CN2433044Y - Tin ball forming machine - Google Patents
Tin ball forming machine Download PDFInfo
- Publication number
- CN2433044Y CN2433044Y CN 00220306 CN00220306U CN2433044Y CN 2433044 Y CN2433044 Y CN 2433044Y CN 00220306 CN00220306 CN 00220306 CN 00220306 U CN00220306 U CN 00220306U CN 2433044 Y CN2433044 Y CN 2433044Y
- Authority
- CN
- China
- Prior art keywords
- container
- sphere
- shaping area
- forming
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The utility model relates to a tin ball forming machine, which is needed by tin balls of materials for producing semiconductor chip package welding devices BGA and CSP. The utility model is composed of a canister high pressure forming container, the upper part of the canister high pressure forming container is provided with a feeding device, a feeding dispersal device, and a guard lamp. The outer part of the container is provided with a temperature observing meter and a temperature controlling meter; walls of the container are provided with a heat-insulating layer; the inner part of the container is provided with a sphere forming section and a sphere setting section from top to bottom. The outer walls of the sphere forming section are provided with electric heating wires; connection part of the sphere forming section and the sphere setting section is provided with a discharge controlling valve; the lower end of the sphere setting section is provided with a discharge gate. The utility model has the advantages of small space for forming, low energy consumption, and high productive efficiency.
Description
The utility model relates to a kind of produce semiconductor chip BGA, the required tin ball make-up machine invention of CSP welded encapsulation equipment raw material tin ball.
The tin ball is the BGA that welded encapsulation adopts (ball grid array of package) of large scale integrated circuit semiconductor chip in the current international microelectronic industry, the essential raw material of CSP (chip scale package) equipment.The tin ball used as welded encapsulation only has indivedual manufacturer production in the world, and its production technology all is to adopt tin is fused into to be sprayed into after the tin liquor further to be machined to finished product tin ball again after granular; Concrete processing technology and production equipment are all holded in close confidence as know-how, introduce according to the relevant technologies data, shortcoming such as exist that investment is big, complex process and yield rate are low.
The purpose of this utility model provides a kind of high efficiency tin ball make-up machine.
To be it be made of the high-pressure molding container of a cartridge type architectural feature of tin ball make-up machine described in the utility model, and its top is provided with feeding device, dispersal of feed device and warning lamp; External container is provided with thermoviewer table and temperature control instrument, chamber wall is provided with heat-insulation layer, internal tank is provided with spheroid shaping area and spheroid shaping area from top to bottom, spheroid shaping area outer wall is provided with heating wire, spheroid shaping area and spheroid shaping area connecting place are provided with the discharging control valve, and spheroid shaping area lower end is provided with discharging opening.
Tin ball make-up machine described in the utility model is broken through shortcomings such as existing equipment is bulky, energy consumption is high, yield rate is low, and the equipment molding space is little, power consumption is low and production efficiency is high.
Accompanying drawing is the utility model example structure schematic diagram:
Fig. 1 is the utility model external structure schematic diagram.
Fig. 2 is Fig. 1 cross-sectional schematic.
The tin ball make-up machine profile that the utility model is invented as shown in Figure 1, it is a tubular high-pressure molding container, to be it be made of the high-pressure molding container 2 of a cartridge type architectural feature of the tin ball make-up machine that top the utility model is invented, and its top is provided with feeding device 2, dispersal of feed device 3 and warning lamp 4; External container is provided with thermoviewer table 5 and temperature control instrument 6, be provided with heat-insulation layer 1-1 on the chamber wall as shown in Figure 2, container 2 inside are provided with spheroid shaping area 1-2 and spheroid shaping area 1-3 from top to bottom, spheroid shaping area outer wall is provided with heating wire 1-5, spheroid shaping area 1-2 and spheroid shaping area 1-3 connecting place are provided with discharging control valve 1-4, and spheroid shaping area lower end is provided with discharging opening 1-6.The tin grain is after 2 inputs of tin ball make-up machine top feeding device, under the effect of dispersal device 3, become shape freely falling body at random to fall into spheroid shaping area 1-2, the temperatures involved that produced by spheroid shaping area 1-2 heating wire 1-5, the tin material melts in the process of falling, liquid tin is subjected to its inner interior rapid power effect, liquefy spheroid; Be condensed into solid-state tin ball through discharging control valve 1-4 to spheroid shaping area 1-3 again.
Claims (1)
1. a tin ball make-up machine is characterized in that it is made of the high-pressure molding container of a cartridge type, and high-pressure bottle top is provided with feeding device, dispersal of feed device and warning lamp; External container is provided with thermoviewer table and temperature control instrument, chamber wall is provided with heat-insulation layer, internal tank is provided with spheroid shaping area and spheroid shaping area from top to bottom, spheroid shaping area outer wall is provided with heating wire, spheroid shaping area and spheroid shaping area connecting place are provided with the discharging control valve, and spheroid shaping area lower end is provided with discharging opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00220306 CN2433044Y (en) | 2000-05-13 | 2000-05-13 | Tin ball forming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00220306 CN2433044Y (en) | 2000-05-13 | 2000-05-13 | Tin ball forming machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2433044Y true CN2433044Y (en) | 2001-06-06 |
Family
ID=33585377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00220306 Expired - Fee Related CN2433044Y (en) | 2000-05-13 | 2000-05-13 | Tin ball forming machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2433044Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100431747C (en) * | 2005-10-27 | 2008-11-12 | 徐振武 | Preparation method of leadless soldering ball |
-
2000
- 2000-05-13 CN CN 00220306 patent/CN2433044Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100431747C (en) * | 2005-10-27 | 2008-11-12 | 徐振武 | Preparation method of leadless soldering ball |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Zhiheng Document name: Notification of Termination of Patent Right |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |