heat that when central processing unit 20 runnings, is produced, can be absorbed heat to heat-conducting block 4 earlier, absorbed heat to radiating fin 5 from heat-conducting block 4 again, at this moment, the air-flow that is produced during radiator fan 2 runnings can be taken away the heat on the radiating fin 5 together toward axial direction, shown in arrow among Fig. 4, at this moment, when the air-flow of part at a touch during guide plate 6, promptly can directly impact other electronic component 30 of central processing unit 20 adjacent sides, make other electronic component 30 also be subjected to the heat radiation of air-flow along the arc portion 61 of this guide plate 6.
In sum, the effect by guidance device generation fluid impact of the present utility model makes other electronic component also can reach the effect of heat radiation, and other heat abstractor need not be installed in addition again.
Therefore, " construction for heat radiating device of central processing unit " of the present utility model can reach described effect by the above-mentioned structure that discloses really.And do not see publication before the utility model application and also do not see public use, then met the requirement such as novelty, progressive of utility model patent.
Above-mentioned accompanying drawing that discloses and explanation only are an embodiment of the present utility model, and unrestricted scope of the present utility model.All persons skilled in the art, the feature category of the present utility model of complying with, other equivalence of having done changes or modifies, and all should be encompassed in the scope of the present utility model.
Claims (6)
1. the heat abstractor of a central processing unit, it comprises a housing, this housing is installed in the central processing unit top, and the side in housing is equipped with radiator fan, in addition, a heat conduction film has been sticked on central processing unit, in the heat conduction film top and the heat-conducting block of fitting, the radiating fin of on heat-conducting block, fitting again, and radiating fin is positioned at housing, and be positioned at the adjacent side of radiator fan, it is characterized in that:
This heat abstractor is provided with at least one guidance device in the formed air-flow course of radiator fan, this guidance device and towards other electronic component of the adjacent side of central processing unit.
2. the heat abstractor of central processing unit as claimed in claim 1 is characterized in that, described housing is made of a base and loam cake.
3. the heat abstractor of central processing unit as claimed in claim 2, it is characterized in that, described base is provided with an opening in the adjacent side of radiator fan, and just corresponding to central processing unit, this radiating fin placed the opening part of base when the appropriate housing in the position of this opening placed on the central processing unit.
4. the heat abstractor of central processing unit as claimed in claim 1 is characterized in that, described housing forms breach in the side away from radiator fan.
5. the heat abstractor of central processing unit as claimed in claim 1 is characterized in that, described radiating fin is a paliform.
6. the heat abstractor of central processing unit as claimed in claim 1 is characterized in that, described guidance device is provided with a guide plate, and guide plate has an arc portion, and is provided with an air-flow port in this heat abstractor below, and this air-flow port is relative with guide plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01231572 CN2524273Y (en) | 2001-07-17 | 2001-07-17 | CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01231572 CN2524273Y (en) | 2001-07-17 | 2001-07-17 | CPU radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2524273Y true CN2524273Y (en) | 2002-12-04 |
Family
ID=33645801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01231572 Expired - Fee Related CN2524273Y (en) | 2001-07-17 | 2001-07-17 | CPU radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2524273Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100534282C (en) * | 2006-07-21 | 2009-08-26 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| US8254127B2 (en) | 2009-01-08 | 2012-08-28 | Asustek Computer Inc. | Heat dissipation module and electronic device having the same |
-
2001
- 2001-07-17 CN CN 01231572 patent/CN2524273Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100534282C (en) * | 2006-07-21 | 2009-08-26 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| US8254127B2 (en) | 2009-01-08 | 2012-08-28 | Asustek Computer Inc. | Heat dissipation module and electronic device having the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |