CN2279255Y - Ultrathin diamond cutting slice - Google Patents
Ultrathin diamond cutting slice Download PDFInfo
- Publication number
- CN2279255Y CN2279255Y CN 96222827 CN96222827U CN2279255Y CN 2279255 Y CN2279255 Y CN 2279255Y CN 96222827 CN96222827 CN 96222827 CN 96222827 U CN96222827 U CN 96222827U CN 2279255 Y CN2279255 Y CN 2279255Y
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- CN
- China
- Prior art keywords
- utility
- model
- cutting blade
- cutting
- diamond
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an ultrathin diamond cutting slice, and the utility model is used for scribing processing optical materials, and the cutting of optical materials and precious stones in an integrated circuit industry. The utility model does not only solve the problems of the separation of a basal body and a tyre body caused by a conventional manufacturing process of an electroplating method and complicated technology, but also avoids the problem of the adoption of the high cost brought by a CVD (chemical vapor deposition) method. The utility model adopts the combination of a chemical plating method and an electroplating method to produce a non-basal body type diamond cutting slice; the utility model has the advantages of high rigidity and intensity, long service life, high cutting accuracy and precision and low cost; besides, the thickness of the utility model ranges from 20 mu m-100 mu m, and the thickness can be optionally adjusted.
Description
The utility model is a kind of superthin diamond cutting blade, and it is mainly used in integrated circuit industry scribing processing, the cutting of optical material and jewel.
In integrated circuit processing scribing operation, need wafer is divided into the little chip of integrated circuit, and used machining tool is a superthin diamond cutting blade with separate unit.Development of integrated circuits requires integrated level more and more higher, and cutting apart of high integration wafer must be used the more cutting blade of minimal thickness, just can reach high accuracy, the requirement of low-cost and little allowance.
Conventional cutting piece made from diamond is to adopt pressure sintering or galvanoplastic to make.And pressure sintering for make this thickness as thin as a wafer the cutting blade of (100 μ m are following) be not suitable for very much.The cutting blade of conventional galvanoplastic manufacturing has many weak points, and as shown in Figure 1: 1 is matrix among Fig. 1, normally makes with general spring steel or tool steel, mainly plays a supportive role.2 is carcass, is made up of diamond single crystal and Ni-Co plating alloy.1 with 2 be connected by electroplating deposition and realize.This kind section is because matrix and carcass two parts link, and to come off be inevitable so carcass and matrix separate when being subjected to thump load.In addition, because matrix very thin (100 μ m are following), and performance indications such as desired end face run-out surface roughness rigidity are higher, thus matrix preparation cost height, and it is numerous and diverse to implement to apply depositing process on matrix as thin as a wafer.
At present, external have employing CVD (chemical vapor deposition) method at first to make diamond multicrystal film ring in order to solve the deficiency that superthin diamond cutting blade brought of conventional galvanoplastic manufacturing, then is welded on the matrix again.The method has been improved the performance of section to a certain extent, but diamond drop-off problem and high accuracy connectivity problem still have its deficiency.CVD method equipment needed thereby complex process costs an arm and a leg in addition.
The purpose of this utility model is to utilize a kind of process to make no matrix formula cutting piece made from diamond, so do not have cutting blade and matrix segregation phenomenon in cutting, cutting blade rigidity and intensity are higher, guaranteed that the section end face run-out is less, long service life, cost is low and cutting accuracy is improved greatly.
The utility model is that galvanoplastic and electroless plating method are combined, and produces no basic formula cutting piece made from diamond.This cutting piece made from diamond is as Ni-Co, Ni-Mn, NiP, alloy and diamond single crystal compositions such as (or glomerocrysts) such as single Ni alloy or stainless steel by the material that evenly is mixed into one.Be the front view of a complete no matrix formula cutting piece made from diamond among Fig. 2, Fig. 3 is its vertical view.
Superthin diamond cutting blade is to be formed on a substrate earlier by galvanoplastic and electroless plating method, and thickness separates both in the 20-100 mu m range then, reaches the physical dimension of regulation again through punch forming.Wherein substrate can be selected iron plate, copper coin, corrosion resistant plate etc.Earlier the substrate machining surface is processed, use chemical method to form layer oxide film then on its surface, on the substrate that forms oxide-film, at first carry out chemical plating again, and then electroplate, carry out chemical plating at last again, so just on end liner, formed superthin diamond cutting blade blank ring.Adopt heating to cut into slices then and separate, just obtain required cutting blade through the punching press integer from end liner.
Effective effect that the utility model had is: owing to be no matrix formula section, so can not produce cutting blade and matrix segregation phenomenon in cutting, cutting blade rigidity and intensity are higher, and the life-span is long, and cost is low and processing technology is simple.
Description of drawings:
Accompanying drawing 1: the cutting blade master cutaway view that conventional galvanoplastic are made, 1-matrix among the figure, 2-carcass
Accompanying drawing 2: no matrix formula cutting piece made from diamond master cutaway view
Accompanying drawing 3: no matrix formula cutting piece made from diamond vertical view
Claims (4)
1. a superthin diamond cutting blade is characterized in that: adopt to electroplate to combine with chemical plating, alloy and diamond evenly are mixed into the made no matrix formula cutting blade of one.
2. according to the described cutting blade of claim 1, it is characterized in that: used alloy can be Ni-Co in the cutting blade, Ni-P, alloy materials such as Ni-Mn and single Ni alloy or stainless steel.
3. according to the described cutting blade of claim 1, it is characterized in that: used diamond can be monocrystalline or glomerocryst in the cutting blade.
4. according to the described cutting blade of claim 1, it is characterized in that: the thickness of cutting blade is in the 20-100 mu m range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96222827 CN2279255Y (en) | 1996-08-30 | 1996-08-30 | Ultrathin diamond cutting slice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96222827 CN2279255Y (en) | 1996-08-30 | 1996-08-30 | Ultrathin diamond cutting slice |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2279255Y true CN2279255Y (en) | 1998-04-22 |
Family
ID=33902276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 96222827 Expired - Fee Related CN2279255Y (en) | 1996-08-30 | 1996-08-30 | Ultrathin diamond cutting slice |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2279255Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102009390B (en) * | 2009-09-04 | 2012-08-22 | 沈阳中科超硬磨具磨削研究所 | Electroforming high-precision profiling grinding wheel and preparation process thereof |
| CN112301404A (en) * | 2019-07-30 | 2021-02-02 | 中国有色桂林矿产地质研究院有限公司 | Method for manufacturing ultrathin electroplated diamond cutting blade |
| WO2021097988A1 (en) * | 2019-11-20 | 2021-05-27 | 娄底市安地亚斯电子陶瓷有限公司 | Manufacturing method for hub type electroplating ultrathin diamond cutting disc |
-
1996
- 1996-08-30 CN CN 96222827 patent/CN2279255Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102009390B (en) * | 2009-09-04 | 2012-08-22 | 沈阳中科超硬磨具磨削研究所 | Electroforming high-precision profiling grinding wheel and preparation process thereof |
| CN112301404A (en) * | 2019-07-30 | 2021-02-02 | 中国有色桂林矿产地质研究院有限公司 | Method for manufacturing ultrathin electroplated diamond cutting blade |
| WO2021097988A1 (en) * | 2019-11-20 | 2021-05-27 | 娄底市安地亚斯电子陶瓷有限公司 | Manufacturing method for hub type electroplating ultrathin diamond cutting disc |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |