CN221689051U - Circuit board support structure and heat pump water heater - Google Patents
Circuit board support structure and heat pump water heater Download PDFInfo
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- CN221689051U CN221689051U CN202322871370.XU CN202322871370U CN221689051U CN 221689051 U CN221689051 U CN 221689051U CN 202322871370 U CN202322871370 U CN 202322871370U CN 221689051 U CN221689051 U CN 221689051U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 37
- 230000000712 assembly Effects 0.000 claims description 16
- 238000000429 assembly Methods 0.000 claims description 16
- 239000000243 solution Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002452 interceptive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
Description
技术领域Technical Field
本实用新型属于热水器技术领域,具体地说,涉及一种电路板支撑结构及热泵热水器。The utility model belongs to the technical field of water heaters, and in particular relates to a circuit board supporting structure and a heat pump water heater.
背景技术Background Art
目前家电的电路板需要设置固定支撑结构进行支撑。例如,热泵热水器的WiFi电路板安装在内衬件上,安装采用卡扣+螺钉的固定方式,固定支撑结构上需要设置与待支撑电路板相匹配的支撑限位等结构以及开设相对应的固定螺孔,因此,一种固定支撑结构只能承载单一规格的电路板,其通用性低。At present, the circuit boards of household appliances need to be supported by fixed support structures. For example, the WiFi circuit board of the heat pump water heater is installed on the lining, and the installation adopts the fixing method of buckle + screw. The fixed support structure needs to be provided with support limiter and other structures matching the circuit board to be supported, and corresponding fixing screw holes. Therefore, a fixed support structure can only carry circuit boards of a single specification, and its versatility is low.
当家电所采用的电路板规格变化时,需要重新开模制造相对应的固定支撑结构,导致增加生产成本,而且由于型号规格多,带来管理成本。When the specifications of the circuit boards used in home appliances change, it is necessary to re-mold and manufacture the corresponding fixed support structure, which increases production costs. In addition, due to the large number of models and specifications, management costs are incurred.
还有一些家电产品由于升级或者电路板的供货等问题,需要新增加电路板,也即电路板的数量增加,若所有电路板均采用平铺在固定支撑结构上,会导致增加固定支撑结构相应的面积,进而增加固定支撑结构在家电产品上的占用空间,浪费工料的同时,导致电器笨重。In addition, some home appliances need to add new circuit boards due to upgrades or circuit board supply issues, that is, the number of circuit boards increases. If all circuit boards are laid flat on the fixed support structure, the corresponding area of the fixed support structure will increase, and then the space occupied by the fixed support structure on the home appliance will increase, wasting labor and materials and making the appliance bulky.
本背景技术所公开的上述信息仅仅用于增加对本申请背景技术的理解,因此,其可能包括不构成本领域普通技术人员已知的现有技术。The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field.
发明内容Summary of the invention
本实用新型针对现有技术中电器产品的电路板支撑结构只能承载单一规格的电路板,其通用性低,以及当设置多个电路板时导致增加占用面积的技术问题,提出了一种电路板支撑结构,可以解决上述问题。The utility model aims at the technical problems that the circuit board support structure of the electrical product in the prior art can only carry circuit boards of a single specification, has low versatility, and increases the occupied area when multiple circuit boards are set. The utility model proposes a circuit board support structure that can solve the above problems.
为实现上述实用新型目的,本实用新型采用下述技术方案予以实现:In order to achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:
一种电路板支撑结构,包括底座,所述底座上形成有:A circuit board support structure comprises a base, on which is formed:
第一支撑部,其具有多个,用于支撑第一电路板,多个所述第一支撑部布设在第一电路板朝向所述底座的正投影面上;A first supporting portion, which has a plurality of parts and is used to support a first circuit board, wherein the plurality of first supporting portions are arranged on an orthographic projection surface of the first circuit board toward the base;
第二支撑部,其具有多个,用于支撑第二电路板,多个所述第二支撑部布设在第二电路板朝向所述底座的正投影面上,且所述第二支撑部避让开所述第一电路板朝向所述底座的正投影面,且该两个台阶面第二支撑部的支撑面高于第一支撑部的支撑面。The second supporting part has multiple parts for supporting the second circuit board. The multiple second supporting parts are arranged on the orthographic projection surface of the second circuit board toward the base, and the second supporting parts avoid the orthographic projection surface of the first circuit board toward the base, and the supporting surfaces of the second supporting parts with two step surfaces are higher than the supporting surfaces of the first supporting parts.
在有的实施例中,所述第一支撑部和第二支撑部为一体成型设置,多个由第一支撑部和第二支撑部组成的组合体沿着电路板的一周方向布设,且所述第一支撑部位于朝向组合体所围空间的一侧,所述第二支撑部位于背向组合体所围空间的一侧。In some embodiments, the first support portion and the second support portion are integrally formed, and a plurality of assemblies consisting of the first support portion and the second support portion are arranged along a circumferential direction of the circuit board, and the first support portion is located on a side facing the space enclosed by the assembly, and the second support portion is located on a side facing away from the space enclosed by the assembly.
在有的实施例中,所述组合体为长条状结构,所述长条状结构在平行于电路板的长度或者宽度的方向上延伸,所述长条状结构的顶面形成有两个台阶面,该两个台阶面之间通过第一连接边连接,分别为第二支撑部的支撑面和第一支撑部的支撑面。In some embodiments, the combination is a long strip structure, which extends in a direction parallel to the length or width of the circuit board. Two step surfaces are formed on the top surface of the long strip structure, and the two step surfaces are connected by a first connecting edge, which are the support surface of the second support part and the support surface of the first support part respectively.
在有的实施例中,所述组合体为卧置的U形槽状结构,且所述U形槽状结构的开口朝向组合体所围空间,所述U形槽状结构的槽壁顶面形成有两个台阶面,分别为第二支撑部的支撑面和第一支撑部的支撑面。In some embodiments, the combination is a horizontal U-shaped trough structure, and the opening of the U-shaped trough structure faces the space enclosed by the combination, and the top surface of the trough wall of the U-shaped trough structure is formed with two step surfaces, which are the support surface of the second support part and the support surface of the first support part respectively.
在有的实施例中,所述电路板支撑结构还包括第一限位部,用于对第一电路板限位,所述第一限位部包括:In some embodiments, the circuit board support structure further includes a first limiting portion for limiting the position of the first circuit board, and the first limiting portion includes:
第一挡板,其具有一个或者多个,所述第一挡板沿竖向固定在所述底座上,用于对第一电路板在横向限位,所述第一挡板的内侧壁与其所邻近的第一连接边位于同一竖直平面上,所述第一挡板的上表面不高于所述第二支撑部的支撑面;a first baffle, which has one or more first baffles, which are vertically fixed to the base and are used to limit the first circuit board in the lateral direction, wherein the inner side wall of the first baffle and the first connecting edge adjacent to the first baffle are located on the same vertical plane, and the upper surface of the first baffle is not higher than the supporting surface of the second supporting portion;
第一压板,其具有一个或者多个,所述第一压板沿横向固定在所述底座上,用于对第一电路板在竖向限位,所述第一压板的下表面与所述第一支撑部的支撑面之间的垂直距离不小于第一电路板的厚度,且所述第一压板的上表面不高于所述第二支撑部的支撑面,第一电路板限位在所述第一压板和第一支撑部的支撑面之间。The first pressing plate has one or more first pressing plates, which are laterally fixed on the base and are used to limit the first circuit board in the vertical direction. The vertical distance between the lower surface of the first pressing plate and the supporting surface of the first supporting part is not less than the thickness of the first circuit board, and the upper surface of the first pressing plate is not higher than the supporting surface of the second supporting part. The first circuit board is limited between the first pressing plate and the supporting surface of the first supporting part.
在有的实施例中,当位于第一电路板的同一侧具有多个组合体和第一挡板时,该多个组合体和第一挡板交错布设。In some embodiments, when there are a plurality of assemblies and first baffles on the same side of the first circuit board, the plurality of assemblies and the first baffles are arranged alternately.
在有的实施例中,所述第一压板与所述第一挡板相对设置在第一电路板的两侧。In some embodiments, the first pressing plate and the first baffle are arranged on two sides of the first circuit board opposite to each other.
在有的实施例中,所述电路板支撑结构还包括第二限位部,用于对第二电路板限位,所述第二限位部包括:In some embodiments, the circuit board support structure further includes a second limiting portion for limiting the position of the second circuit board, and the second limiting portion includes:
第二挡板,其具有一个或者多个,所述第二挡板沿竖向固定在所述底座上,用于对第二电路板在横向限位,所述第二挡板的上表面不高于所述第二支撑部的支撑面;A second baffle, which has one or more, the second baffle is vertically fixed to the base, and is used to limit the second circuit board in the lateral direction, and the upper surface of the second baffle is not higher than the supporting surface of the second supporting part;
第二压板,其具有一个或者多个,所述第二压板沿横向固定在所述底座上,用于对第二电路板在竖向限位,所述第二压板的下表面与所述第二支撑部的支撑面之间的垂直距离不小于第二电路板的厚度,第二电路板限位在所述第二压板和第二支撑部的支撑面之间。The second pressing plate has one or more second pressing plates, which are laterally fixed on the base and are used to limit the second circuit board in the vertical direction. The vertical distance between the lower surface of the second pressing plate and the supporting surface of the second supporting part is not less than the thickness of the second circuit board, and the second circuit board is limited between the supporting surfaces of the second pressing plate and the second supporting part.
在有的实施例中,所述电路板支撑结构还包括限位支撑部,其沿竖向固定在所述底座上,所述限位支撑部呈L状结构,所述L状结构的其中一侧壁上形成有支撑台阶,所述支撑台阶的台阶面与所述第二支撑部的支撑面位于同一平面上,用于支撑第二电路板,且第二电路板的侧壁与所述支撑台阶的竖边相抵接。In some embodiments, the circuit board support structure also includes a limiting support portion, which is vertically fixed on the base, and the limiting support portion is an L-shaped structure. A supporting step is formed on one of the side walls of the L-shaped structure, and the step surface of the supporting step and the supporting surface of the second supporting portion are located on the same plane for supporting the second circuit board, and the side wall of the second circuit board abuts against the vertical side of the supporting step.
在有的实施例中,所述电路板支撑结构还包括固定柱,其顶部开设有与第一电路板和/或第二电路板上的固定孔相对应的内螺孔,螺钉穿过第一电路板和/或第二电路板上的固定孔与所述内螺孔固定。In some embodiments, the circuit board support structure also includes a fixing column, a top of which is provided with an internal screw hole corresponding to the fixing hole on the first circuit board and/or the second circuit board, and a screw passes through the fixing hole on the first circuit board and/or the second circuit board and is fixed to the internal screw hole.
本实用新型同时提出了一种热泵热水器,其包括第一电路板和/或第二电路板,所述热泵热水器还包括前面任一条所记载的电路板支撑结构。The utility model also proposes a heat pump water heater, which comprises a first circuit board and/or a second circuit board. The heat pump water heater also comprises any circuit board supporting structure described in the above items.
与现有技术相比,本实用新型的优点和积极效果是:Compared with the prior art, the advantages and positive effects of the utility model are:
本实用新型的电路板支撑结构,通过在底座上设置第一支撑部和第二支撑部,能够分别用于支撑两种规格的电路板,且该两个电路板可同时设置,能够满足设置单个电路板和同时设置两个电路板的方案,解决了在不新开模具的情况下,增加了装配电路板的数量及种类。充分利用了底座的竖向空间,能够同时支撑两个电路板,并未增加对底座的平面空间的占用,节省空间。The circuit board support structure of the utility model can be used to support two specifications of circuit boards respectively by setting the first support part and the second support part on the base, and the two circuit boards can be set at the same time, which can meet the solution of setting a single circuit board and setting two circuit boards at the same time, and solves the problem of increasing the number and types of assembled circuit boards without opening a new mold. The vertical space of the base is fully utilized, and two circuit boards can be supported at the same time, and the occupation of the plane space of the base is not increased, saving space.
结合附图阅读本实用新型的具体实施方式后,本实用新型的其他特点和优点将变得更加清楚。After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本实用新型实施例中的技术方案,下面将对实施例中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention, a brief introduction will be given below to the drawings required for use in the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
图1 是本实用新型提出的电路板支撑结构的一种实施例的平面结构示意图;FIG1 is a schematic diagram of a planar structure of an embodiment of a circuit board support structure proposed by the present invention;
图2 是本实用新型提出的电路板支撑结构的一种实施例的结构示意图;FIG2 is a schematic structural diagram of an embodiment of a circuit board support structure proposed by the present invention;
图3是本实用新型提出的电路板支撑结构的一种实施例的与电路板装配状态的分解图;FIG3 is an exploded view of an embodiment of a circuit board support structure provided by the present invention and a circuit board assembly state;
图4 是本实用新型提出的电路板支撑结构的一种实施例中第一电路板的装配状态示意图;FIG4 is a schematic diagram of an assembled state of a first circuit board in an embodiment of a circuit board support structure proposed by the present invention;
图5 是本实用新型提出的电路板支撑结构的一种实施例中第二电路板的装配状态示意图;FIG5 is a schematic diagram of an assembled state of a second circuit board in an embodiment of a circuit board support structure provided by the present invention;
图6是本实用新型提出的电路板支撑结构的一种实施例中组合体的其中一种形态的结构示意图;FIG6 is a schematic structural diagram of one form of a combination body in one embodiment of a circuit board support structure provided by the present invention;
图7是本实用新型提出的电路板支撑结构的一种实施例中组合体的另外一种形态的结构示意图;FIG7 is a schematic structural diagram of another form of an assembly in one embodiment of a circuit board support structure provided by the present invention;
图8是本实用新型提出的电路板支撑结构的一种实施例中限位支撑部的结构示意图。FIG. 8 is a schematic structural diagram of a position limiting support portion in an embodiment of a circuit board support structure provided by the present invention.
具体实施方式DETAILED DESCRIPTION
为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
需要说明的是,在本实用新型的描述中,术语“上”、“下”、“左”、“右”、“竖”、“横”、“内”、“外”等指示的方向或位置关系的术语是基于附图所示的方向或位置关系,这仅仅是为了便于描述,而不是指示或暗示所述装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性。在本实用新型的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。It should be noted that, in the description of the present invention, the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are merely for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.
在本实用新型中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本实用新型中的具体含义。In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
实施例一Embodiment 1
本实施例提出了一种电路板支撑结构,如图1-图6所示,包括底座4,底座4上形成有第一支撑部11和第二支撑部12,其中,第一支撑部11具有多个,该多个第一支撑部11用于支撑第一电路板2,多个第一支撑部11布设在第一电路板2朝向底座4的正投影面上。This embodiment proposes a circuit board support structure, as shown in Figures 1 to 6, including a base 4, on which a first support portion 11 and a second support portion 12 are formed, wherein the first support portion 11 has multiple first support portions 11, and the multiple first support portions 11 are used to support the first circuit board 2, and the multiple first support portions 11 are arranged on the positive projection surface of the first circuit board 2 facing the base 4.
第二支撑部12具有多个,用于支撑第二电路板3,多个第二支撑部12布设在第二电路板3朝向底座4的正投影面上,且第二支撑部12避让开第一电路板2朝向底座的正投影面,第一电路板2朝向底座的正投影面落入在第二电路板3朝向底座4的正投影面中,第二支撑部12的支撑面高于第一支撑部11的支撑面。There are multiple second support parts 12 for supporting the second circuit board 3. The multiple second support parts 12 are arranged on the orthographic projection surface of the second circuit board 3 toward the base 4, and the second support parts 12 avoid the orthographic projection surface of the first circuit board 2 toward the base. The orthographic projection surface of the first circuit board 2 toward the base falls into the orthographic projection surface of the second circuit board 3 toward the base 4. The support surface of the second support part 12 is higher than the support surface of the first support part 11.
本实施例的电路板支撑结构,通过在底座4上设置第一支撑部11和第二支撑部12,能够分别用于支撑两种规格的电路板,且该两个电路板可同时设置,能够满足设置单个电路板和同时设置两个电路板的装配方案,解决了在不新开模具的前提下,增加了能够装配电路板的数量及种类。The circuit board support structure of the present embodiment can be used to support circuit boards of two specifications respectively by arranging the first support portion 11 and the second support portion 12 on the base 4, and the two circuit boards can be arranged at the same time, which can meet the assembly solutions of setting a single circuit board and setting two circuit boards at the same time, and solves the problem of increasing the number and types of circuit boards that can be assembled without opening a new mold.
当同时设置两个电路板时,将两个电路板进行高低搭配设置,分利用了底座4的竖向空间,能够同时支撑两个电路板,并未增加对底座4的平面空间的占用,节省空间。When two circuit boards are arranged at the same time, the two circuit boards are arranged in a high and low arrangement, and the vertical space of the base 4 is fully utilized. The two circuit boards can be supported at the same time without increasing the occupancy of the plane space of the base 4, thus saving space.
一般情况下底座4由模具注塑制作而成,为了方便制作,减小开模成本,在有的实施例中,如图1、图6所示,第一支撑部11和第二支撑部12为一体成型设置,能够减少模具上对应的部件的数量。Generally, the base 4 is made by injection molding. In order to facilitate the production and reduce the mold opening cost, in some embodiments, as shown in Figures 1 and 6, the first support part 11 and the second support part 12 are integrally formed, which can reduce the number of corresponding parts on the mold.
多个由第一支撑部11和第二支撑部12组成的组合体沿着电路板的一周方向布设,且第一支撑部11位于朝向组合体所围空间的一侧,第二支撑部12位于背向组合体所围空间的一侧。具体而言,组合体的布设方式应当满足第一支撑部11沿着第一电路板2一周的方向,第二支撑部12沿着第二电路板3一周的方向,进而能够起到分别支撑第一电路板2和第二电路板3的作用,同时可以起到防止第二支撑部12对第一电路板造成干涉的作用。A plurality of assemblies consisting of first support portions 11 and second support portions 12 are arranged along the circumference of the circuit board, and the first support portions 11 are located on the side facing the space enclosed by the assemblies, and the second support portions 12 are located on the side facing away from the space enclosed by the assemblies. Specifically, the arrangement of the assemblies should satisfy the requirement that the first support portions 11 are along the circumference of the first circuit board 2, and the second support portions 12 are along the circumference of the second circuit board 3, so as to support the first circuit board 2 and the second circuit board 3 respectively, and prevent the second support portions 12 from interfering with the first circuit board.
第一电路板2和第二电路板3一般为矩形的板状结构,在有的实施例中,组合体可以为如图1、图2中所示的长条状结构1a,该长条状结构1a在平行于电路板(第一电路板2或者第二电路板3)的长度或者宽度的方向上延伸,长条状结构1a的顶面形成有两个台阶面,分别为第一台阶面111和第二台阶面121,第一台阶面111和第二台阶面121之间通过第一连接边112连接,第一台阶面111为第一支撑部11的支撑面,第一电路板2支撑在第一台阶面111上,第二台阶面121为第二支撑部12的支撑面,第二电路板3支撑在第二台阶面121上。The first circuit board 2 and the second circuit board 3 are generally rectangular plate structures. In some embodiments, the combination can be a long strip structure 1a as shown in Figures 1 and 2, which extends in a direction parallel to the length or width of the circuit board (the first circuit board 2 or the second circuit board 3), and two step surfaces are formed on the top surface of the long strip structure 1a, namely the first step surface 111 and the second step surface 121. The first step surface 111 and the second step surface 121 are connected by a first connecting edge 112. The first step surface 111 is the supporting surface of the first supporting portion 11, and the first circuit board 2 is supported on the first step surface 111. The second step surface 121 is the supporting surface of the second supporting portion 12, and the second circuit board 3 is supported on the second step surface 121.
在有的实施例中,组合体还可以为如图1、图7中所示的横卧设置的U形槽状结构1b,且U形槽状结构1b的开口朝向组合体所围空间,U形槽状结构1b的两侧槽壁竖向固定在底座4上,U形槽状结构1b的槽壁顶面形成有两个台阶面,分别为第一台阶面111和第二台阶面121,分别作为第一支撑部11的支撑面和第二支撑部12的支撑面,起到支撑第一电路板2和第二电路板3的作用。第一支撑部11和第二支撑部12采用U形槽状结构的组合方式,可以在一个组合体上同时形成两条第一台阶面111以及一个U形的第二台阶面121,能够增加对电路板的支撑面积,提高支撑的稳固性。In some embodiments, the assembly can also be a U-shaped groove structure 1b disposed horizontally as shown in FIG. 1 and FIG. 7, and the opening of the U-shaped groove structure 1b faces the space enclosed by the assembly, and the groove walls on both sides of the U-shaped groove structure 1b are vertically fixed on the base 4, and the top surface of the groove wall of the U-shaped groove structure 1b is formed with two step surfaces, namely, a first step surface 111 and a second step surface 121, which serve as the support surface of the first support portion 11 and the support surface of the second support portion 12, respectively, to support the first circuit board 2 and the second circuit board 3. The first support portion 11 and the second support portion 12 adopt a combination of U-shaped groove structures, and two first step surfaces 111 and a U-shaped second step surface 121 can be formed on a single assembly at the same time, which can increase the support area for the circuit board and improve the stability of the support.
在有的实施例中,电路板支撑结构还包括第一限位部,用于对第一电路板2限位,如图1、图2所示,第一限位部包括第一挡板131和第一压板132,其中,第一挡板131具有一个或者多个,第一挡板131沿竖向固定在底座4上,用于对第一电路板2在横向限位,第一挡板131的内侧壁与其所邻近的第一连接边112位于同一竖直平面上,第一挡板131的上表面不高于第二支撑部12的支撑面。第一挡板131的内侧壁是指第一挡板131朝向组合体所围挡空间的一侧壁。第一电路板2支撑在第一支撑部11的支撑面上之后,其侧边沿与第一挡板131的内侧壁和第一连接边112相抵接,进而起到对第一电路板2在横向限位的作用。In some embodiments, the circuit board support structure further includes a first limiting portion for limiting the position of the first circuit board 2. As shown in FIG. 1 and FIG. 2, the first limiting portion includes a first baffle 131 and a first pressure plate 132, wherein the first baffle 131 has one or more, and the first baffle 131 is vertically fixed on the base 4, and is used to limit the first circuit board 2 in the lateral direction. The inner side wall of the first baffle 131 and the first connecting edge 112 adjacent to it are located on the same vertical plane, and the upper surface of the first baffle 131 is not higher than the supporting surface of the second supporting portion 12. The inner side wall of the first baffle 131 refers to a side wall of the space enclosed by the first baffle 131 toward the assembly. After the first circuit board 2 is supported on the supporting surface of the first supporting portion 11, its side edge abuts against the inner side wall of the first baffle 131 and the first connecting edge 112, thereby playing a role in limiting the first circuit board 2 in the lateral direction.
第一压板132具有一个或者多个,第一压板132沿横向固定在底座4上,用于对第一电路板2在竖向限位。具体而言,如图2所示,底座4包括底壁41和与底壁41固定的挡框42,第一挡板131等沿竖向设置的结构件实际是与底壁41固定,第一压板132与挡框42固定,实现其能够沿横向设置。The first pressing plate 132 has one or more first pressing plates 132, which are fixed on the base 4 in the horizontal direction, and are used to limit the vertical position of the first circuit board 2. Specifically, as shown in FIG. 2 , the base 4 includes a bottom wall 41 and a stop frame 42 fixed to the bottom wall 41, and the first stop plate 131 and other structural members arranged vertically are actually fixed to the bottom wall 41, and the first pressing plate 132 is fixed to the stop frame 42, so that it can be arranged in the horizontal direction.
第一电路板2位于第一压板132和第一支撑部11的支撑面之间,第一压板132的下表面与第一支撑部11的支撑面之间的垂直距离不小于第一电路板2的厚度,且第一压板132的上表面不高于第二支撑部12的支撑面,以避免第一压板132对第二电路板3造成干涉。第一电路板2限位在第一压板132和第一支撑部11的支撑面之间,起到对其竖向限位的作用。The first circuit board 2 is located between the first pressing plate 132 and the supporting surface of the first supporting portion 11, the vertical distance between the lower surface of the first pressing plate 132 and the supporting surface of the first supporting portion 11 is not less than the thickness of the first circuit board 2, and the upper surface of the first pressing plate 132 is not higher than the supporting surface of the second supporting portion 12, so as to avoid the first pressing plate 132 from interfering with the second circuit board 3. The first circuit board 2 is limited between the first pressing plate 132 and the supporting surface of the first supporting portion 11, which plays a role in limiting its vertical position.
在有的实施例中,当位于第一电路板2的同一侧具有多个组合体和第一挡板131时,该多个组合体和第一挡板131交错布设。In some embodiments, when there are a plurality of assemblies and the first baffle 131 on the same side of the first circuit board 2 , the plurality of assemblies and the first baffle 131 are arranged alternately.
在有的实施例中,第一压板132与第一挡板131相对设置在第一电路板2的两侧,方便装配第一电路板2。In some embodiments, the first pressing plate 132 and the first baffle plate 131 are disposed opposite to each other on two sides of the first circuit board 2 to facilitate assembly of the first circuit board 2 .
第一压板132与第一挡板131配合第一支撑部11的支撑,起到稳固支撑固定第一电路板2的作用。The first pressing plate 132 and the first baffle plate 131 cooperate with the support of the first supporting portion 11 to firmly support and fix the first circuit board 2 .
在有的实施例中,电路板支撑结构还包括第二限位部,用于对第二电路板3限位,第二限位部包括第二挡板141和第二压板142。第二挡板141具有一个或者多个,第二挡板141沿竖向固定在底座4上,用于对第二电路板4在横向限位,第二挡板141的上表面不高于第二支撑部12的支撑面,以放置对第二电路板4造成干涉。In some embodiments, the circuit board support structure further includes a second limiting portion for limiting the position of the second circuit board 3, and the second limiting portion includes a second baffle 141 and a second pressure plate 142. The second baffle 141 has one or more, and the second baffle 141 is vertically fixed on the base 4, and is used to limit the position of the second circuit board 4 in the lateral direction. The upper surface of the second baffle 141 is not higher than the supporting surface of the second supporting portion 12 to prevent interference with the second circuit board 4.
第二压板142具有一个或者多个,第二压板142沿横向固定在底座4上,用于对第二电路板3在竖向限位,第二电路板3位于第二压板142第二支撑部12的支撑面之间,第二压板142的下表面与第二支撑部12的支撑面之间的垂直距离不小于第二电路板3的厚度,第二电路板3限位在第二压板142和第二支撑部12的支撑面之间。The second pressing plate 142 has one or more second pressing plates 142, which are laterally fixed on the base 4 and are used to limit the second circuit board 3 in the vertical direction. The second circuit board 3 is located between the supporting surfaces of the second pressing plate 142 and the second supporting portion 12. The vertical distance between the lower surface of the second pressing plate 142 and the supporting surface of the second supporting portion 12 is not less than the thickness of the second circuit board 3. The second circuit board 3 is limited between the supporting surfaces of the second pressing plate 142 and the second supporting portion 12.
在有的实施例中,第二压板142与第二挡板141相对设置在第二电路板3的两侧,方便装配第二电路板3。In some embodiments, the second pressing plate 142 and the second baffle plate 141 are disposed opposite to each other on two sides of the second circuit board 3 , so as to facilitate the assembly of the second circuit board 3 .
第二压板142与第二挡板141配合第二支撑部12的支撑,起到稳固支撑固定第二电路板3的作用。The second pressing plate 142 and the second baffle plate 141 cooperate with the support of the second supporting portion 12 to firmly support and fix the second circuit board 3 .
在有的实施例中,如图1、图2、图8所示,电路板支撑结构还包括限位支撑部15,其沿竖向固定在底座4上,限位支撑部15呈L状结构,L状结构的其中一侧壁上形成有支撑台阶,支撑台阶的台阶面151与第二支撑部12的支撑面位于同一平面上,用于与第二支撑部12的支撑面共同配合支撑第二电路板3,且第二电路板3的侧壁与支撑台阶的竖边152相抵接,竖边152起到对第二电路板3横向限位的作用。In some embodiments, as shown in Figures 1, 2, and 8, the circuit board support structure also includes a limiting support portion 15, which is vertically fixed on the base 4, and the limiting support portion 15 is an L-shaped structure. A supporting step is formed on one of the side walls of the L-shaped structure, and the step surface 151 of the supporting step is located on the same plane as the supporting surface of the second supporting portion 12, and is used to cooperate with the supporting surface of the second supporting portion 12 to support the second circuit board 3, and the side wall of the second circuit board 3 is in contact with the vertical side 152 of the supporting step, and the vertical side 152 serves to limit the second circuit board 3 laterally.
在有的实施例中,电路板支撑结构还包括固定柱16,其顶部开设有与第一电路板2和/或第二电路板3上的固定孔(图中未示出)相对应的内螺孔161,螺钉穿过第一电路板2和/或第二电路板3上的固定孔与内螺孔161固定,实现将第一电路板2和/或第二电路板3与底座4的固定。In some embodiments, the circuit board support structure also includes a fixing column 16, a top of which is provided with an internal screw hole 161 corresponding to a fixing hole (not shown in the figure) on the first circuit board 2 and/or the second circuit board 3, and a screw passes through the fixing hole on the first circuit board 2 and/or the second circuit board 3 and is fixed to the internal screw hole 161, thereby fixing the first circuit board 2 and/or the second circuit board 3 to the base 4.
实施例二Embodiment 2
本实施例提出了一种热泵热水器,如图3所示,其包括第一电路板2或第二电路板3,也可以同时包括第一电路板2和第二电路板3,该热泵热水器还包括电路板支撑结构,第一电路板2和/或第二电路板3固定设置在电路板支撑结构上。This embodiment proposes a heat pump water heater, as shown in Figure 3, which includes a first circuit board 2 or a second circuit board 3, and may also include the first circuit board 2 and the second circuit board 3 at the same time. The heat pump water heater also includes a circuit board support structure, and the first circuit board 2 and/or the second circuit board 3 are fixedly arranged on the circuit board support structure.
如图1-图8所示,电路板支撑结构包括底座4,底座4上形成有第一支撑部11和第二支撑部12,其中,第一支撑部11具有多个,该多个第一支撑部11用于支撑第一电路板2,多个第一支撑部11布设在第一电路板2朝向底座4的正投影面上。As shown in Figures 1 to 8, the circuit board support structure includes a base 4, on which a first support portion 11 and a second support portion 12 are formed, wherein the first support portion 11 has multiple first support portions 11, and the multiple first support portions 11 are used to support the first circuit board 2, and the multiple first support portions 11 are arranged on the positive projection surface of the first circuit board 2 facing the base 4.
第二支撑部12具有多个,用于支撑第二电路板3,多个第二支撑部12布设在第二电路板3朝向底座4的正投影面上,且第二支撑部12避让开第一电路板2朝向底座的正投影面,第一电路板2朝向底座的正投影面落入在第二电路板3朝向底座4的正投影面中,第二支撑部12的支撑面高于第一支撑部11的支撑面。There are multiple second support parts 12 for supporting the second circuit board 3. The multiple second support parts 12 are arranged on the orthographic projection surface of the second circuit board 3 toward the base 4, and the second support parts 12 avoid the orthographic projection surface of the first circuit board 2 toward the base. The orthographic projection surface of the first circuit board 2 toward the base falls into the orthographic projection surface of the second circuit board 3 toward the base 4. The support surface of the second support part 12 is higher than the support surface of the first support part 11.
本实施例的电路板支撑结构,通过在底座4上设置第一支撑部11和第二支撑部12,能够分别用于支撑两种规格的电路板,且该两个电路板可同时设置,能够满足设置单个电路板和同时设置两个电路板的装配方案,解决了在不新开模具的前提下,增加了能够装配电路板的数量及种类。The circuit board support structure of the present embodiment can be used to support circuit boards of two specifications respectively by arranging the first support portion 11 and the second support portion 12 on the base 4, and the two circuit boards can be arranged at the same time, which can meet the assembly solutions of setting a single circuit board and setting two circuit boards at the same time, and solves the problem of increasing the number and types of circuit boards that can be assembled without opening a new mold.
当同时设置两个电路板时,将两个电路板进行高低搭配设置,分利用了底座4的竖向空间,能够同时支撑两个电路板,并未增加对底座4的平面空间的占用,节省空间。When two circuit boards are arranged at the same time, the two circuit boards are arranged in a high and low arrangement, and the vertical space of the base 4 is fully utilized. The two circuit boards can be supported at the same time without increasing the occupancy of the plane space of the base 4, thus saving space.
一般情况下底座4由模具注塑制作而成,为了方便制作,减小开模成本,在有的实施例中,第一支撑部11和第二支撑部12为一体成型设置,能够减少模具上对应的部件的数量。Generally, the base 4 is made by injection molding. To facilitate manufacturing and reduce mold opening costs, in some embodiments, the first support portion 11 and the second support portion 12 are integrally formed, which can reduce the number of corresponding components on the mold.
多个由第一支撑部11和第二支撑部12组成的组合体沿着电路板的一周方向布设,且第一支撑部11位于朝向组合体所围空间的一侧,第二支撑部12位于背向组合体所围空间的一侧。具体而言,组合体的布设方式应当满足第一支撑部11沿着第一电路板2一周的方向,第二支撑部12沿着第二电路板3一周的方向,进而能够起到分别支撑第一电路板2和第二电路板3的作用,同时可以起到防止第二支撑部12对第一电路板造成干涉的作用。A plurality of assemblies consisting of first support portions 11 and second support portions 12 are arranged along the circumference of the circuit board, and the first support portions 11 are located on the side facing the space enclosed by the assemblies, and the second support portions 12 are located on the side facing away from the space enclosed by the assemblies. Specifically, the arrangement of the assemblies should satisfy the requirement that the first support portions 11 are along the circumference of the first circuit board 2, and the second support portions 12 are along the circumference of the second circuit board 3, so as to support the first circuit board 2 and the second circuit board 3 respectively, and prevent the second support portions 12 from interfering with the first circuit board.
以上实施例仅用以说明本实用新型的技术方案,而非对其进行限制;尽管参照前述实施例对本实用新型进行了详细的说明,对于本领域的普通技术人员来说,依然可以对前述实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或替换,并不使相应技术方案的本质脱离本实用新型所要求保护的技术方案的精神和范围。The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for a person skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to replace some of the technical features therein by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present invention.
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