CN2349680Y - Double butt contact horizontal modular assembly device - Google Patents
Double butt contact horizontal modular assembly device Download PDFInfo
- Publication number
- CN2349680Y CN2349680Y CN 98216424 CN98216424U CN2349680Y CN 2349680 Y CN2349680 Y CN 2349680Y CN 98216424 CN98216424 CN 98216424 CN 98216424 U CN98216424 U CN 98216424U CN 2349680 Y CN2349680 Y CN 2349680Y
- Authority
- CN
- China
- Prior art keywords
- processing unit
- central processing
- membrane module
- unit membrane
- motherboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
The utility model relates to a double butt joint horizontal modular component which comprising a central processing unit component, a host machine board and a connector through which the central processing unit modular component is electrically connected with the host machine board. The host machine board of the computer and the central processing unit modular component are electrically connected with the connector mutually and horizontally. Accordingly, the utility model can make the central processing unit plugged and connected steadily and is convenient to be used in a bad working environment, and the height of the central processing unit modular component is decreased to make a computer shell thin.
Description
The utility model relates to a kind of biconjugate water receiving flat-die assembly apparatus, particularly relates to a kind ofly making the slimming of computer body, and is beneficial to the biconjugate water receiving flat-die assembly apparatus that packing, transportation and material store.
After CPU and circuit board moduleization, peg graft with the connector of motherboard again, formed the basic structure of present computer motherboard in order to the configuration space of saving whole motherboard.As shown in Figure 1, it is installed in the schematic diagram of circuit board for the central processing unit membrane module.As shown in the figure, central processing unit membrane module 50 behind the modularity still must be considered the problem of heat dissipation capacity, therefore, be equipped with fin 60 (or small-sized fans), modularity no doubt makes the configuration space of motherboard save flexibly, but, relatively make the fixed component of accepting 70 be subjected to suitable load, especially central processing unit membrane module 50 has certain altitude, and the assembly of its side direction is quite heavy again, therefore, if be in bad operational environment, can be easier to cause the side direction of fixed component 70 loosening, and influence electrically contact.
Moreover, being subjected to the influence of computer chassis thin typeization up till now, aforementioned central processing unit membrane module also can't be fit to the demand of following thin typeization because of its intrinsic limitation in height.And, in packed and transported or storage, also can be because of the relation of central processing unit membrane module height, except that packaging volume increases, also easily because of the neglectful phenomenon that gets loose that causes with the motherboard electric welding of touching.
The purpose of the utility model biconjugate water receiving flat-die assembly apparatus is to provide a kind of central processing unit that can make firmly to peg graft, and is convenient to the use of bad operational environment, and can reduces central processing unit membrane module height, and make computer chassis be able to thin typeization.
The purpose of this utility model is to realize like this, a kind of biconjugate water receiving flat-die assembly apparatus promptly is provided, comprise central processing unit membrane module, motherboard and the connector that the central processing unit membrane module is electrically connected with motherboard, motherboard and central processing unit membrane module flatly are electrically connected with described connector mutually.
The advantage of the utility model device is, it for flatly being electrically connected with connector mutually, makes the computer slimming at motherboard and central processing unit membrane module, reduces packaging volume, reduces cost of transportation.
Below in conjunction with accompanying drawing, describe embodiment of the present utility model in detail, wherein:
Fig. 1 is assembled in the stereogram of motherboard for existing central processing unit membrane module;
Fig. 2 is the three-dimensional exploded view of the utility model biconjugate water receiving flat-die assembly apparatus;
Fig. 3 is the three-dimensional combination figure of the utility model biconjugate water receiving flat-die assembly apparatus;
Fig. 4 is assembled in the three-dimensional combination figure of motherboard for the utility model biconjugate water receiving flat-die assembly apparatus;
Fig. 5 is second embodiment of assist location frame in the utility model biconjugate water receiving flat-die assembly apparatus.
See also Fig. 2, the utility model biconjugate water receiving flat-die assembly apparatus 1 comprises: central processing unit membrane module 10, motherboard 11, connector 12 and assist location frame 13, wherein, this central processing unit membrane module 10 is electrically connected on central processing unit on the have contact chip circuit board of (Golden Finger) in advance, and coats with a shell body.This motherboard 11 is the motherboard of computer special use.In addition, this connector 12 comprises: insulation shell 121 and several conducting terminals (not shown), wherein, insulation shell 121 has first and second plug surface 1210,1211, and first and second plug surface 1210,1211 all is provided with slot 123 (second plug surface, 1,211 one sides only are shown among the figure), is used to provide the grafting of central processing unit membrane module 10 with motherboard 11.And be provided with the accepting groove 124 (second plug surface, 1,211 one sides equally only are shown) of mutual perforation in the slot 123, be used to accommodate this each conducting terminal, the both sides notch that this each conducting terminal is positioned at accommodating groove is a contact site, can be electrically connected with motherboard 11 with central processing unit membrane module 10.
In addition, this assist location frame 13 comprises: first jig arm 131 that the side of central processing unit membrane module can be inserted and put and second jig arm 132, and linking arm 133, this two jig arm 131,132 of mat can be used for guiding and fixing central processing unit membrane module 10, and this linking arm 133 of mat can insert and put connector 12.
See also Fig. 3 and Fig. 4, earlier motherboard 11 is plugged in a side slot of connector 12 during the utility model assembling, and mat bolt 30 is with first and second jig arm 131,132 and connector 12 (see figure 3) that locks simultaneously, mat bolt 31 is locked in (see figure 4) on the computer matrix 2 with first and second jig arm 131,132 other ends again, can connect for the electric mortiser of central processing unit membrane module 10 with connector 12.As shown in the figure, peg graft, thereby whole height can reduce, and can be convenient to packing, transportation and store because the utility model central processing unit membrane module 10 is level with motherboard 11.
In addition, see also Fig. 5, its be the utility model assist location frame 13 ' second embodiment, they are different with aforementioned first embodiment be in only comprise first jig arm 131 ' and second jig arm 132 ', can reach the effect of guiding and inserting and putting central processing unit membrane module 10 like this, equally.
In sum, the main feature of the utility model biconjugate water receiving flat-die group device spare is that computer motherboard and central processing unit membrane module flatly are electrically connected with connector mutually.
Main feature according to above-mentioned wherein, is provided with an assist location frame between central processing unit membrane module and the connector, guide the grafting of central processing unit by this, and further fixing.
Claims (4)
1. biconjugate water receiving flat-die assembly apparatus, comprise central processing unit membrane module, motherboard and the connector that the central processing unit membrane module is electrically connected with motherboard, it is characterized in that described motherboard and described central processing unit membrane module flatly are electrically connected with described connector mutually.
2. biconjugate water receiving flat-die assembly apparatus as claimed in claim 1, it is characterized in that, described connector comprises insulation shell and several conducting terminals, described insulation shell has first and second plug surface, described first and second plug surface is provided with slot, at least one side is provided with the accepting groove of mutual perforation in the described slot, described each conducting terminal is accommodated in described each accepting groove of described first and second plug surface, and the notch that is positioned at accommodating groove is a contact site, is electrically connected with described motherboard with described central processing unit membrane module.
3. biconjugate water receiving flat-die assembly apparatus as claimed in claim 1 or 2, it is characterized in that, also be provided with the assist location frame that is used to guide and fix described central processing unit membrane module between described central processing unit membrane module and described connector, described assist location frame includes first jig arm and second jig arm that the side of described central processing unit membrane module can be inserted and put at least.
4. biconjugate water receiving flat-die assembly apparatus as claimed in claim 3 is characterized in that described assist location frame also is provided with linking arm between described first and second jig arm, and described linking arm inserts and puts described connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98216424 CN2349680Y (en) | 1998-08-05 | 1998-08-05 | Double butt contact horizontal modular assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98216424 CN2349680Y (en) | 1998-08-05 | 1998-08-05 | Double butt contact horizontal modular assembly device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2349680Y true CN2349680Y (en) | 1999-11-17 |
Family
ID=33969374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98216424 Expired - Fee Related CN2349680Y (en) | 1998-08-05 | 1998-08-05 | Double butt contact horizontal modular assembly device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2349680Y (en) |
-
1998
- 1998-08-05 CN CN 98216424 patent/CN2349680Y/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6089878A (en) | Electrical connector assembly having a standoff | |
| CA2129586C (en) | Enclosure for personal computer card and method of making | |
| CN2401923Y (en) | Electronic card | |
| EP0671704B1 (en) | Grounded IC card | |
| CN2312523Y (en) | Electric connector assemblies | |
| US6381140B1 (en) | Memory module | |
| US6726505B2 (en) | Memory daughter card apparatus, configurations, and methods | |
| CN2422749Y (en) | Electric connector with clamping device | |
| CN2596616Y (en) | Module connector | |
| TW384557B (en) | System for connecting a set of opposite connectors | |
| US6540550B2 (en) | Stacked card edge connector | |
| US20020187661A1 (en) | Low inductance power connector and method of reducing inductance in an electrical connector | |
| CN2349680Y (en) | Double butt contact horizontal modular assembly device | |
| US20040264148A1 (en) | Method and system for fan fold packaging | |
| CN2402001Y (en) | Piling type electric connector | |
| CN1129089C (en) | IC card with board positioning means | |
| JPS63106984A (en) | Memory cartridge | |
| JPS60245298A (en) | Printed board containing device | |
| JP2553438Y2 (en) | Memory card connector | |
| CN2770124Y (en) | Electronic card connector | |
| CN2454940Y (en) | Electronic-card connector | |
| CN2144876Y (en) | Electric circuit connector | |
| CN215954217U (en) | Board card and electronic product | |
| CN217085708U (en) | Power supply adapter plate, computer module and computer equipment | |
| CN201185013Y (en) | Card-reading mold set apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |