CN2326913Y - Throw-into type semiconductor refrigerating device - Google Patents

Abstract

The utility model belongs to the refrigerating device and uses the hot sides of two blocks of semiconductor refrigerating devices to clamp a water cooling board into the cavity of a cold shell. The wall of the cavity is attached to the cold side of the semiconductor refrigerating device closely, the left space in the cavity is filled with thermal insulating material to separate the water cooling board from the cold shell, and a heat insulating layer on the water outlet pipe of the water cooling board extending out of the cold shell wraps a water pipe. When the utility model is used, the device is thrown into the medium needed to be cooled directly with the cold shell, and the utility model can make the medium be extremely cold if used for many times; compared with the traditional semiconductor refrigerating device, a circulating pump and a pipeline are omitted from the utility model, and the utility model has simple structure, low noise, high thermal efficiency and high speed of refrigeration, and can be widely used for refrigeration or thermostatic control.

Description

The throw-in type semiconductor cooling device

The utility model relates to a kind of refrigerating plant.

The semiconductor cooling device that is used for media such as the various liquid of constant temperature, gas now is made up of the heat exchanger and the cooling water plate of two block semiconductor refrigerators, interior tool passage, the cold side of two block semiconductor refrigerators inserts and puts heat exchanger, and hot side respectively contacts with cooling water plate.The thermostat that media such as liquid, gas will be housed by pipeline is communicated with heat exchanger, rely on the circulating pump that is provided with on the pipeline to make medium circulation, by the continuous cooling medium of heat exchanger, the recirculated cooling water in the cooling water plate is constantly taken away the heat that the semiconductor heat side produces, the realization refrigerated constant temperature.The weak point of this refrigerating plant is:

1. must adopt circulating pump that medium is circulated at pipeline, so make whole refrigerant system configurations, installation complexity, cost raising, noise increase, also take.

2. heat exchange area is limited, and when the temperature of medium during near condensation point, the passage in the heat exchanger can freeze gradually especially, in addition, the long-term use, the pipeline inner wall fouling has all caused heat exchanger effectiveness low, has influence on refrigeration, and refrigerating speed is slow.

3. radiating surfaces such as connecting line, joint and heat exchanger side are many, cause heat loss to increase.

In view of above-mentioned, the purpose of this utility model is to overcome the prior art weak point, and a kind of heat exchanger effectiveness height is provided, and refrigeration is quick, and effective, structure is simple and direct, installation, easy to use, and noise is little, the throw-in type semiconductor cooling device that cost is low.

For reaching above-mentioned purpose, the throw-in type semiconductor cooling device that the utility model provides is that the hot side with two block semiconductor refrigerators inserts and puts cooling water plate and inserts in the cavity volume of cooled case, the cold side and the chamber wall of semiconductor cooler are close to, remaining space is filled filled insulation with cooled case and cooling water plate isolation in the chamber, outer end at cooled case is provided with heat insulation layer, and the inlet tube and outlet tube of cooling water plate passes through heat insulation layer from this end and stretches out cooled case.During work, this device input is needed in the medium of cooling, by the direct constantly cooling medium of cooled case, the recirculated cooling water of cooling water plate is constantly taken away heat, realizes refrigeration or thermostatic control.

Below in conjunction with accompanying drawing the utility model is illustrated:

Fig. 1 is the utility model structural representation;

Fig. 2 is the cross section of Fig. 1.

With reference to Fig. 1, Fig. 2, two block semiconductor refrigerators 2 of throw-in type semiconductor cooling device, 2 ' hot side A insert and put cooling water plate 1 and insert in the cavity volume of cooled case 3, for ease of installing, usually, cooled case forms admittedly with two hemicompacts, semiconductor cooler 2,2 ' cold side B and chamber wall be close to, remaining space is filled filled insulation 5 with cooled case 3 and cooling water plate 1 isolation in the chamber, outer end at cooled case is provided with heat insulation layer 6, and the inlet tube and outlet tube 4,4 of cooling water plate 1 ' passing through heat insulation layer 6 from this end stretches out cooled case.Heat insulation layer can adopt plastics or plastic foam.

Because the utility model is directly to drop in the medium when using, the contact area of medium and cooled case is big, so the heat exchanger effectiveness height, refrigeration fast, and is effective, simultaneously, it does not need circulating pump, pipeline connects, so noise is greatly reduced, overcomes heat loss, and install, use very convenient, according to user's needs,, also can realize quick deep cooling as the several throw-in type semiconductor cooling devices of many uses in medium.The utility model structure is simple and direct, volume is little, in light weight, cost is low, pollution-free, can be widely used in oil, chemical industry, the laboratory, hospital etc. as the refrigeration, thermostatic equipment.

Claims (2)

1. throw-in type semiconductor cooling device, have two block semiconductor refrigerators [2], [2 '], contain into, outlet pipe [4], the cooling water plate of [4 '] [1], it is characterized in that two block semiconductor refrigerators [2], the hot side [A] of [2 '] inserts and puts cooling water plate [1] and inserts in the cavity volume of cooled case [3], semiconductor cooler [2], the cold side of [2 '] [B] is close to chamber wall, remaining space is filled filled insulation [5] with cooled case [3] and cooling water plate [1] isolation in the chamber, in an outer end of cooled case heat insulation layer [6] is set, advances, outlet pipe [4], [4 '] are passed through heat insulation layer [6] from this end and are stretched out cooled case.

2. by the described refrigerating plant of claim 1, it is characterized in that said cooled case [3] is to form by two halves are fastening.

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