CN2507607Y - Apparatus for producing leadless solder - Google Patents

Apparatus for producing leadless solder Download PDF

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Publication number
CN2507607Y
CN2507607Y CN 01275353 CN01275353U CN2507607Y CN 2507607 Y CN2507607 Y CN 2507607Y CN 01275353 CN01275353 CN 01275353 CN 01275353 U CN01275353 U CN 01275353U CN 2507607 Y CN2507607 Y CN 2507607Y
Authority
CN
China
Prior art keywords
heater
smelter
hermetically
smelter body
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 01275353
Other languages
Chinese (zh)
Inventor
许开华
聂祚仁
郭学益
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Gem High Tech Co Ltd
Original Assignee
GELINMEI ENVIRONMENT MATERIAL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GELINMEI ENVIRONMENT MATERIAL filed Critical GELINMEI ENVIRONMENT MATERIAL
Priority to CN 01275353 priority Critical patent/CN2507607Y/en
Application granted granted Critical
Publication of CN2507607Y publication Critical patent/CN2507607Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses an apparatus for producing the leadless solder, which comprises a smelter comprising a smelter body, a charging hole is arranged on a sealing cover, a discharge hole is arranged on the lower portion of the smelter body, an extraction opening is further arranged on the smelter body, and an aspirator which is hermetically connected with an air intake duct of a vacuum pump is hermetically connected on the smelter body, a copple is arranged in the inner cavity of the smelter body, a feeding pipe which is arranged on a feed inlet on the upper portion of the copple hermetically extends upward through the charging hole and is arranged outside the smelter body, and a sealing cover is arranged on a port which is arranged outside the smelter body of the feeding pipe, a discharge hole is arranged on the lower portion of the copple, a discharge pipe which is arranged on the discharge hole hermetically extends downward through the smelter body from the discharge hole arranged on the lower portion of the smelter body, and a sealing valve is arranged on the portion outside the smelter body of the discharge pipe. The leadless solder production apparatus effectively prevents oxidization in the melting process through the special structure and can manufacture the leadless solder to replace the lead solder which has more pollution.

Description

A kind of equipment of producing lead-free solder
Technical field
The utility model belongs to the used scolder of welding field, relates in particular to a kind of equipment of producing lead-free solder.
Background technology
As everyone knows, lead is a kind of noxious material, and the excessive lead of absorption of human body can cause lead poisoning, and a small amount of absorption also can influence people's cognitive ability and nervous system.The plumbous use that all is under an embargo in many fields of some countries, as automobile, can and running water pipe, but prohibit lead in welding field makes slow progress always, scolder comes out to the history in existing several thousand now from utility model, the Sn/pb scolder is with its excellent performance and cheap cost, for people are extensive use of, now become the main welding material in the electronics assembling welding always.In electronics manufacturing, solder containing pb can discharge poisonous flue gas at a certain temperature, the operator is injured, and in producing the discharging of leaded waste liquid or waste material and handle after, lead can discharge and enter underground water, polluted drinking water source, the various electronic products of the discarding solder containing pb on it also can cause very important pollution.This person and environment have the solder containing pb of severe contamination like this also being extensive use of so far, and very slow to its progress of forbidding, its reason just be up to the present also to can not find a kind of can be suitable and substitute that cost is suitable with the performance of solder containing pb.
The lead-free solder of researching and developing in the prior art mainly contains Sn-Ag, Sn-Zn, several systems of Sn-Bi, but it compares with the Sn-Pb eutectic solder, and tangible deficiency is all arranged.Under 1 explanation of tabulating.
Various lead-free solder pluses and minuses in table 1 prior art
The lead-free solder system Mechanical performance Hot strength Creep properties Ductility Fusing point Wetability Cost Other
Sn-Ag Good Good Good Difference Higher 30-40 ℃ Difference High
Sn-Zn Good Good Good Difference Easily oxidation, perishable
Sn-In Difference Too high Very easily oxidation
Sn-Bi Good Good Difference
Sn-Sb Difference Poisonous slightly
The pluses and minuses of several lead-free solders more of the prior art as can be known, its ductility is generally lower, wetability is poor, chase after its reason, one of them is exactly to use existing smelting equipment in alloy formation process, it can not realize with air isolated preferably, thereby causes the scolder that produces oxidized, makes its degradation.
The sealing property of smelting furnace of the prior art is bad, because the participation of air is arranged, makes material easily oxidized in fusion process, especially when discharging, pour the molten alloy in the crucible in mould ingot casting again with crucible by taking out in the smelting furnace, motlten metal will have more contacting with air in this process, thus, also can make a part of alloy oxidized, its fragility of lead-free solder made from such alloy is big, poor ductility, other mechanical performance is also bad, and conductivity type also reduces simultaneously.
Summary of the invention
The purpose of this utility model is to improve the deficiencies in the prior art, and a kind of equipment of the production lead-free solder that molten metal alloy and air completely cut off in the fusion process of preparation lead-free solder is provided.
The purpose of this utility model is achieved in that
The equipment of this production lead-free solder comprises a smelting furnace, it has a melting body of heater, on the lateral wall of body of heater, be provided with the electric heating heater, be provided with seal cover and body of heater formation is tightly connected in the upper end of described body of heater, what this connection was preferably removable is tightly connected, and is provided with a charging hole on described seal cover, and the bottom of described body of heater is provided with a discharging opening, on described body of heater, be provided with a bleeding point in addition, connect an exhaust tube that is tightly connected with the air intake duct of vavuum pump on it hermetically; In the internal cavity of described body of heater, be provided with crucible, on charging aperture above the described crucible, be provided with a feed pipe, described feed pipe extends upward the outside that the described charging hole that passes hermetically on the described seal cover is located at described body of heater, is provided with seal cover on the port that places the body of heater outside of described feed pipe; Be provided with a discharging opening in the bottom of described crucible, on this discharging opening, establish discharge nozzle, this discharge nozzle extends downwards the described discharging opening that the bottom by described body of heater is provided with and passes described body of heater hermetically, is provided with a seal valve on the part that places the body of heater outside of described discharge nozzle.
Crucible in this smelting furnace is up by a feed pipe charging of stretching out in the body of heater outside, seal cover with its upper end after the charging seals, start the vavuum pump that is connected with described exhaust tube, make and have higher vacuum in the body of heater, start the described heater on the body of heater then, make the metal molten in the crucible carry out melting.After treating that melting finishes, open the described valve on the described discharge nozzle, the alloy of fusion is flowed in the ingot mold be cast into ingot.
The feed pipe structure of this smelting furnace can be lived furnace sealing after making and throw in raw material in crucible easily.Body of heater is provided with bleeding point, in fusion process, make and be in vacuum state in the stove, especially bottom pass-out one discharge nozzle that designed on its output section by crucible of this smelting furnace directly stretches out body of heater, changing will be with crucible by the structure of taking out casting in the body of heater in the prior art, make in fusion process, especially be reduced to minimum with the touch opportunity of air in the molten alloy casting cycle, can guarantee that thus alloy is not oxidized basically in casting cycle.
The lead-free solder production equipment that the utility model provides by its special structure decrease in fusion process the touch opportunity of material and air, prevented its possibility oxidized in fusion process effectively, thus, it is good, cheap just can to select for use as ductility such as zinc, aluminium in the preparation lead-free solder, but very easily oxidized metallic element, make elimination fragility by the smelting furnace that the utility model provides, mechanical performance is higher, especially the product that improves greatly of ductility replaces the solder containing pb with big contaminative.
The structural representation of the smelting furnace that description of drawings Fig. 1 provides for the utility model
The specific embodiment
As shown in Figure 1, the equipment of this production lead-free solder comprises a smelting furnace 1, it has a melting body of heater 10, on the lateral wall of body of heater, be provided with electric heating heater 2, be provided with seal cover 3 in the upper end of body of heater 1 and constitute removable being tightly connected with body of heater 10, be provided with a charging hole 31 on seal cover 3, the bottom of body of heater 1 is provided with a discharging opening 11, on body of heater, be provided with a bleeding point 12 in addition, connect an exhaust tube 13 that is tightly connected with the air intake duct of vavuum pump on it hermetically; In the internal cavity of body of heater 1, be provided with crucible 4, on charging aperture above the crucible 4, be provided with a feed pipe 41, feed pipe 41 extends upward the outside that the charging hole 31 that passes hermetically on the seal cover 3 is located at body of heater 1, is provided with seal cover 5 on the port 411 that places body of heater 1 outside of feed pipe 41; Be provided with a discharging opening 42 in the bottom of crucible 4, establish discharge nozzle 6 on discharging opening 42, this discharge nozzle extends downwards the discharging opening 11 that the bottom by body of heater 1 is provided with and passes body of heater 1 hermetically, is provided with a seal valve 7 on the part that places body of heater 1 outside of discharge nozzle 6.

Claims (1)

1, a kind of equipment of producing lead-free solder comprises a smelting furnace, and it has a melting body of heater, is provided with the electric heating heater on the lateral wall of body of heater, is provided with seal cover and body of heater formation in the upper end of described body of heater and is tightly connected; In the internal cavity of described body of heater, be provided with crucible, it is characterized in that: on described seal cover, be provided with a charging hole, the bottom of described body of heater is provided with a discharging opening, is provided with a bleeding point on described body of heater in addition, connects an exhaust tube that is tightly connected with the air intake duct of vavuum pump on it hermetically; Be provided with a feed pipe on charging aperture above the described crucible, described feed pipe extends upward the outside that the described charging hole that passes hermetically on the described seal cover is located at described body of heater, is provided with seal cover on the port that places the body of heater outside of described feed pipe; Be provided with a discharging opening in the bottom of described crucible, on this discharging opening, establish discharge nozzle, this discharge nozzle extends downwards the described discharging opening that the bottom by described body of heater is provided with and passes described body of heater hermetically, is provided with a seal valve on the part that places the body of heater outside of described discharge nozzle.
CN 01275353 2001-11-27 2001-11-27 Apparatus for producing leadless solder Expired - Lifetime CN2507607Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01275353 CN2507607Y (en) 2001-11-27 2001-11-27 Apparatus for producing leadless solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01275353 CN2507607Y (en) 2001-11-27 2001-11-27 Apparatus for producing leadless solder

Publications (1)

Publication Number Publication Date
CN2507607Y true CN2507607Y (en) 2002-08-28

Family

ID=33679802

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01275353 Expired - Lifetime CN2507607Y (en) 2001-11-27 2001-11-27 Apparatus for producing leadless solder

Country Status (1)

Country Link
CN (1) CN2507607Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102538457A (en) * 2012-02-21 2012-07-04 四川有色新材料科技股份有限公司 Tin melting furnace for producing solder
CN114799392A (en) * 2022-06-13 2022-07-29 重庆科技学院 Secondary processing method and device of tin column for electronic packaging based on electromagnetic pulse heating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102538457A (en) * 2012-02-21 2012-07-04 四川有色新材料科技股份有限公司 Tin melting furnace for producing solder
CN114799392A (en) * 2022-06-13 2022-07-29 重庆科技学院 Secondary processing method and device of tin column for electronic packaging based on electromagnetic pulse heating
CN114799392B (en) * 2022-06-13 2023-06-02 重庆科技学院 Electromagnetic pulse heating-based secondary processing method and device for tin column for electronic packaging

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: GELINMEI HI-TECH CO., LTD., SHENZHEN

Free format text: FORMER NAME OR ADDRESS: GELINMEI ENVIRONMENT MATERIAL CO., LTD., SHENZHEN

CP03 Change of name, title or address

Address after: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50

Patentee after: Gelinmei Hi-Tech Co., Ltd., Shenzhen

Address before: 518101 science and Technology Museum, Longjing Road, Shenzhen, Guangdong, Baoan District B304

Patentee before: Gelinmei Environment Material Co., Ltd., Shenzhen

C56 Change in the name or address of the patentee

Owner name: SHENZHEN CITY GELINMEI HIGH NEW TECHNOLOGY CO., LT

Free format text: FORMER NAME OR ADDRESS: GELINMEI HI-TECH CO., LTD., SHENZHEN

CP01 Change in the name or title of a patent holder

Address after: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50

Patentee after: Shenzhen GEM High-tech Co., Ltd.

Address before: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50

Patentee before: Gelinmei Hi-Tech Co., Ltd., Shenzhen

C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20111127

Granted publication date: 20020828