CN2519412Y - Cooling device assembly - Google Patents

Cooling device assembly Download PDF

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Publication number
CN2519412Y
CN2519412Y CN 01258486 CN01258486U CN2519412Y CN 2519412 Y CN2519412 Y CN 2519412Y CN 01258486 CN01258486 CN 01258486 CN 01258486 U CN01258486 U CN 01258486U CN 2519412 Y CN2519412 Y CN 2519412Y
Authority
CN
China
Prior art keywords
heat abstractor
heat dissipating
buckling
locking
extended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 01258486
Other languages
Chinese (zh)
Inventor
李学坤
李冬云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CN 01258486 priority Critical patent/CN2519412Y/en
Application granted granted Critical
Publication of CN2519412Y publication Critical patent/CN2519412Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating device assembly comprises a locking device and a heat dissipating seat which comprises a base plate and a plurality lines of heat dissipating fins distributed in parallel extending upwards along the top surface of the base plate, and the outsides of the two neighboring lines of heat dissipating fins in the middle are respectively provided with a locking bulge. The locking device comprises two symmetrical locking bodies, each of which comprises a main body part, the lower edge of which is inclinedly bent upwards to one side and is extended, thus forming a fixing holding part, which can be locked in the lower edge of the locking bulge of the heat dissipating fin correspondingly to fix the locking device on the heat dissipating seat. The two ends of the upper edge of the main body part are inclinedly bent upwards to the other side and are extended, thus forming a locking arm, the end of which is inclinedly bent downwards and is extended for a distance, and then is bent upwards and extended, forming a locking part, which can be locked in the corresponding locking hole in the circuit board, ensuring that the heat dissipating seat clings to the chip surface of the circuit board firmly.

Description

The heat abstractor combination
[technical field]
The utility model is about the combination of a kind of heat abstractor, refers to especially a kind ofly operate facility, fasten firm heat abstractor combination.
[background technology]
Common calculator chip heat abstractor combination, as No. the 86209116th, Taiwan patent application, it comprises a radiating seat, assembling device and a folder shape thing, wherein this folder shape thing is made by a steel wire, comprise a pars intermedia and detain arms by pars intermedia two ends vertically extending two, and the end of two button arms extends two lugs, the pars intermedia of this folder shape thing is placed between radiating seat by this assembling device during fastening, pushes projection that this folder shape thing makes its lug block corresponding object both sides and reaches radiating seat is fastened on purpose on the wafer.
The combination of above-mentioned heat abstractor exists when fastening that the point of application is little, operator's application of force difficulty, it fastens unsteady shortcoming, and the assembling of this heat abstractor combination needs by finishing complex operation with the frame assembling device of folder shape thing non-integral.
[summary of the invention]
The purpose of this utility model be to provide a kind of fastening firm, operate heat abstractor combination easily.
The purpose of this utility model realizes by following technical proposal: the combination of the utility model heat abstractor comprises a radiating seat and a buckling device.This radiating seat comprises a pedestal and the radiating fin that is arranged in parallel along the upwardly extending plurality of rows of base top surface, forms a groove between every adjacent two row's radiating fins, and the outside of two row's radiating fins that middle part is adjacent all is convexly equipped with one and fixes projection.This buckling device is made up of the buckling body of two symmetries, each buckling body comprises a main part, the lower edge of this main part extends a holding parts to one side and bending obliquely, this holding parts can correspondingly fix the fixing projection lower edge at this radiating fin, thereby this buckling device is fixed on this radiating seat, each extends a button arm to its opposite side and bending obliquely the two ends of this main part upper limb, upwards bend again behind the terminal oblique extension of bending down one segment distance of this button arm and extend to form a clamping part, this clamping part can corresponding buckle in the clamping hole of circuit board correspondence, makes this radiating seat firmly be fitted in the wafer surface of circuit board.
Compared with prior art, convenient as application of force place so operation when the combination of the utility model heat abstractor adopts the projection on the radiating seat to realize pre-aligned and fastening by the button arm of broad, and this heat abstractor combination realizes fastening so fastens firm by four clamping parts.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor combination.
Fig. 2 is the three-dimensional combination figure of the utility model heat abstractor combination.
Fig. 3 is the three-dimensional combination figure of combination of the utility model heat abstractor and related elements.
Fig. 4 is the stereogram of another embodiment of the buckling device of the utility model heat abstractor combination.
[embodiment]
See also Fig. 1 to Fig. 3, the combination of the utility model heat abstractor comprises a radiating seat 10 and a buckling device 30, radiating seat 10 firmly can be fitted in wafer (figure do not show) surface of circuit board 70 with this buckling device 30, this circuit board 70 is provided with some clamping holes 72.
This radiating seat 10 comprises a pedestal 12 and the radiating fin 14 that is arranged in parallel along the upwardly extending plurality of rows of these pedestal 12 end faces, every adjacent two 14 of row's radiating fins form a slightly V-shaped groove 16, and the outside of the adjacent two row's radiating fins 14 of middle part all convexes with a fixing projection 18.
This buckling device 30 is made up of the buckling body 32 of two symmetries, this buckling body 32 is formed by the sheet metal integrated punching, it comprises a main part 34, the lower edge of this main part 34 extends a holding parts 36 to one side and bending obliquely, 34 of this holding parts 36 and this main parts slightly are one " V " shape, each extends a button arm 38 to its opposite side and bending obliquely the two ends of these main part 34 upper limbs, upwards bend again behind the terminal oblique extension of bending down one segment distance of this button arm 38 and extend to form a V-shaped clamping part 42, and should button arm 38 wideer, so that application of force when this clamping part 42 buckled into the block button hole 72 of this circuit board 70 than this clamping part 42.
During assembling, earlier the buckling body 32 of this buckling device 30 is placed on respectively in the groove 16 of this radiating seat 10 two row's radiating fins 14 placed in the middle, and the holding parts 36 that makes this buckling body 32 fixes the lower edge of fixing projection 18 at this two rows radiating fin 14 respectively, thereby this buckling device 30 is fixed on this radiating seat 10; Again the combination of this heat abstractor is placed on the wafer of this circuit board 70, pushes the button arm 38 of the buckling body 32 of this buckling device 30 respectively, its clamping part 42 correspondences are buckled in the block button hole 72 of this circuit board 70 promptly finish assembling.
As shown in Figure 4, be another embodiment of the buckling device of the utility model heat abstractor combination, this buckling device 30 ' is integrated, and the buckling body 32 ' of its two symmetry is fused by two connecting portions 44 ', and other structure is all identical with last embodiment, no longer describes at this.

Claims (7)

1. heat abstractor combination, comprise a radiating seat and a buckling device, this radiating seat comprises a pedestal and the radiating fin that is arranged in parallel along the upwardly extending plurality of rows of base top surface, form a groove between every adjacent two row's radiating fins, it is characterized in that: the outside of the adjacent two row's radiating fins of this radiating seat middle part all convexes with one and fixes projection; This buckling device comprises the buckling body of two symmetries, each buckling body comprises a main part, the lower edge of this main part extends a holding parts to one side and bending obliquely, and the two ends of this main part upper limb each extend a button arm to its opposite side and bending obliquely, the terminal oblique bending down of this button arm is extended to make progress to bend behind the segment distance again and is extended to form a clamping part.
2. heat abstractor combination as claimed in claim 1, it is characterized in that: the groove of this radiating seat is slightly V-shaped.
3. heat abstractor combination as claimed in claim 1, it is characterized in that: this buckling device comprises the buckling body of two independent moulding and symmetry.
4. heat abstractor combination as claimed in claim 1, it is characterized in that: this buckling device is integrated, is provided with two connecting portions between its two buckling body.
5. as any described heat abstractor combination in the claim 1 to 4, it is characterized in that: slightly V-shaped between the holding parts of this buckling device and main part.
6. heat abstractor combination as claimed in claim 5, it is characterized in that: the clamping part of this buckling device is slightly V-shaped.
7. heat abstractor combination as claimed in claim 6, it is characterized in that: the button arm of this buckling body is wideer than this clamping part.
CN 01258486 2001-12-03 2001-12-03 Cooling device assembly Expired - Fee Related CN2519412Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01258486 CN2519412Y (en) 2001-12-03 2001-12-03 Cooling device assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01258486 CN2519412Y (en) 2001-12-03 2001-12-03 Cooling device assembly

Publications (1)

Publication Number Publication Date
CN2519412Y true CN2519412Y (en) 2002-10-30

Family

ID=33667067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01258486 Expired - Fee Related CN2519412Y (en) 2001-12-03 2001-12-03 Cooling device assembly

Country Status (1)

Country Link
CN (1) CN2519412Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101106888B (en) * 2006-07-14 2012-06-13 富准精密工业(深圳)有限公司 Heat radiation module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101106888B (en) * 2006-07-14 2012-06-13 富准精密工业(深圳)有限公司 Heat radiation module

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C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee