CN2510267Y - Improved structure of supporting table for quartz crystal circle cutting machine - Google Patents
Improved structure of supporting table for quartz crystal circle cutting machine Download PDFInfo
- Publication number
- CN2510267Y CN2510267Y CN 01266191 CN01266191U CN2510267Y CN 2510267 Y CN2510267 Y CN 2510267Y CN 01266191 CN01266191 CN 01266191 CN 01266191 U CN01266191 U CN 01266191U CN 2510267 Y CN2510267 Y CN 2510267Y
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- CN
- China
- Prior art keywords
- holding table
- articles holding
- cutting machine
- quartz wafer
- board
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- Expired - Fee Related
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Abstract
A modified goods-placing platform structure of quartz wafer cutting machine is mainly that the worktable of one quartz wafer cutting machine is provided with a compound goods-placing platform, after the quartz wafer waiting to be processed is fixed on the goods-placing platform, the utility model can automatically do the processing actions of cutting and feeding controlled by the servo motor.
Description
Technical field
The utility model relates to a kind of articles holding table improvement structure of quartz wafer cutting machine, especially refer to a kind of articles holding table that vertically reaches transversal driving mechanism that on cutting machine, has, can fix a quartz wafer according to this articles holding table, control the depth of cut and the cutting speed of its cutting again, and the processing characteristics that can reach automatic operation and accurately control.
Background technology
See also shown in Figure 3ly, the structure of known quartz wafer cutting machine wherein mainly includes formations such as a board a, band saw b and motor c, and is provided with an articles holding table e that can move back and forth along cutting path on the work top d of this board a; When fixing a quartz wafer f on the articles holding table e at this known structure and desire to cut, must adjust the depth of cut of desire cutting with manual type after, just start articles holding table e and slowly advance, with function and the purpose that reaches automatic cutting.Yet, when using, because of wherein only when cutting, advancing automatically at most to keep the straight line precision of its cutting path as above-mentioned known structure; As for other relevant do aspect the feed adjustment then very difficult, the volume and the weight of especially general quartz wafer are quite big, so it adjusts difficulty especially, thereby often cause the depth of cut to tilt or disappearance that each depth of cut (thickness) differs, scrap so easily cause, the situation in waste material and man-hour, causing influences this competitiveness of product in market, so to real necessity of improvement again that has.
Summary of the invention
The inventor be at above-mentioned known quartz wafer cutting machine be configured in actual use the time disappearance, study intensively development, and long-pending individual is engaged in this industry experience for many years, create a kind of articles holding table improvement structure of brand-new quartz wafer cutting machine eventually.
The utility model main purpose is providing a kind of articles holding table improvement structure of quartz wafer cutting machine, be the convenience and the degree of accuracy when promoting this product cutting processing, and on workbench, be provided with the combined type articles holding table that tool vertically reaches transversal driving mechanism, with the processing quality and the economic benefit that can promote this product.
In order to achieve the above object, the utility model adopts technical scheme as described below: the articles holding table improvement structure of quartz wafer cutting machine, this quartz wafer cutting machine system comprises by board, contexture such as band saw and motor, the work top of this cutting machine is provided with a horizontal stroke (indulging) to linear bearing, and on this linear bearing, be fixed with a seat board, between this seat board and work top, be provided with a linear driving mechanism and do horizontal (indulging) to reciprocating motion to drive seat board, on seat board, be provided with one vertical (horizontal stroke) again to linear bearing, and on this linear bearing, be fixed with an articles holding table, between this articles holding table and seat board, be provided with a linear driving mechanism and make vertical (horizontal stroke) to reciprocating motion to drive articles holding table, and in this above articles holding table along its vertical (horizontal stroke) to and be provided with the parallel T type groove guide groove parallel in two roads with two roads, on this articles holding table, can be provided with Jiong type compacting structure by two T type truss, and be provided with a top board perpendicular to guide groove, be provided with a linear driving mechanism between this top board and articles holding table and make vertical (horizontal stroke) to reciprocating motion along the guide groove direction to drive top board.
Adopt the utility model of said structure adding all be subjected to guide groove or linear bearing man-hour because of each adjustment and motion restriction, cause the accurate and amount of movement precision height of its moving line, and can make things convenient for and effectively reach the cutting quartz wafer effect, and then can reduce material, and promote the economic benefit of product because of mis-machined waste.
Description of drawings
Fig. 1 is a quartz wafer cutting machine overall schematic of the present utility model.
Fig. 2 is a quartz wafer cutting machine articles holding table constructing stereo exploded view of the present utility model.
Fig. 3 is known quartz wafer cutting machine overall schematic.
The explanation of parts label among the figure:
10 boards, 20 band saws, 30 motors
40 seat boards, 50 articles holding tables, 60 Jiong types compacting structure
70 top boards, 80 quartz wafers, 11 work tops
12,41 linear bearings, 13,42,53 linear driving mechanism 51T type grooves
52 guide grooves, 61 bolts, 62 depression bars
63 nuts
The specific embodiment
See also Figure 1 and Figure 2, the articles holding table improvement structure of the utility model quartz wafer cutting machine, it mainly ties up to one and includes board 10, the work top 11 of the cutting machine of contextures such as band saw 20 and motor 30 is provided with a horizontal stroke (indulging) to linear bearing 12, and on this linear bearing 12, be fixed with a seat board 40, be provided with a linear driving mechanism 13 can drive seat board 40 works horizontal (indulging) at this seat board 40 and 11 of work tops to reciprocating motion, be provided with one vertical (horizontal stroke) to linear bearing 41 in seat board 40 again, and on this linear bearing 41, be fixed with an articles holding table 50, be provided with a linear driving mechanism 42 can drive articles holding table 50 works vertical (horizontal stroke) at this articles holding table 50 and 40 of seat boards to reciprocating motion, and in this above articles holding table 50 along its vertical (horizontal stroke) to and be provided with the parallel T type groove in two roads 51 guide groove 52 parallel with two roads, on this articles holding table 50, can set up Jiong type compacting structure 60 by two T type grooves 51, and being provided with a top board 70 perpendicular to guide groove 52, this top board 70 and 50 of articles holding tables are provided with a linear driving mechanism 53 and make vertical (horizontal stroke) to reciprocating motion can drive top board 70 along guide groove 52 directions.
And for example above-mentioned Jiong type compacting structure 60 must draw interior removable adjustment with the T type groove that its head end is inserted on the articles holding table 50 respectively by two support bolts 61, again in the sheathed from top to bottom depression bar 62 in these two bolts, 61 upper ends, again respectively at sealed on the bolt 61 with nut 63, according to and can below depression bar 62, have quartz wafer 80 time, through nut 63 lockings to reach the purpose that grips quartz wafer 80.In addition, these Jiong type compacting structures 60 must draw direction along T type groove and move according to the size of quartz wafer 80, are adjusted to the best state that grips.Moreover, in structures such as the described linear driving mechanism 13 of leading portion and 42,53, (above part is known structure to use a kind of ball screw to cooperate servo motor and optics chi etc. when reality is implemented, being fixed in this repeats no more) form, can get best control and motion effect, and then promote the precision of product and reduce its fraction defective.
When using, after placing a quartz wafer 80 on the articles holding table and making this quartz wafer 80 be resisted against top board 70, and can Jiong type compacting structure 60 frames be located on the quartz wafer 80 and grip, so that carry out cutting processing according to above-mentioned structure; When desire begins to cut, then can advance so that outstanding articles holding table 50 1 segment distances of quartz wafer 80 front ends by the set linear driving mechanism 53 in top board 70 bottoms earlier, and the nut 63 through tightening Jiong type compacting structure 60 is with after having gripped quartz wafer, can order about by the set linear driving mechanism 42 in articles holding table 50 bottoms and stop after this articles holding table 50 moves forward to the first cutter cutting position, ordering about the related glove plate 50 on it of seat board 40 and quartz wafer 80 grades by the set linear driving mechanism 13 in seat board 40 bottoms immediately advances with constant speed slowly to the band saw 20 of high speed rotating, to reach the work that quartz wafer is cut, thereafter every well cutting a slice is promptly ordered about this articles holding table 50 by the set linear driving mechanism 42 in glove plate 50 bottoms and is moved forward a step (i.e. the thickness of desire cutting quartz wafer), ordering about quartz wafer 80 by the set linear driving mechanism 13 in seat board 40 bottoms more slowly moves with constant speed and cuts, and blocks of automatic cutting quartz wafer, in addition when cutting near articles holding table 50 front ends, also can loosen Jiong type compacting structure 60 again and the set linear driving mechanism in top board 70 bottoms 53 is advanced so that quartz wafer 80 front ends are given prominence to glove plate 50 1 segment distances, so that repeat above-mentioned cutting work.
As above-mentioned, the utility model is adding all be subjected to guide groove or linear bearing man-hour because of each adjustment and motion restriction, cause the accurate and amount of movement precision height of its moving line, and can make things convenient for and effectively reach the cutting quartz wafer effect, and then can reduce material, and promote the economic benefit of product because of mis-machined waste.
In sum, the articles holding table of quartz wafer cutting machine of the present utility model improvement structure, the purpose that it can reach handled easily really and obtain accurate processing dimension, and tool is convenient, practical and the effect that reduces cost.
Claims (1)
1, a kind of articles holding table of quartz wafer cutting machine improvement structure, this quartz wafer cutting machine system comprises by contextures such as board, band saw and motors, it is characterized in that:
The work top of this cutting machine is provided with a horizontal stroke (indulging) to linear bearing, and on this linear bearing, be fixed with a seat board, between this seat board and work top, be provided with a linear driving mechanism and do horizontal (indulging) to reciprocating motion to drive seat board, on seat board, be provided with one vertical (horizontal stroke) again to linear bearing, and on this linear bearing, be fixed with an articles holding table, between this articles holding table and seat board, be provided with a linear driving mechanism and make vertical (horizontal stroke) to reciprocating motion to drive articles holding table, and in this above articles holding table along its vertical (horizontal stroke) to and be provided with the parallel T type groove guide groove parallel in two roads with two roads, on this articles holding table, can be provided with Jiong type compacting structure by two T type truss, and be provided with a top board perpendicular to guide groove, be provided with a linear driving mechanism between this top board and articles holding table and make vertical (horizontal stroke) to reciprocating motion along the guide groove direction to drive top board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01266191 CN2510267Y (en) | 2001-11-12 | 2001-11-12 | Improved structure of supporting table for quartz crystal circle cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01266191 CN2510267Y (en) | 2001-11-12 | 2001-11-12 | Improved structure of supporting table for quartz crystal circle cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2510267Y true CN2510267Y (en) | 2002-09-11 |
Family
ID=33672914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01266191 Expired - Fee Related CN2510267Y (en) | 2001-11-12 | 2001-11-12 | Improved structure of supporting table for quartz crystal circle cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2510267Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105643823A (en) * | 2016-03-18 | 2016-06-08 | 叶侃 | Four-axis moving rack of simple ceramic cutting device |
| CN106487347A (en) * | 2015-08-31 | 2017-03-08 | 通用电气公司 | The system and method engaging for quartz wafer |
-
2001
- 2001-11-12 CN CN 01266191 patent/CN2510267Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106487347A (en) * | 2015-08-31 | 2017-03-08 | 通用电气公司 | The system and method engaging for quartz wafer |
| US10432168B2 (en) | 2015-08-31 | 2019-10-01 | General Electric Company | Systems and methods for quartz wafer bonding |
| CN106487347B (en) * | 2015-08-31 | 2020-08-18 | 通用电气公司 | System and method for quartz wafer bonding |
| CN105643823A (en) * | 2016-03-18 | 2016-06-08 | 叶侃 | Four-axis moving rack of simple ceramic cutting device |
| CN105643823B (en) * | 2016-03-18 | 2017-11-07 | 郑招才 | A kind of simple axle moving frame of cutter device four of ceramics |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: RONGING CO., LTD. Free format text: FORMER NAME OR ADDRESS: RONGJING CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Taoyuan County of Taiwan Province Patentee after: Rongjing Co., Ltd. Address before: Taoyuan County of Taiwan Province Patentee before: Fusion Crystal Co., Ltd. |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |