CN2290923Y - Storage case for loading integrated circuit wire rack for follow-up processing - Google Patents

Abstract

The utility model relates to a storage case (L/FMagazine) for loading integrated circuit (IC) wire rack (LeadFrame, L/F) for follow-up processing. The main body of the storage case forms an n shape, wherein, the n-shaped main body is provided with two cards at the lower ends of both sides and two grooves at the suitable points of the both sides of the upper end; two grooves are arranged at points corresponding to the two cards to enhance the intensity of the corner of the storage case and to counteract the radius of the corner; automated jobs of an integrated circuit package factory are benefit from using the storage case to hold wire racks.

Description

The magazine that is used for following process of splendid attire integrated circuit lead frame

The utility model relates to a kind of magazine of splendid attire integrated circuit lead frame, it is a kind of corner bending radius of offsetting, strengthen the magazine that is used for following process of corner intensity, problem with effective solution integrated circuit (IC) encapsulation back operation reaches the benefit that promotes IC production capacity, quality and reduce cost.

In the high-tech IC industry, each factory building setting up one after another like the mushrooms after rain in recent years, for increasing its competitiveness, spend invariably manpower, financial resources in research and development or otherwise so that production capacity improve.

The magazine that is used for following process is a kind of precision optical machinery member, be mainly the automated job of splendid attire integrated circuit lead frame in order to integrated circuit encapsulation factory following process, so its dimensional requirement is very strict, generally speaking, the length and width of this magazine size is that the length and width of integrated circuit lead frame respectively adds 1.5 millimeters, if magazine is shaped with normal mode, promptly with the squeezer processing method, then its corner can produce the circular arc that radius is about 1 millimeter, bilateral then have 2 millimeters generations, causes lead frame to slide within it; For improving above-mentioned shortcoming, existing magazine is before it is shaped, processing is earlier milled ditch and is reshaped, so cause the corner strength reduction of this magazine, then integrated circuit encapsulation factory director's year repaiies, safeguards and disturbed by magazine distortion and incorrect the sending of size, more influences its row yielding, quality grade, friendship phase and goodwill.

The purpose of this utility model is to provide a kind of magazine that is used for following process of splendid attire integrated circuit lead frame, in order to integrated circuit encapsulation factory following process, as pressing mold, moulding, impress, cut the automated job of work such as pin, plating, baking.

The purpose of this utility model is achieved in that the magazine that is used for following process that a kind of splendid attire integrated circuit lead frame promptly is provided, and its body is a JiongZi Xing, and in lower end, described body both sides folding two cards is arranged; Establish two grooves in upper end, magazine body both sides, and also be provided with two grooves corresponding to two card places.

The advantage of the utility model device is:

1, not yielding, better stability is arranged.

2, can not produce interference with lead frame, thereby can not produce misoperation or damage product.

3, manufacture easily low price.

4, effectively solve the problem of the magazine easy deformation of IC encapsulation following process, benefit such as have production capacity, the quality of lifting and reduce cost.

Below in conjunction with accompanying drawing, embodiment of the present utility model is described, wherein:

Fig. 1 is the stereogram of magazine splendid attire lead frame embodiment;

Fig. 2 A, 2B are the size schematic diagram of magazine;

Fig. 3 is the front elevational schematic with existing processing method shaping magazine;

Fig. 4 is the generalized section of the preceding material of existing magazine shaping;

Fig. 5 is the shaping front view of existing magazine;

Fig. 6 is the schematic perspective view of the utility model magazine;

Fig. 7 is the Another Application illustration of the utility model magazine.

See also the schematic diagram of magazine 1 splendid attire lead frame 2 shown in Figure 1, this lead frame 2 is placed in the opening part of this magazine 1 by automatic transmission means, make lead frame 2 in this magazine 1, to slide, this magazine 1 upper end is provided with several holes 4, the bottom folding has two cards 5, so, so that the operation of integrated circuit encapsulation following process, as pressing mold, impress, be shaped, cut the automated job of work such as pin, plating, baking.

See also shown in Figure 2ly, the dimensions length A in this magazine 1 and the specification of width B are:

The length C of A=lead frame 2+1.5 millimeter

The width D of B=lead frame 2+1.5 millimeter

See also the front elevational schematic of the magazine 1 that is shaped with existing processing method shown in Figure 3, if the shaping of this magazine 1 is normally to pull the metalworking method, promptly adopt squeezer processing, so, though it is up to specification on the internal diameter size surface of magazine 1, yet its corner 3 has produced radius 6 is about 1 millimeter, bilateral having added, then have 2 millimeters, to cause lead frame 2 in magazine 1, to slide, if the feasible value of 1.5 millimeters of dimensionss is strengthened, when then lead frame 2 slides drift will be arranged, tilt, the misoperation of counter-rotating all can not be accepted this encapsulation factory or automaton factory, so must solve this problem by the use specific process.

See also the generalized section of the preceding material of existing magazine 1 shaping shown in Figure 4, for improving the interference that 6 pairs of lead frames 2 of above-mentioned radius cause, corrosion resistant plate 7 (STAINLESS before earlier this magazine being shaped, material thickness is 1.5 millimeters) processing mills ditch and becomes chase 8, the degree of depth of this chase 8 is about 0.9 millimeter, directly chase 8 is depressed with forming-tool again, can form the pattern of this magazine, though so can solve the problem of radius 6, but because of processing the relation of milling ditch earlier, 3 of the corners of the magazine after the shaping have a chase trace 9 (as shown in Figure 5), weakened the intensity of the corner 3 of magazine 1, thus yielding, so integrated circuit encapsulation factory adopts this kind magazine, then be the magazine distortion throughout the year, size is incorrect and send and repair, maintenance is disturbed, and more influences its row yielding, quality grade, friendship phase and goodwill.

See also the schematic perspective view of the utility model magazine 1 shown in Figure 6, for improving the above-mentioned influence that corner 3 strength reductions is caused because of chase trace 9, both sides, the utility model magazine 1 upper end appropriate location is provided with groove 10, and also be provided with groove 10 corresponding to two cards, 5 places, make it can offset the radius 6 that is produced because of squeezer processing, thereby conform with the use standard fully, do not have because of chase trace 9 yet and produce the too weak variety of issue that is produced of corner 3 intensity, again because of the processing earlier of this magazine being milled ditch, so manufacture and be easier to, reduce relatively on the price, moreover, there are many holes 4 magazine 1 body upper end, this is in order to plating, baking operation institute must, and existing magazine 1 directly slides by friction in magazine 1 for lead frame 2, sometimes with this magazine 1 basal plane on hole 4 produce interference, and produce misoperation or damage product, but the utility model magazine 1 is because of the relation of groove 10, still have living space 11 distance of lead frame 2 and magazine 1 basal plane, 2 of lead frames lean on groove ditch 12 to slide in magazine 1, that is lead frame 2 can not produce interference with the hole 4 on magazine 1 basal plane, can solve the problem of integrated circuit encapsulation following process operation completely effectively, to promoting IC encapsulation production capacity, quality and reducing cost etc. all has greatest benefiting.

See also the Another Application illustration of the utility model magazine shown in Figure 7, the principle that it used is same as described above, difference is: the basal plane appropriate location of the hole 4 in magazine 1 is provided with two pads 13, and also be provided with two pads 13 corresponding to two cards, 5 places, make it can offset the radius 6 that is produced because of squeezer processing, so, do not have yet and mill ditch because of processing and make corner 3 cause the shortcoming of strength reduction, also can solve the problem of integrated circuit encapsulation following process operation completely effectively, benefit such as have the integrated circuit of lifting encapsulation production capacity, quality and reduce cost.

Claims (2)

1, a kind of magazine that is used for following process of splendid attire integrated circuit lead frame, its body are the door font, and in lower end, described body both sides folding two cards are arranged; It is characterized in that; Establish two grooves in upper end, magazine body both sides, and also be provided with two grooves corresponding to two card places.

2, the magazine that is used for following process of splendid attire integrated circuit lead frame as claimed in claim 1 is characterized in that, establishes two pads on the hole basal plane in the described magazine, and also establishes two pads corresponding to two card places.

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