CN2373217Y

CN2373217Y - Plane grinding machine

Info

Publication number: CN2373217Y
Application number: CN 99211493
Authority: CN
Inventors: 谢乐天
Original assignee: Individual
Current assignee: Individual
Priority date: 1999-05-17
Filing date: 1999-05-17
Publication date: 2000-04-12
Anticipated expiration: 2009-05-17

Abstract

The utility model relates to a plane grinding machine which is characterized in that a clamping mechanism of a grinding roller is improved on the basis of the existing plane grinding machine, wherein the clamping mechanism comprises a static clamping wheel arranged on the end surface of one end of the grinding roller and a balance weight wheel is arranged on a position which is symmetrical to the static clamping wheel corresponding to the shaft line of the grinding roller. The other end of the grinding roller is provided with a clamping disk which is connected with the grinding roller via a disk spring, a movable clamping wheel is arranged on the clamping disk and the other balance weight wheel is arranged on a position which is symmetrical to the movable clamping wheel corresponding to the shaft line of the clamping disk. The utility model greatly simplifies the structure of the clamping mechanism of the grinding roller, lowers the difficulty of production, reduces cost, simultaneously increases the service life of a disposable clamping abrasive band and enhances work efficiency.

Description

Wafer lapping machine

The utility model relates to a kind of wafer lapping machine, relates in particular to the clamping mechanism on a kind of wafer lapping machine.

Wafer lapping machine is footwear leather a kind of machine mechanically, is used for the grinding sole.Wafer lapping machine generally comprises body, on body, be provided with some groups of conveying rollers, and brush roll, mill amount roller and grinding roller, being provided with clamping mechanism in grinding roller clamps the abrasive band and makes the abrasive band continue tightly to overlay on the grinding roller under the situation of elongating after the wearing and tearing, the clamping mechanism of grinding roller generally adopts the extension spring tension on the existing wafer lapping machine, there is following shortcoming in this structure: at first the impulse stroke scope of extension spring is less, when the abrasive band owing to the long stretcher strain that produces of working time greatly the time, can not tightly overlay on the grinding roller owing to be subjected to the impulse stroke restriction of extension spring, the product of producing is affected, at this moment clamping abrasive band or adopt new abrasive band again just will make production efficiency reduce like this; Secondly, because grinding roller is ceaselessly rotation at a high speed all the time, its center of gravity must drop on the quality of life-span that could guarantee workpiece on the grinding roller axis and the product of producing, at this moment weight must be set with counterweight at clamping mechanism with respect to the position of grinding roller axial line, owing to adopt the clamping mechanism out-of-shape of extension spring, the difficult control in the position of mass has so just strengthened the difficulty of producing, and has also increased cost.

The purpose of this utility model is to overcome the above-mentioned defective of prior art, and a kind of wafer lapping machine is provided, and makes that the clamping mechanism of grinding roller is simple in structure, easy to process on the wafer lapping machine, and the operating efficiency of wafer lapping machine is improved.

Technical solution of the present utility model is that the clamping mechanism to grinding roller improves on the basis of existing wafer lapping machine, clamping mechanism after the improvement comprises the quiet clip wheel on the end face of being located at grinding roller one end, on the position of same end face, be provided with weighting distribution wheel with respect to grinding roller axis and quiet clip wheel symmetry, in the grinding roller of the other end of grinding roller, be provided with chuck, grinding roller is connected by disc spring with chuck, disc spring one end is fixed on the grinding roller, the other end is fixed on the chuck, on chuck, be provided with moving clip wheel, position with respect to chuck axle line and moving clip wheel symmetry on chuck is provided with weighting distribution wheel, and quiet clip wheel and moving clip wheel are an eccentric wheel.

Owing to adopted above-mentioned concrete setting, simplified the structure of grinding roller clamping mechanism greatly, reduced the difficulty of producing, also reduced cost, simultaneously since the impulse stroke of disc spring improved much than the impulse stroke of stage clip, increase the service time in a clamping abrasive band, also increased operating efficiency.

Further illustrate particular content of the present utility model below in conjunction with drawings and Examples.

Fig. 1: configuration diagram of the present utility model;

The A-A view of Fig. 2: Fig. 1;

The B-B view of Fig. 3: Fig. 2;

The C-C view of Fig. 4: Fig. 2.

Present embodiment comprises body 1, on body 1, be provided with some groups of conveying rollers 2, and brush roll 3, mill amount roller 4 and grinding roller 5, in grinding roller 5, be provided with clamping mechanism, described clamping mechanism comprises the quiet clip wheel 7 on the end face of being located at grinding roller 5 one ends, on the position of same end face, be provided with weighting distribution wheel 8 with respect to grinding roller 5 axis and quiet clip wheel 7 symmetries, in the grinding roller 5 of the other end of grinding roller 5, be provided with chuck 9, grinding roller 5 is connected by disc spring 10 with chuck 9, disc spring 10 1 ends are fixed on the grinding roller 5, the other end is fixed on the chuck 10, on chuck 10, be provided with moving clip wheel 11, position with respect to chuck 10 axis and moving clip wheel 11 symmetries on chuck 10 is provided with weighting distribution wheel 12, and quiet clip wheel 7 and moving clip wheel 11 are an eccentric wheel.

During the clamping abrasive band, the abrasive band is wrapped on the grinding roller, an end in abrasive band is clamped in it on grinding roller by quiet clip wheel, and the other end is clamped in it on chuck by moving clip wheel, unclamps chuck, takes up on grinding roller because the effect chuck of disc spring rotates the drive abrasive band.Because quiet clip wheel and moving clip wheel all are eccentric wheels, thereby have auto-lock function.

Claims

1, a kind of wafer lapping machine, comprise body, on body, be provided with some groups of conveying rollers, and brush roll, mill amount roller and grinding roller, in grinding roller, be provided with clamping mechanism, it is characterized in that: described clamping mechanism comprises the quiet clip wheel (7) on the end face of being located at grinding roller (5) one ends, on the position of same end face, be provided with weighting distribution wheel (8) with respect to grinding roller (5) axis and quiet clip wheel (7) symmetry, in the grinding roller (5) of the other end of grinding roller (5), be provided with chuck (9), grinding roller (5) is connected by disc spring (10) with chuck (9), disc spring (10) one ends are fixed on the grinding roller (5), the other end is fixed on the chuck (10), be provided with moving clip wheel (11) on chuck (10), the position of going up with respect to chuck (10) axis and moving clip wheel (11) symmetry at chuck (10) is provided with weighting distribution wheel (12).

2, wafer lapping machine according to claim 1 is characterized in that: described quiet clip wheel (7) and moving clip wheel (11) are an eccentric wheel.