CN2370468Y

CN2370468Y - Radiator

Info

Publication number: CN2370468Y
Application number: CN 99235652
Authority: CN
Inventors: 李学坤; 李顺荣
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 1999-03-25
Filing date: 1999-03-25
Publication date: 2000-03-22
Anticipated expiration: 2009-03-25

Abstract

The utility model relates to a radiator which is attached on a wafer and is used for helping to discharge heat generated by the wafer. The radiator comprises a base and a plurality of radiating fins arranged on the base, wherein, the base is formed by extrusion moulding and then is properly processed, the bottom face of the base is attached on the wafer, and the top face of the base is integrally extended with a plurality of convex posts in the proper arrangement so that the radiating fins are arranged; the radiating fins are made of plates which are punched and bent, and form U-shaped in general and comprise a base fin and a first and a second side fins bending in a same direction and extending in parallel with each other from both sides of the base fin, and the base fin is used for attaching with the top face of the base.

Description

Heat abstractor

The utility model relates to a kind of heat abstractor, refers to a kind of heat abstractor that adopts the separate type design especially, and its radiating effect is good, easy to manufacture and one-piece construction is firm.

Growing along with IT industry, electronic product has been obtained the progress of apparent alpine yarrow, and is wherein comparatively remarkable with the computer field especially, and with the fastest developing speed with central processing unit in the computer field.As everyone knows, central processing unit is the maincenter of computer deal with data and information, is one of high heater element in the computer, and can the heat that central processing unit produces in time discharge, and is directly connected to the speed and the accuracy of computer deal with data.Existing central processing unit arithmetic speed is more and more fast, and the heat that it produced is also more and more many, and heat dissipation problem has become the problem that needs to be resolved hurrily.Existing radiating mode is a lot, and heat abstractor as shown in Figure 1 is one of them.The bottom surface of this heat abstractor 2 fits on the wafer (figure does not show), in time discharges with the heat that wafer is produced.Because this type of heat abstractor 2 adopts tradition (Extruding) modes that extrude to make, under restrictions such as manufacturing technology ability and mould strength, fin density or integral heat sink surface area also are restricted and are difficult to meet more and more high heat radiation requirement.In addition, combined radiating device is as shown in Figure 2 also arranged, this heat abstractor 4 is made up of a pedestal 6 and some fins 8 that is inserted on the pedestal 6.Because the fin 8 of this type of heat abstractor 4 is to change with impact style to make, so on fin density and integral heat sink surface area, have bigger design space.Yet,,, and influence the radiating effect of heat abstractor 4 greatly so integrally-built steadiness is obviously not enough, and also is easy to generate the space at the joint of fin 8 and pedestal 6 because the fin 8 of this type of heat abstractor 4 is directly to be embedded on the pedestal 6 in the plant mode.Therefore, provide the heat abstractor that a kind of radiating effect is good, easy to manufacture and one-piece construction is firm, become the task of top priority.

The purpose of this utility model is to provide a kind of easy to manufacture, one-piece construction is firm and radiating effect is good heat abstractor.

The technical scheme of the utility model heat abstractor is: this heat abstractor comprises a pedestal and some radiating fins that is installed on the pedestal.This pedestal is that its bottom surface fits on the wafer by extrusion molding and after suitable processing and get, and end face then one is extended with the projection of several suitable deployings, installs for this radiating fin.This radiating fin is to be got by the plate stamping bending, is " U " font substantially, comprises a substrate and bend first lateral plate and second lateral plate that extends parallel to each other in the same way from the substrate both sides that this substrate is in order to fit with base top surface.

Owing to adopted technique scheme, the utlity model has good heat dissipation effect, easy to manufacture and advantage that one-piece construction is firm.

The utility model is described in further detail below in conjunction with accompanying drawing and preferred embodiment.

Fig. 1 is the three-dimensional view of existing heat abstractor.

Fig. 2 is the three-dimensional view of another existing heat abstractor.

Fig. 3 is the three-dimensional view of the utility model first embodiment.

Fig. 4 is the diagrammatic cross-section in the utility model first embodiment assembling process.

Fig. 5 is the three-dimensional view of the utility model second embodiment.

Fig. 6 is the three-dimensional view of the utility model the 3rd embodiment.

Please refer to Fig. 3, is the three-dimensional view of the utility model heat abstractor first embodiment, and this heat abstractor comprises a pedestal 60 and some radiating fins 70 that is installed on the pedestal 60.This pedestal 60 is to make by extrusion molding and through suitable processing back, and its bottom surface 62 fits on the wafer (scheming not show), and end face 64 then one is extended with the square projection 66 that several are the arrangement of square formation shape.This radiating fin 70 is by plate stamping bending and get, is " U " font substantially, comprises that a substrate 72 reaches to bend first lateral plate 74 and second lateral plate 76 that extends parallel to each other in the same way from substrate 72 both sides.Be formed with the perforate 82 that matches with pedestal 60 projections 66 on this substrate 72.

By cooperating of the projection on the pedestal 60 66 and 82 of radiating fin 70 perforates, radiating fin 70 correspondences are installed on pedestal 60 end faces 64, utilize tool 90 to impact this projection 66 then, make the suitable distortion of projection 66 generations and make radiating fin 70 firm engagement on pedestal 60, (please refer to Fig. 4).

Please refer to Fig. 5, is the three-dimensional view of the utility model heat abstractor second embodiment.On radiating fin 30 first lateral plates 32 and second lateral plate 34 of this heat abstractor, further be formed with the opening 36 that corresponds to each other, this opening 36 also can be beneficial to cross-ventilation except that can increasing the integral heat sink surface area.Understandably, this first lateral plate 32 and second lateral plate 34 can further in position form the hole that corresponds to each other, as circular opening, triangle hole etc. (figure does not show), to increase the integral heat sink surface area and to be beneficial to cross-ventilation.

Please refer to Fig. 6, be the three-dimensional view of the utility model heat abstractor the 3rd embodiment.First lateral plate 54 of this radiating fin 50 further extends a top flat 52 towards the bending of second lateral plate 56 so that radiating fin 50 become around the structure of edge sealing, simultaneously and form an enclosed channel 58 that can speed cross-ventilation speed.

Claims

1. heat abstractor, fit on the wafer, in order to assist the discharging heat that institute's wafer produces, this heat abstractor comprises a pedestal and some radiating fins, it is characterized in that: this base bottom surface fits on the wafer, and end face then one is extended with the projection of several suitable deployings; These some radiating fins all have a substrate and bend first lateral plate and second lateral plate that extends parallel to each other from the substrate both sides in the same way, and be formed with the perforate that matches with the pedestal projection on this substrate, even by cooperating the radiating fin firm engagement on pedestal between projection and perforate.

2. heat abstractor as claimed in claim 1 is characterized in that: the projection on this base top surface is to be square and deploying becomes the square formation shape.

3. heat abstractor as claimed in claim 1 is characterized in that: engaging between this radiating fin and pedestal is to utilize tool to impact projection on the base top surface, make projection produce suitably distortion and with the radiating fin rivet clasp on pedestal.

4. heat abstractor as claimed in claim 1 is characterized in that: this pedestal is by extrusion molding and through suitably making after the processing.

5. heat abstractor as claimed in claim 1 is characterized in that: this radiating fin is to be got by the plate stamping bending.

6. as claim 1,2,3,4 or 5 described heat abstractors, it is characterized in that: on first lateral plate and second lateral plate of this radiating fin, further be formed with the opening that corresponds to each other.

7. as claim 1,2,3,4 or 5 described heat abstractors, it is characterized in that: first lateral plate of this radiating fin further extends a top flat towards the bending of second lateral plate, so that radiating fin becomes the structure of edge sealing all around.