CN2268902Y - Semiconductory cooling and warming apparatus with water circulating radiation - Google Patents

Semiconductory cooling and warming apparatus with water circulating radiation Download PDF

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Publication number
CN2268902Y
CN2268902Y CN 96200956 CN96200956U CN2268902Y CN 2268902 Y CN2268902 Y CN 2268902Y CN 96200956 CN96200956 CN 96200956 CN 96200956 U CN96200956 U CN 96200956U CN 2268902 Y CN2268902 Y CN 2268902Y
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CN
China
Prior art keywords
cooling
swimming
heating installation
semiconductor
semiconductor refrigerating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 96200956
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Chinese (zh)
Inventor
杨淑丽
孙燕朴
杨建民
王清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SANSI AUTOMATIC CONTROL ENGINEERING Co QINDAO CITY
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SANSI AUTOMATIC CONTROL ENGINEERING Co QINDAO CITY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by SANSI AUTOMATIC CONTROL ENGINEERING Co QINDAO CITY filed Critical SANSI AUTOMATIC CONTROL ENGINEERING Co QINDAO CITY
Priority to CN 96200956 priority Critical patent/CN2268902Y/en
Application granted granted Critical
Publication of CN2268902Y publication Critical patent/CN2268902Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a semiconductory cooling and warming apparatus with water circulating radiation. The working surfaces of existing technical ceramics plate TEC 1 and a semiconductor refrigeration device are tightly attached to a metal cold gathering heat conducting plate. The other surface is attached to a cooling warming apparatus which is composed of a circular water type radiation device. The device which is arranged on the seat cushion and backrest of the drivers of the automobile can be used for the direct current power supply of the automobile to carry out the energy supply. As long as the positive and negative electrodes of the power supply exchange, the cooling can be changed into the warming. The device can be placed in the sofa and the mattress for cooling and warming. The utility model with simple structure can save the energy, and the utility model is the novel and practical cooling and warming apparatus.

Description

Recirculated water heat dissipation type semiconductor refrigerating heating installation
The utility model belongs to the refrigeration heating dual-purpose apparatus that body-care is used, and is applicable to automotive seat, mattress and sofa etc.
At present, be used for human body both at home and abroad and often contact articles for use such as seat cushion, heatings such as the mattress mode of enjoying the cool has many kinds.Under blanket heating as resistance wire heating commonly used in winter, use ice crystal water-cooled seat cushion etc. always in summer, but up to the present, all can only single heating or singlely enjoy the cool, the temperature of especially can not active adjusting enjoying the cool, and can regulate the room conditioning of temperature and the air-conditioning in the automobile, though can regulate temperature, result of use is good, its complex structure, price height, power consumption is big, and the scope of application is restricted.
The utility model purpose provides a kind of mattress that is used for, also can be used for automotive seat cushion, the dual-purpose recirculated water heat dissipation type semiconductor refrigerating heating installation of heating of enjoying the cool of sofa cushion etc., this device can adopt the adjusting operating current directly to regulate temperature, and the face of enjoying the cool when the dc supply both positive and negative polarity oppositely uses will transfer heating face to.
Technical essential of the present utility model is that the working face at prior art product TEC1-12705 (or 12703) earthenware slab type semiconductor temperature difference electricity refrigeration device tightens to connect airtight and touches the poly-cold drawing of a metal heat-conducting, at the tight contact one cover recirculated water heat abstractor of its another side, utilize the heating that realizes enjoying the cool of semiconductor temperature difference electricity refrigeration Peltier effect principle.
Fig. 1 is a recirculated water heat dissipation type semiconductor refrigerating heating installation schematic diagram.
[1] is cushion among the figure, and the cold article of storage are housed in the pad, is used for storage cold-peace cushioning effect, and it is thick Degree is defined as 10mm-40mm, and [2] [3] all are poly-cold heat-conducting plates, and thickness is 0.5mm-Below the 6mm, poly-cold heat-conducting plate [3] be semiconductor cooling device (TEC1-12705 or 12703) [4]; The tight note unification of the lower surface of semiconductor cooling device [4] recirculated water heat abstractor [5], this device comprises water heat conducting sleeve [9], air-cooled radiator [10], and water tank [11], water pump [12] etc., Water-cooled heat conducting sleeve [9] is open-core type, is full of water in the cavity of radiator during work, have into Water pipe and outlet pipe are connected with water pump [12] in the pipe-line system, water tank [11] and air-cooled radiator [10], the forced circulation by water pump [12] is recycled to air-cooled loosing with the heat in the water heat conducting sleeve [9] Hot device [10] distributes. In order to make semiconductor devices directly not bear pressure and vibratory impulse, Be connected a bracing frame [6] with poly-cold heat-conducting plate [2], have one between bracing frame [6] and water heat conducting sleeve [9] Decide the space. In order to make this device that good heat-conductive characteristic be arranged, poly-cold heat-conducting plate [2] [3], Be coated with to use behind the thin layer heat-conducting silicone grease between the parts such as semiconductor cooling device [4], water heat conducting sleeve [9] Screw [7] [8] is tightened to one, in order to reduce the heat between poly-cold heat-conducting plate and the water heat conducting sleeve Conduction, screw preferably selects the low nonmetallic materials of thermal conductivity factor to make.
Below be one of the present utility model and execute example:
At first recirculated water heat dissipation type semiconductor refrigerating heating installation provided by the utility model is installed in each cover on driver's seat cushion and the backrest, wherein circulating water pipe connect shared one the cover heat abstractor [5], air-cooled radiator [10] and water tank [11] are installed in the car steering outdoor, the power supply of semiconductor refrigerating heating device directly uses car direct current power supply to be 12V or 24V, when being used for mattress, the 220V alternating current can be become direct current when seat cushions and sofa cushion, operating voltage is 5V-14V, operating current is 1.5A-5A, and will enjoy the cool to transfer to when warming oneself when needs needs only with power unit oppositely.Pump power is also used car direct current power supply.
4 ℃-15 ℃ of the utility model adjustable low ambient temperatures of when refrigeration, operating voltage adjustable 5 ℃-20 ℃ of the environment temperatures that are higher than of time spent of oppositely warming oneself, it is simple in structure, safe in utilization, the power consumption low, and non-environmental-pollution, can be widely used in seat cushions and sofa, the heating of enjoying the cool of articles for use such as mattress.

Claims (6)

1, a kind of circulation ability of swimming semiconductor refrigerating heating installation, by TEC112705 or 12703 earthenware slab type semiconductor temperature differences electricity refrigeration device [4], the poly-cold drawing [3] [2] of metal heat-conducting, cushion [1], bracing frame formations such as [6], it is characterized in that the lower surface of semiconductor cooling device [4] fits tightly a cover recirculated water heat abstractor [5].
2,, it is characterized in that described recirculated water heat abstractor [5] is made of water heat conduction cover [9], water inlet pipe, outlet pipe, water pump [12], water tank [11], air-cooled radiator [10] by the described circulation ability of swimming of claim [1] semiconductor refrigerating heating installation.
3, by the described circulation ability of swimming of claim [1] semiconductor refrigerating heating installation, it is characterized in that described metal heat-conducting gather to be equipped with on the cold drawing [2] cushion [1] of storing cold article is housed, be used to store the cold-peace cushioning effect.
4, by the described circulation ability of swimming of claim [1] semiconductor refrigerating heating installation, it is characterized in that described semiconductor cooling device [4] when work, DC voltage is 5V-14V, electric current is 1.5A-5A; When being used for automotive seat cushion, directly select car direct current power supply 12V or 24V for use.
5, by the described circulation ability of swimming of claim [1] semiconductor refrigerating heating installation, it is characterized in that described bracing frame [6] has certain space apart from the water heat conduction cover [9] that links together, semiconductor devices [4] etc., make and partly lead device [4] and directly do not bear pressure and vibratory impulse.
6,, it is characterized in that scribbling heat-conducting silicone grease between the contact-making surface of described poly-cold heat-conducting plate [2] [3], semiconductor cooling device [4], water heat conduction cover [9] by the described circulation ability of swimming of claim [1] semiconductor refrigerating heating installation.
CN 96200956 1996-01-04 1996-01-04 Semiconductory cooling and warming apparatus with water circulating radiation Expired - Fee Related CN2268902Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 96200956 CN2268902Y (en) 1996-01-04 1996-01-04 Semiconductory cooling and warming apparatus with water circulating radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 96200956 CN2268902Y (en) 1996-01-04 1996-01-04 Semiconductory cooling and warming apparatus with water circulating radiation

Publications (1)

Publication Number Publication Date
CN2268902Y true CN2268902Y (en) 1997-11-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 96200956 Expired - Fee Related CN2268902Y (en) 1996-01-04 1996-01-04 Semiconductory cooling and warming apparatus with water circulating radiation

Country Status (1)

Country Link
CN (1) CN2268902Y (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004063643A1 (en) * 2003-01-13 2004-07-29 Qinghua Wang A thermoelectric cooling device
CN100427850C (en) * 2002-08-07 2008-10-22 菲尼克斯咨询有限公司 Temperature regulated clothing
CN100447503C (en) * 2002-12-30 2008-12-31 Bsh博世和西门子家用器具有限公司 Auxiliary cooling device
CN103142217A (en) * 2013-03-13 2013-06-12 江西师范大学 Electronic body temperature monitor
CN106679229A (en) * 2017-02-16 2017-05-17 山东大学 Auxiliary vapor compression refrigeration system for semiconductor refrigeration driven by solar photovoltaic power generation
CN108488891A (en) * 2018-02-02 2018-09-04 清华大学 A kind of flat-plate heat pipe heating end of combination semiconductor
CN112178748A (en) * 2020-10-09 2021-01-05 徐松 Electric heating device using semiconductor ceramic

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100427850C (en) * 2002-08-07 2008-10-22 菲尼克斯咨询有限公司 Temperature regulated clothing
CN100447503C (en) * 2002-12-30 2008-12-31 Bsh博世和西门子家用器具有限公司 Auxiliary cooling device
WO2004063643A1 (en) * 2003-01-13 2004-07-29 Qinghua Wang A thermoelectric cooling device
CN103142217A (en) * 2013-03-13 2013-06-12 江西师范大学 Electronic body temperature monitor
CN106679229A (en) * 2017-02-16 2017-05-17 山东大学 Auxiliary vapor compression refrigeration system for semiconductor refrigeration driven by solar photovoltaic power generation
CN108488891A (en) * 2018-02-02 2018-09-04 清华大学 A kind of flat-plate heat pipe heating end of combination semiconductor
CN112178748A (en) * 2020-10-09 2021-01-05 徐松 Electric heating device using semiconductor ceramic

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