CN221630163U - Silicon wafer drying furnace - Google Patents
Silicon wafer drying furnace Download PDFInfo
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- CN221630163U CN221630163U CN202322873786.5U CN202322873786U CN221630163U CN 221630163 U CN221630163 U CN 221630163U CN 202322873786 U CN202322873786 U CN 202322873786U CN 221630163 U CN221630163 U CN 221630163U
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- 238000001035 drying Methods 0.000 title claims abstract description 77
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 49
- 239000010703 silicon Substances 0.000 title claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The utility model discloses a silicon wafer drying furnace, which comprises a drying furnace body and square tubes, wherein square tubes are fixed at the inner furnace wall of the drying furnace body, and the drying furnace also comprises a side flow guide mechanism, wherein the side flow guide mechanism comprises a guide hole, a wind inlet pipe, a mounting ring, a main wind guide pipe, an auxiliary wind guide pipe, a bottom through pipe, a fan, a back support plate, a diagonal plate, a wind guide bent plate and an L-shaped support plate, the side flow guide mechanism is arranged at the drying furnace body between the square tubes to replace the structure of the original top air supply of the silicon wafer drying furnace, the side flow guide mechanism supplies air to the side surface of the drying furnace body at multiple points by double fans, under the wind force flow guide effect, the heat generated by a heating element at the original air guide pipe of the silicon wafer drying furnace between the square tubes is efficiently brought into the furnace chamber of the drying furnace body to flow, so that the drying wind force in the drying furnace carries the hot air flow to improve the efficiency, thereby leading the silicon wafer to be heated better and the temperature to be quickly increased, and the drying time of the drying furnace to the silicon wafer is shortened.
Description
Technical Field
The utility model relates to the technical field of silicon wafer drying, in particular to a silicon wafer drying furnace.
Background
In the processing process of the solar silicon wafer, the solar silicon wafer is dried by a drying furnace after being printed with the sizing agent, and a cabinet type drying furnace is generally adopted for drying the solar silicon wafer in the prior art, compared with a conveying furnace body, the solar silicon wafer is of a sealed structure, so that particles in air are not easy to enter in the drying process, and the drying quality is better.
Application number: CN202320791678.0 discloses a silicon chip drying furnace, this application is through the venthole on the air duct, in the setting of cooperation fan to can realize that inside gaseous continuous flow through heating element forms hot-blast, the place area of flow direction silicon chip, thereby improved the utilization to heating element heat, compare in current cabinet formula drying furnace, improve whole stoving's efficiency.
The mode that prior art's silicon chip dry-off oven adopted air duct cooperation fan in the silicon chip stoving in-process supplies air to the stove, when the silicon chip was put into the stove through placing the dish and is dried, this kind of air supply structure can receive more blockking to the mode of single fan air supply makes the efficiency of wind-force transmission in foraminiferous pipeline lower, thereby leads to the stoving wind-force in the dry-off oven to carry the efficiency that hot air flows to receive the influence, causes the silicon chip to heat up too slowly easily, just so causes the stoving time to be long, thereby leads to the dry-off oven inefficiency, and for this reason, we propose a silicon chip dry-off oven.
Disclosure of utility model
The utility model mainly aims to provide a silicon wafer drying furnace, wherein a side flow guide mechanism is arranged at a drying furnace body between square pipes to replace the original top end air supply structure of the silicon wafer drying furnace, the side flow guide mechanism uses double fans to carry out side surface multipoint air supply of the drying furnace body, under the action of wind power flow guide, heat generated by a heating element at an original air guide pipe of the silicon wafer drying furnace between square pipes is efficiently brought into a furnace chamber of the drying furnace body to flow, so that the efficiency of carrying hot air flow by drying wind power in the drying furnace is improved, the silicon wafer is heated better and is heated up quickly, the drying time of the silicon wafer in the drying furnace is shortened, and the problems in the background technology can be effectively solved.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a silicon chip drying furnace, includes drying furnace body and side pipe, the interior oven department of drying furnace body is fixed with side guide mechanism, side guide mechanism includes leading-in hole, wind income pipe, collar, main wind pipe, auxiliary wind pipe, end siphunculus, fan, back support plate, to swash plate, wind-guiding curved piece and L shape extension board, the outside symmetry of side furnace wall department of drying furnace body has seted up the leading-in hole that is used for the cartridge wind income pipe between the side pipe, and the outer pipe wall department welding of wind income pipe extension leading-in hole has the collar, the locking has the bolt between the drying furnace body of collar and the leading-in hole outside, wind income pipe extension leading-in hole outer end body is arranged the welding at main wind pipe and auxiliary wind pipe surface, the end mouth of pipe of main wind pipe and auxiliary wind pipe is through welding end intercommunication, and main wind pipe and auxiliary wind pipe's top mouth of pipe are through the bolt locking has the fan, insert the back support plate in the main wind pipe and auxiliary wind pipe bottom end welding has the L shape extension board to insert into the end bottom plate, the back support plate surface has the wind to face through the welding of the end support plate to face of pipe.
Further, a U-shaped tube cavity is arranged in the pipeline of the bottom through pipe, and an L-shaped support plate is clamped in a symmetrical pipe orifice of the U-shaped tube cavity; the U-shaped tube cavity of the bottom through tube can be communicated with the main air guide tube and the auxiliary air guide tube, and the symmetrical tube orifice of the U-shaped tube cavity can be inserted into the L-shaped support plates of the two groups of backboard plates.
Further, the wind guiding bending piece inclines from the opposite inclined plate to the wind inlet pipe direction, and a wind passing cavity channel is reserved among the opposite inclined plate, the wind guiding bending piece and the back plate; the inclined plate, the wind guiding bent plate and the back plate can be driven by part of wind power of the fan, and the other part of wind power generated by the fan is blown into the pipe under the action of the wind guiding bent plate.
Further, two groups of pipe bodies of air inlet pipes are vertically arranged and welded on the surfaces of the vertical pipe walls of the main air duct and the auxiliary air duct, and the air inlet pipes are communicated with the pipe cavities of the main air duct and the auxiliary air duct; the surfaces of the main air duct and the auxiliary air duct are welded with a plurality of groups of air inlet pipes, so that air can be supplied to the drying furnace body.
Further, the air outlets of the fans at the top ends of the main air duct and the auxiliary air duct are directed towards the inner cavities of the pipelines; after the fan is powered on, wind power can be blown into the main wind guide pipe and the auxiliary wind guide pipe.
Compared with the prior art, the utility model has the following beneficial effects:
According to the utility model, the side flow guide mechanism is arranged at the position of the drying furnace body between the square pipes to replace the original top end air supply structure of the silicon wafer drying furnace, the side flow guide mechanism supplies air to the side surface of the drying furnace body in multiple points through the double fans, under the wind power flow guide effect, heat generated by a heating element at the original air guide pipe of the silicon wafer drying furnace between the square pipes is efficiently brought into the furnace chamber of the drying furnace body to flow, so that the efficiency of hot air flow carried by the drying wind power in the drying furnace is improved, the silicon wafer is heated better and heated rapidly, and the drying time of the silicon wafer in the drying furnace is shortened.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a silicon wafer drying furnace according to the present utility model.
Fig. 2 is a schematic diagram showing the separation of a fan, a main air duct and an auxiliary air duct of the silicon wafer drying furnace.
FIG. 3 is an exploded view of a side guide mechanism of a silicon wafer drying oven according to the present utility model.
Fig. 4 is a schematic diagram of the bottom through pipe structure of the silicon wafer drying furnace.
In the figure: 1. a drying furnace body; 2. square tubes; 3. a side guide mechanism; 4. an introduction hole; 5. a wind inlet pipe; 6. a mounting ring; 7. a main wind duct; 8. an auxiliary wind guide pipe; 9. a bottom through pipe; 10. a U-shaped lumen; 11. a blower; 12. a backing plate; 13. a diagonal plate; 14. wind guiding bending piece; 15. l-shaped support plate.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in figures 1-4, a silicon wafer drying furnace comprises a drying furnace body 1 and a square tube 2, wherein the square tube 2 is fixed at the inner furnace wall of the drying furnace body 1, and the silicon wafer drying furnace further comprises a side guide mechanism 3, the side guide mechanism 3 comprises a guide hole 4, a wind inlet tube 5, a mounting ring 6, a main wind guide tube 7, an auxiliary wind guide tube 8, a bottom through tube 9, a fan 11, a backrest 12, a diagonal plate 13, a wind guide bent sheet 14 and an L-shaped support plate 15, the guide hole 4 for inserting the wind inlet tube 5 is symmetrically arranged at the outer furnace wall of the drying furnace body 1 between the square tubes 2, a mounting ring 6 is welded at the outer tube wall of the wind inlet tube 5 extending out of the guide hole 4, bolts are locked between the mounting ring 6 and the drying furnace body 1 outside the guide hole 4, the outer end tube body of the wind inlet tube 5 is welded on the surfaces of the main wind guide tube 7 and the auxiliary wind guide tube 8, the bottom orifices of the main wind guide tube 7 and the auxiliary wind guide tube 8 are communicated with each other through the welding bottom through the auxiliary wind guide tube 9, the top end 7 and the backrest 12 are welded to the bottom through the auxiliary wind guide tube 9, the bottom through the wind guide tube 12 and the backrest 12 are inserted into the bottom through the wind guide tube 9, and the side support plate 12 is welded into the side support plate 12, and the bottom through the side guide tube 12 is inserted into the air guide tube 12 through the side guide tube 12.
Wherein, a U-shaped tube cavity 10 is arranged in the pipeline of the bottom through pipe 9, and an L-shaped support plate 15 is clamped in the symmetrical pipe orifice of the U-shaped tube cavity 10; the U-shaped tube cavity 10 of the bottom through tube 9 can be communicated with the main air duct 7 and the auxiliary air duct 8, and the symmetrical tube orifices of the U-shaped tube cavity 10 can be inserted into the L-shaped support plates 15 of the two groups of backboard plates 12.
Wherein the wind guiding bending piece 14 inclines from the position of the opposite inclined plate 13 towards the direction of the wind inlet pipe 5, and a wind passing cavity channel is reserved among the opposite inclined plate 13, the wind guiding bending piece 14 and the back rest plate 12; the inclined plate 13, the wind guiding bent plate 14 and the back plate 12 can pass through the wind power of part of the fans 11, and the other part of the wind power generated by the fans 11 blows into the air inlet pipe 5 under the action of the wind guiding bent plate 14.
Wherein, two groups of pipe bodies of the air inlet pipe 5 are vertically arranged and welded on the surfaces of the vertical pipe walls of the main air duct 7 and the auxiliary air duct 8, and the air inlet pipe 5 is communicated with the pipe cavities of the main air duct 7 and the auxiliary air duct 8; the surfaces of the main air duct 7 and the auxiliary air duct 8 are welded with a plurality of groups of air inlet pipes 5, so that air can be supplied into the drying furnace body 1.
Wherein, the air outlets of the fans 11 at the top ends of the main air duct 7 and the auxiliary air duct 8 face the inner cavities of the pipelines; after the fan 11 is powered on, wind power can be blown into the main wind guide pipe 7 and the auxiliary wind guide pipe 8.
It should be noted that, that the utility model is a silicon wafer drying furnace, the side diversion mechanism 3 is arranged at the position of the drying furnace body 1 between the square tubes 2 to replace the structure of the original top end air supply of the silicon wafer drying furnace, after the air inlet pipe 5 of the side diversion mechanism 3 is inserted and installed at the position of the leading-in hole 4 of the drying furnace body 1, the surface of the mounting ring 6 outside the air inlet pipe 5 can be locked at the outer box wall of the drying furnace body 1 by means of bolts, then the main air conduit 7 and the auxiliary air conduit 8 can be inserted into the back plate 12, so that the L-shaped support plate 15 at the bottom end of the back plate 12 is supported in the U-shaped pipe cavity 10 of the bottom bobbin 9, then the top end pipe orifice of the main air conduit 7 and the auxiliary air conduit 8 is provided with the fan 11 for connection, the wind generated by the fan 11 blows into the main air conduit 7 and the auxiliary air conduit 8, the inclined plate 13, the wind guiding bending piece 14 and the back plate 12 can pass through part of the wind power of the fan 11, the part of the wind power continuously downwards enters into the lower air guiding bending piece 14, and the U-shaped pipe 10 of the lower end of the drying furnace body, the main air conduit 7 can be continuously downwards, the main air conduit 10 can be inserted into the U-shaped pipe 10 of the lower side of the main air conduit 9, and the main air guiding pipe 12 can be inserted into the other side air guiding piece 1, the main air guiding pipe 1 can be used for carrying the heat of the silicon wafer, the silicon wafer can be heated and the silicon wafer can be more quickly heated, the silicon wafer can be dried and can be dried, the silicon can be more quickly and air can flow and can be dried, and can be directly and more directly and can be dried, and can be directly and directly.
It should be noted that the utility model is a silicon wafer drying furnace, the components in the utility model are all known by those skilled in the art, and the structure and principle are all known by those skilled in the art through technical manual or through routine experimental methods.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a silicon chip drying furnace, includes drying furnace body (1) and side's pipe (2), the interior oven department of drying furnace body (1) is fixed with side's pipe (2), its characterized in that: the side flow guide mechanism (3) is further included, the side flow guide mechanism (3) comprises an introduction hole (4), a wind inlet pipe (5), a mounting ring (6), a main wind guide pipe (7), an auxiliary wind guide pipe (8), a bottom through pipe (9), a fan (11), a back plate (12), a pair of inclined plates (13), wind guide bent plates (14) and L-shaped support plates (15), the introduction hole (4) for inserting the wind inlet pipe (5) is formed in the side furnace wall of the drying furnace body (1) between the square pipes (2), the mounting ring (6) is welded at the outer pipe wall of the wind inlet pipe (5) extending out of the introduction hole (4), bolts are locked between the mounting ring (6) and the drying furnace body (1) at the outer side of the introduction hole (4), the outer end pipe bodies of the main wind guide pipe (4) and the auxiliary wind guide pipe (8) are arranged and intercommunicated and welded on the surfaces of the main wind guide pipe (7) and the auxiliary wind guide pipe (8), the bottoms of the main wind guide pipe (7) and the auxiliary wind guide pipe (8) are welded at the top ends of the main wind guide pipe (7) and the auxiliary wind guide pipe (8) through the bottom through the pipe (9), the bolts (7) and the auxiliary wind guide pipe (8) are welded at the top end (8), and the bottom end of the back plate (12) is welded with an L-shaped support plate (15) inserted into the bottom through pipe (9), and the surface of the plate body of the back plate (12) is welded with an air guide bent piece (14) towards the air inlet pipe (5) through a diagonal plate (13).
2. A silicon wafer drying oven according to claim 1, wherein: a U-shaped tube cavity (10) is arranged in the pipeline of the bottom through pipe (9), and an L-shaped support plate (15) is clamped in the symmetrical pipe orifice of the U-shaped tube cavity (10).
3. A silicon wafer drying oven according to claim 1, wherein: the air guide bent piece (14) is inclined from the opposite inclined plate (13) towards the direction of the air inlet pipe (5), and an air passing cavity channel is reserved among the opposite inclined plate (13), the air guide bent piece (14) and the back plate (12).
4. A silicon wafer drying oven according to claim 1, wherein: two groups of pipe bodies of the air inlet pipe (5) are vertically arranged and welded on the surfaces of the vertical pipe walls of the main air duct (7) and the auxiliary air duct (8), and the air inlet pipe (5) is communicated with the pipe cavities of the main air duct (7) and the auxiliary air duct (8).
5. A silicon wafer drying oven according to claim 1, wherein: the air outlets of the fans (11) at the top ends of the respective pipe bodies of the main air guide pipe (7) and the auxiliary air guide pipe (8) face the inner cavities of the respective pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322873786.5U CN221630163U (en) | 2023-10-26 | 2023-10-26 | Silicon wafer drying furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322873786.5U CN221630163U (en) | 2023-10-26 | 2023-10-26 | Silicon wafer drying furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221630163U true CN221630163U (en) | 2024-08-30 |
Family
ID=92482258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322873786.5U Active CN221630163U (en) | 2023-10-26 | 2023-10-26 | Silicon wafer drying furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221630163U (en) |
-
2023
- 2023-10-26 CN CN202322873786.5U patent/CN221630163U/en active Active
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