CN2520567Y - Backplate of radiator - Google Patents
Backplate of radiator Download PDFInfo
- Publication number
- CN2520567Y CN2520567Y CN 01279297 CN01279297U CN2520567Y CN 2520567 Y CN2520567 Y CN 2520567Y CN 01279297 CN01279297 CN 01279297 CN 01279297 U CN01279297 U CN 01279297U CN 2520567 Y CN2520567 Y CN 2520567Y
- Authority
- CN
- China
- Prior art keywords
- rear panel
- radiator rear
- radiator
- motherboard
- location hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A radiator back board is glued on the bottom of a motherboard to strengthen the intensity of the motherboard, which approximately takes a shape of a cross. A positioning hole is opened on the middle of the back board, and fixation holes are respectively opened on the four corner ends around the positioning hole, which are used to fix and engage. The all-around edges of the radiator back board all take shape of arc-shaped inward concave, which is convenient for the holding and positioning of four-jaws in disconnection.
Description
[technical field]
The utility model is the radiator rear panel that can be used for increasing motherboard intensity about a kind of, refer in particular to a kind of simple in structure, can be combined on the motherboard in advance and be convenient to the radiator rear panel of dismounting operation.
[background technology]
Along with central processing unit (CPU) high-frequency high-speed development day by day, the heat of the corresponding generation of central processing unit is also more and more, and if too much heat is untimely discharge, the stability when having a strong impact on the central processing unit operation.For this reason, industry is locking one heat abstractor on motherboard usually, and the surface that is fitted in central processing unit discharges heat assisting, and the volume and weight of this heat abstractor also has the trend that increases gradually, to satisfy the radiating requirements of central processing unit.But, when this type of heat abstractor locks on motherboard, cause motherboard flexural deformation easily, even motherboard ruptured because of unpredictable external force such as vibrations.
[summary of the invention]
The purpose of this utility model is to provide a kind of and can be combined in advance on the motherboard to increase motherboard intensity, simple in structure and be convenient to the radiator rear panel of dismounting operation.
The purpose of this utility model is achieved through the following technical solutions: the utility model radiator rear panel is sticked and is used for increasing the intensity of motherboard in the bottom surface of motherboard, it roughly is cross, central authorities run through and offer a location hole, four jiaos of end places offer a fixing hole respectively around this location hole, use during for secure fit, edge all is the arcuation indent around this radiator rear panel, four paws tool clamping and location when for convenience detach.
Compared with prior art, the utility model radiator rear panel can be combined in the intensity that is used for increasing motherboard on the motherboard in advance, has advantage simple in structure, the easy disassembly operation.
With reference to the accompanying drawings, in conjunction with the embodiments the utility model is further described.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of the utility model radiator rear panel and associated component.
Fig. 2 is the stereogram of the utility model radiator rear panel.
Fig. 3 is the cutaway view after the utility model radiator rear panel and the associated component combination.
[embodiment]
See also Fig. 1, the utility model radiator rear panel 50 is positioned at the below of motherboard 30, and the position of these motherboard 30 top correspondences is installed with a central processing unit 20, and the top of this central processing unit 20 is provided with a radiator 10.On the motherboard 30 around four jiaos of ends of this radiator 10 and this central processing unit 20 respectively correspondence offer a through hole 12,32, usefulness when wearing back and corresponding nut 44 cooperations for some screws 42, and this radiator rear panel 50 locked together in the corresponding position of motherboard 30 bottom surfaces.
Please together consult Fig. 2, this radiator rear panel 50 roughly is cross, its central authorities run through and offer the bigger circular location hole 52 of an internal diameter, and 60 (as shown in Figure 3) of four paws tool plug location usefulness during for dismounting, and this four paws tool 60 comprises fixed claw 62 and fixed leg 64 of four symmetrical distributions; Four jiaos of end places of this radiator rear panel 50 offer the less circular fixing hole 54 of an internal diameter respectively around this location hole 52, wear when cooperating for screw 42 and use; Edge all is the arcuation indent around this radiator rear panel 50, the clamping of four paws tool 60 location when for convenience detach.In addition, this radiator rear panel 50 both can adopt plastic material to penetrate injection forming, also can adopt the moulding of metal blank stamping-out, and can cover one deck insulation film in addition on the surface of this metal heat sink backboard 50 and motherboard 30 attachings, usefulness during for insulation and buffering.
During assembling, only need in advance screw 42 to be inserted in the corresponding fixing hole 54 of 50 4 jiaos of ends of this radiator rear panel, be fixed in the through hole 32 of motherboard 30 from the below with these screw 42 corresponding inserted again, so that backboard 50 is attached to the bottom surface of motherboard 30 in advance; Then, again radiator 10 correspondences are placed on the surface of central processing unit 20, and make the corresponding respectively through hole 12 that passes 10 4 jiaos of ends of radiator of screw 42; At last, with this nut 44 corresponding sheathed respectively and screw lock on screw 42, thereby this radiator 10 and radiator rear panel 50 are fastened on together the both sides of motherboard 30.
Please continue to consult Fig. 3, during dismounting, earlier above-mentioned nut 44 is taken off, again the fixed leg 64 of four paws tool 60 is passed and replaces from the location hole 52 of radiator rear panel 50 central authorities and be positioned on the motherboard 30, and the application of force four fixed claws 62 making four paws tool 60 corresponding respectively clamp radiator rear panel 50 around edge, thereby this radiator rear panel 50 is easily unloaded from the bottom surface of motherboard 30.Because edge is the arcuation indent around this radiator rear panel 30, can fit fully with four fixed claws 62 of four paws tool 60, so can reach preferable clamping positioning states so that dismounting.
Claims (5)
1. radiator rear panel, be sticked in the bottom surface of motherboard, it is characterized in that: this radiator rear panel roughly is cross, and central authorities run through and offer a location hole, four jiaos of fixing holes that the end place uses when this location hole is offered a confession secure fit respectively, edge all is the arcuation indent around this radiator rear panel.
2. radiator rear panel as claimed in claim 1 is characterized in that: this location hole is the bigger circular port for when dismounting one four paws tool location usefulness of internal diameter.
3. radiator rear panel as claimed in claim 2 is characterized in that: the internal diameter of this fixing hole is less.
4. radiator rear panel as claimed in claim 1 is characterized in that: this radiator rear panel can adopt plastic material to penetrate injection forming.
5. radiator rear panel as claimed in claim 1 is characterized in that: this radiator rear panel can adopt the moulding of metal blank stamping-out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01279297 CN2520567Y (en) | 2001-12-29 | 2001-12-29 | Backplate of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01279297 CN2520567Y (en) | 2001-12-29 | 2001-12-29 | Backplate of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2520567Y true CN2520567Y (en) | 2002-11-13 |
Family
ID=33682561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01279297 Expired - Fee Related CN2520567Y (en) | 2001-12-29 | 2001-12-29 | Backplate of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2520567Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1939108B (en) * | 2004-01-26 | 2010-06-09 | 英特尔公司 | Mounting system for high-mass heatsinks |
-
2001
- 2001-12-29 CN CN 01279297 patent/CN2520567Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1939108B (en) * | 2004-01-26 | 2010-06-09 | 英特尔公司 | Mounting system for high-mass heatsinks |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |