CN2479645Y - Built-in centrifugal cooling device - Google Patents
Built-in centrifugal cooling device Download PDFInfo
- Publication number
- CN2479645Y CN2479645Y CN 01208970 CN01208970U CN2479645Y CN 2479645 Y CN2479645 Y CN 2479645Y CN 01208970 CN01208970 CN 01208970 CN 01208970 U CN01208970 U CN 01208970U CN 2479645 Y CN2479645 Y CN 2479645Y
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- China
- Prior art keywords
- radiator
- centrifugal fan
- heat conduction
- cooling device
- groove
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Abstract
An embedded centrifugal cooling facility at least comprises a radiator and a centrifugal fan, wherein the radiator comprises a plurality of heat-conducting fins and a groove, and the centrifugal fan is arranged in the groove and embedded in the radiator. The centrifugal cooling facility also comprises a top cover to keep air-tight. The temperature distribution curve of the utility model is flatter than the temperature distribution curve of prior art, the utility model can make not only the central area but also the circumferential area of the radiator achieve nice cooling, and the cooling facility of the utility model is thinner than the cooling facilities of the prior art.
Description
The utility model is relevant with a kind of high-effect slim cooling device, particularly relevant a kind of embedded centrifugal cooling device.
Generally speaking, cooling device is to place one to need on the surface of device of heat radiation with its heat that is produced of dissipation.
A kind of existing cooling device 10 has an aerofoil fan 50 and a radiator 60 shown in Fig. 1 (a).Wherein, described aerofoil fan 50 is made up of a wheel hub 53 and several flabellums 55.Described aerofoil fan 50 is to be fixed on the upper surface of described radiator 60, and the lower surface of described radiator 60 is attached on the device that needs heat radiation (not shown, for example a central processing unit).And described wheel hub 53 is to be positioned on the middle section of the described device that needs heat radiation, and flabellum 55 is to be positioned on the outer peripheral areas of periphery in surrounding said central zone.The shortcoming of described existing cooling device comprises that at least (1) cooling effect not good (inhomogeneous) (2) flow field (3) volume that has some setbacks is excessive, and its reason is specified in down.
Be the section and the corresponding temperature distribution history thereof of existing cooling device 10 shown in Fig. 1 (b), the peak value of the temperature distribution history of the described device that need dispel the heat mainly is to appear at the described middle section that needs the device of heat radiation, successively decreases gradually towards outer peripheral areas then.Yet, for existing cooling device 10, its cooling effect to middle section but is the poorest, and the cooling effect of outer peripheral areas is better, because described middle section is to be positioned under the described wheel hub 53, and described wheel hub 53 has no to benefit to take away hot gas for cooling blast is set, thus its cooling effect to middle section not good be understandable.
In addition, the fan that is disposed owing to existing cooling device 10 is an aerofoil fan 50, so just be forced to be diverted to the side outflow of radiator 60 behind cooling blast (shown in arrow among the figure) device (for example its upper surface) that the front bump needs to dispel the heat earlier of this aerofoil fan 50 by the outside introducing.Like this, the flow field of described cooling blast has some setbacks very much, and its flow velocity can be hindered and sluggishness.
Still see also Fig. 1 (a), another shortcoming of existing cooling device 10 is that volume is excessive.Because described aerofoil fan 50 is to be fixed on the surface of described radiator 60, so the thickness of existing cooling device 10 is the thickness that adds the above radiator 60 for the thickness of described aerofoil fan 50.
See also Fig. 1 (c), United States Patent (USP) discloses another kind of existing cooling device 20 No. 5661638.Described cooling device 20 has a tube-axial fan 50 and a radiator 60.Described aerofoil fan 50 is made up of a wheel hub 53 and several flabellums 55, and described radiator 60 has several spiral helicine heat conduction fins 65 and is surrounded on described aerofoil fan 50.Described tube-axial fan 50 is to be embedded in the described radiator 60.Yet the shortcoming of described cooling device 20 comprises that also (3) air-tightness is not good except that (1) cooling effect not good (inhomogeneous) (2) and flow field have some setbacks.Wherein, reason that cooling effect not good (inhomogeneous) and flow field have some setbacks and the cooling device 10 shown in above-mentioned Fig. 1 (a) identical caused by tube-axial fan, therefore repeats no more.
Still see also Fig. 1 (c), the not good reason of described cooling device 20 air-tightness is because the cooling blast in the described cooling device 20 promptly is discharged from before the least significant end that does not reach the heat conduction fin, so the exhausted major part of the heat conduction fin of described radiator there is no and is subjected to brushing of cooling blast and performs practically no function.
Another existing cooling device 30 is shown in Fig. 1 (d), and it has a radiator 50 and a centrifugal fan 60.Described centrifugal fan 60 is sides of being attached at described radiator 50 reducing the thickness of described cooling device 30, yet this kind configuration has increased the shared projected area of existing cooling device 30 also.And the distance with centrifugal fan 60 is all different everywhere owing to radiator 50, thus more will be poor more away from the cooling effect of locating of described centrifugal fan 60, and possibly can't be subjected to brushing of cooling blast with the radiator 50 of centrifugal fan 60 farthest.
The purpose of this utility model provides that a kind of volume is little, air-flow is unimpeded thereby has the cooling device of desirable radiating effect.
For achieving the above object, the utility model provides a kind of embedded centrifugal cooling device, and it places one to need on the surface of device of heat radiation with its heat that is produced of dissipation, and it comprises a radiator, a blower fan or a centrifugal fan and a loam cake; The groove that described radiator has several heat conduction fins and limited by described heat conduction fin; Described centrifugal fan is arranged in the described groove and is embedded in described radiator; The shape of described groove is the shape that cooperates described centrifugal fan, is extended to by its central authorities in the below, zone of its outer rim and is distributed with the heat conduction fin so that described centrifugal fan is embedded in the described centrifugal fan in back in the described radiator.
The heat that the device that described radiator tentatively will dispel the heat mainly concentrates on middle section is directed to a bigger area of dissipation, relends to help brushing of centrifugal fan and the heat of radiator is conducted in the background environment.Because the middle section of described centrifugal fan also has the heat conduction fin, so mainly concentrate on the also dissipation effectively of heat of the middle section of desiring heat abstractor.
In addition, embedded centrifugal cooling device of the present utility model also comprises a loam cake, and described loam cake is to keep the airtight of described embedded centrifugal cooling device as a gas check.Like this, the cooling blast that described centrifugal fan produced was just discharged by described heat conduction fin tips after can brushing whole section heat conduction fin substantially, and can not have heat conduction fin partly can't be subjected to brushing of cooling blast as prior art.
Temperature distribution history of the present utility model is smooth than prior art, needs the middle section or the peripheral region of the device of heat radiation all can obtain good cooling no matter promptly be; And cooling device of the present utility model can approaching than prior art.
Understand the purpose of this utility model, characteristics and advantage for clearer, preferred embodiment of the present utility model is elaborated below in conjunction with accompanying drawing.
Fig. 1 (a) is the exploded perspective view of an existing cooling device;
Fig. 1 (b) is the section and corresponding temperature distributing curve diagram of the cooling device of Fig. 1 (a);
Fig. 1 (c) is the stereogram of another existing cooling device;
Fig. 1 (d) is again the stereogram of an existing cooling device;
Fig. 2 (a) is the decomposing schematic representation of the embedded centrifugal cooling device of the utility model one preferred embodiment;
Fig. 2 (b) be the utility model one preferred embodiment the vertical view of radiator, groove structure shown in the figure;
Fig. 3 be the utility model one preferred embodiment profile and for the temperature distributing curve diagram of the Effect on Temperature Distribution of the device of need heat radiations.
Embedded centrifugal cooling device of the present utility model is to place one to need on the surface of device (showing, for example a central processing unit) of heat radiation with its heat that is produced of dissipation.
Shown in Fig. 2 (a), embedded centrifugal cooling device of the present utility model comprises a radiator 100, a blower fan or a centrifugal fan 200 and a loam cake 300.Wherein, described radiator 100 groove 120 (shown in Fig. 2 (b)) that has several heat conduction fins 110 and limited by described heat conduction fin 110; Described centrifugal fan 200 is to be arranged in the described groove and to be embedded in described radiator 100.Shape that it should be noted that described groove 120 is the shape that cooperates described centrifugal fan 200, makes described centrifugal fan 200 be embedded in the described centrifugal fan 200 in back in the described radiator 100 and is extended to by its central authorities in the below, zone of its outer rim and be distributed with heat conduction fin 110.Selected material is made in the group that above-mentioned heat conduction fin 110 is made up of aluminium, aluminium alloy, copper or copper alloy.
Still see also Fig. 2 (a), the heat that the device that described radiator 100 tentatively will dispel the heat mainly concentrates on middle section is directed to a bigger area of dissipation, relends and helps the heat that brushes radiator 100 of centrifugal fan 200 to conduct in the background environment.It should be noted that because the middle section of described centrifugal fan 200 also has heat conduction fin 110, so mainly concentrate on the also dissipation effectively of heat of the middle section of desiring heat abstractor.
In addition, embedded centrifugal cooling device of the present utility model also comprises a loam cake 300, and described loam cake 300 is to keep the airtight of described embedded centrifugal cooling device as a gas check.Like this, the cooling blast that described centrifugal fan 200 is produced was just discharged by the end of described heat conduction fin 110 after can brushing whole section heat conduction fin 110 substantially, and can not have heat conduction fin partly can't be subjected to brushing of cooling blast as prior art.
Fig. 3 shows profile of the present utility model and for the temperature distributing curve diagram of the Effect on Temperature Distribution of the device of need heat radiation.Described as can be known temperature distribution history prior art is smooth according to the above description, needs the middle section or the peripheral region of the device of heat radiation all can obtain good cooling no matter also promptly be.In addition, cooling device of the present utility model is thinner than the prior art.
It should be noted that, though centrifugal fan 200 of the present utility model has wheel hub, but wheel hub of the present utility model can't influence described centrifugal fan 200 to its radiating effect, because it is radially to be brushed to outer rim by the center that the characteristic of centrifugal fan 200 is its air-flow, so the zone between wheel hub below and radiator top also is formed with cooling blast; Centrifugal fan 200 of the present utility model also can select not have wheel hub, or the area that wheel hub is shared reduces to minimum, because the mode of its realization is known by those skilled in the art person, therefore will not give unnecessary details.
The above only is preferred embodiment of the present utility model; be not in order to limit the utility model; all other do not break away from that the equivalence of being finished under the spirit that the utility model discloses changes or equivalence is replaced, and all should be included in the scope of patent protection of the present utility model.
Claims (12)
1. an embedded centrifugal cooling device is characterized in that, which comprises at least:
One radiator, it has a groove; And
One centrifugal fan, it is arranged in the described groove.
2. radiator as claimed in claim 1 is characterized in that, described radiator also has several heat conduction fins, and described heat conduction fin limits described groove.
3. radiator as claimed in claim 2 is characterized in that, described groove forms like this so that the central authorities of described centrifugal fan extend in the below, zone of outer rim of described centrifugal fan and is distributed with described heat conduction fin.
4. radiator as claimed in claim 1 is characterized in that, also comprises a loam cake, is arranged on described centrifugal fan and the described radiator.
5. radiator as claimed in claim 4 is characterized in that, described loam cake is that a gas check (air seal) is to keep airtight.
6. radiator as claimed in claim 1 is characterized in that, the shape of the described centrifugal fan of described groove fit.
7. radiator as claimed in claim 1 is characterized in that, selected material is made in the group that described heat conduction fin is made up of aluminium, aluminium alloy, copper or copper alloy.
8. an embedded centrifugal cooling device is characterized in that, which comprises at least:
One radiator has several heat conduction fins (cooling fin) and reaches, and described heat conduction fin limits a groove; And
One centrifugal fan is arranged in the described groove and is embedded in the described radiator.
9. radiator as claimed in claim 8 is characterized in that it also comprises a loam cake, is arranged on described centrifugal fan and the described radiator.
10. an embedded centrifugal cooling device is characterized in that, which comprises at least:
One radiator has several heat conduction fins (cooling fin), and described heat conduction fin limits a groove;
One centrifugal fan is arranged in the described groove and is embedded in described radiator; And
One loam cake is arranged on described centrifugal fan and the described radiator.
11. the radiator as claim 10 is characterized in that, described groove forms like this so that the central authorities of described centrifugal fan extend in the zone of outer rim of described centrifugal fan and is distributed with described heat conduction fin.
12. the radiator as claim 10 is characterized in that, selected material is made in the group that described heat conduction fin is made up of aluminium, aluminium alloy, copper or copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01208970 CN2479645Y (en) | 2001-03-29 | 2001-03-29 | Built-in centrifugal cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01208970 CN2479645Y (en) | 2001-03-29 | 2001-03-29 | Built-in centrifugal cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2479645Y true CN2479645Y (en) | 2002-02-27 |
Family
ID=33628936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01208970 Expired - Lifetime CN2479645Y (en) | 2001-03-29 | 2001-03-29 | Built-in centrifugal cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2479645Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8118462B2 (en) | 2008-06-23 | 2012-02-21 | Koito Manufacturing Co., Ltd. | Automotive lamp |
| IT201700023721A1 (en) * | 2017-03-02 | 2018-09-02 | Hawklab Srl | LAMP |
| CN109166834A (en) * | 2018-08-28 | 2019-01-08 | 安徽星宇生产力促进中心有限公司 | A kind of microelectronic circuit plate embedded-type heat-dissipating mechanism |
| CN111765660A (en) * | 2019-11-13 | 2020-10-13 | 苏州连海制冷科技有限公司 | Skid-mounted water chilling unit with water-cooling screw |
| CN114543056A (en) * | 2022-01-24 | 2022-05-27 | 桂林智神信息技术股份有限公司 | Heat dissipation device and heat dissipation lamp |
-
2001
- 2001-03-29 CN CN 01208970 patent/CN2479645Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8118462B2 (en) | 2008-06-23 | 2012-02-21 | Koito Manufacturing Co., Ltd. | Automotive lamp |
| IT201700023721A1 (en) * | 2017-03-02 | 2018-09-02 | Hawklab Srl | LAMP |
| CN109166834A (en) * | 2018-08-28 | 2019-01-08 | 安徽星宇生产力促进中心有限公司 | A kind of microelectronic circuit plate embedded-type heat-dissipating mechanism |
| CN109166834B (en) * | 2018-08-28 | 2020-07-07 | 安徽星宇生产力促进中心有限公司 | Embedded heat dissipation mechanism of microelectronic circuit board |
| CN111765660A (en) * | 2019-11-13 | 2020-10-13 | 苏州连海制冷科技有限公司 | Skid-mounted water chilling unit with water-cooling screw |
| CN114543056A (en) * | 2022-01-24 | 2022-05-27 | 桂林智神信息技术股份有限公司 | Heat dissipation device and heat dissipation lamp |
| CN114543056B (en) * | 2022-01-24 | 2023-12-08 | 桂林智神信息技术股份有限公司 | Heat abstractor and heat dissipation lamps and lanterns |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20110329 Granted publication date: 20020227 |